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MWI450-17E9

产品描述Insulated Gate Bipolar Transistor, 540A I(C), 1700V V(BR)CES, N-Channel, MODULE-29
产品类别分立半导体    晶体管   
文件大小286KB,共3页
制造商IXYS
标准  
下载文档 详细参数 全文预览

MWI450-17E9概述

Insulated Gate Bipolar Transistor, 540A I(C), 1700V V(BR)CES, N-Channel, MODULE-29

MWI450-17E9规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IXYS
零件包装代码MODULE
包装说明MODULE-29
针数29
Reach Compliance Codecompliant
外壳连接ISOLATED
最大集电极电流 (IC)540 A
集电极-发射极最大电压1700 V
配置3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
门极-发射极最大电压20 V
JESD-30 代码R-XUFM-X29
JESD-609代码e3
元件数量6
端子数量29
最高工作温度125 °C
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)2200 W
认证状态Not Qualified
表面贴装NO
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式UNSPECIFIED
端子位置UPPER
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用POWER CONTROL
晶体管元件材料SILICON
标称断开时间 (toff)590 ns
标称接通时间 (ton)280 ns
VCEsat-Max2.8 V

MWI450-17E9文档预览

Advanced Technical Information
MWI 450-17 E9
IGBT Modules
Sixpack
2
15
28
16
17
11/12
29
13
14
1
18
19
3
20
21
22
9/10
23
24
5
4
25
26
27
7/8
6
I
C60
= 440 A
V
CES
= 1700 V
V
CE(sat) typ.
= 2.5 V
IGBTs
Symbol
V
CES
V
GES
I
C25
I
C60
I
C80
RBSOA
t
SC
(SCSOA)
P
tot
Symbol
T
C
= 25°C
T
C
= 60°C
T
C
= 80°C
R
G
= 3.3
Ω;
T
VJ
= 125°C
Clamped inductive load; L = 100 µH
V
CE
= 1000 V; V
GE
=
±
15 V; R
G
= 3.3
Ω;
T
VJ
= 125°C; non-repetitive; V
CEmax
< V
CES
T
C
= 25°C
Conditions
Conditions
T
VJ
= 25°C to 125°C
Maximum Ratings
1700
±
20
540
440
375
I
CM
= 750
V
CEK
V
CES
10
2.2
V
V
A
A
A
A
µs
kW
Features
NPT
3
IGBT technology
low saturation voltage
low switching losses
square RBSOA, no latch up
high short circuit capability
positive temperature coefficient for
easy parallelling
MOS input, voltage controlled
ultra fast free wheeling diodes
solderable pins for PCB mounting
package with copper base plate
Advantages
space savings
reduced protection circuits
package designed for wave soldering
Typical Applications
AC motor control
AC servo and robot drives
power supplies
Characteristic Values
(T
VJ
= 25°C, unless otherwise specified)
min.
typ. max.
2.6
3.0
4.5
9
3.0
3.6
6.5
V
V
V
V
CE(sat)
V
GE(th)
I
CES
I
GES
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
C
ies
Q
Gon
R
thJC
I
C
= 450 A; V
GE
= 15 V; T
VJ
= 25°C
T
VJ
= 125°C
I
C
= 30 mA; V
GE
= V
CE
V
CE
= V
CES
; V
GE
= 0 V; T
VJ
= 25°C
T
VJ
= 125°C
V
CE
= 0 V; V
GE
=
±
20 V
1 mA
26 mA
1.5
µA
ns
ns
ns
ns
mJ
mJ
nF
µC
0.057 K/W
416
Inductive load, T
VJ
= 125°C
V
CE
= 900 V; I
C
= 450 A
V
GE
= ±15 V; R
G
= 3.3
V
CE
= 25 V; V
GE
= 0 V; f = 1 MHz
V
CE
= 900 V; V
GE
= 15 V; I
C
= 300 A
170
110
480
110
150
90
33
2.6
IXYS reserves the right to change limits, test conditions and dimensions.
© 2004 IXYS All rights reserved
1-3
Advanced Technical Information
MWI 450-17 E9
Diodes
Symbol
I
F80
I
FRM
Conditions
T
C
= 80°C
t
p
= 1 ms
Maximum Ratings
450
900
A
A
Symbol
V
F
I
RM
R
thJC
Conditions
I
F
= 450 A; V
GE
= 0 V; T
VJ
= 25°C
I
F
= 450 A; di
F
/dt = 3500 A/µs;
T
VJ
= 125°C; V
R
= 1200 V
Characteristic Values
min.
typ. max.
2.2
400
0.075
V
A
K/W
Temperature Sensor NTC
Symbol
R
25
B
25/50
Conditions
T = 25°C
Characteristic Values
min.
typ. max.
4.75
5.0
3375
5.25
kΩ
K
Module
Symbol
T
VJ
T
JM
T
stg
V
ISOL
M
d
Conditions
operating
Maximum Ratings
-40...+125
+150
-40...+125
3400
3-6
3-6
°C
°C
°C
V~
Nm
Nm
I
ISOL
1 mA; 50/60 Hz
Mounting torque (M5)
Terminal connection torque (M6)
Conditions
Resistance terminal to chip
Creepage distance on surface
Strike distance in air
with heatsink compound
12.7
10
Symbol
R
term-chip
*
)
d
S
d
A
R
thCH
Weight
Characteristic Values
min.
typ. max.
0.55
mΩ
mm
mm
0.01
900
K/W
g
*
)
V = V
CE(sat)
+ 2x R
term-chip
· I
C
resp. V = V
F
+ 2x R
term-chip
· I
F
© 2004 IXYS All rights reserved
2-3
416
Advanced Technical Information
MWI 450-17 E9
Dimensions in mm (1 mm = 0.0394")
=
tolerance for all dimensions:
© 2004 IXYS All rights reserved
3-3
416

 
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