MASK ROM, 8MX16, 120ns, MOS, PDSO44, 15.24MM, PLASTIC, SOP-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NEC(日电) |
包装说明 | 15.24MM, PLASTIC, SOP-44 |
Reach Compliance Code | compliant |
最长访问时间 | 120 ns |
备用内存宽度 | 8 |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 27.83 mm |
内存密度 | 134217728 bit |
内存集成电路类型 | MASK ROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 8388608 words |
字数代码 | 8000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | -10 °C |
组织 | 8MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 3 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | MOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 13.24 mm |
UPD23C128080BLGX-XXX | UPD23C128040BLGY-XXX-MKH | UPD23C128080BLGY-XXX-MKH-A | UPD23C128040BLGX-XXX | UPD23C128080BLGY-XXX-MKH | |
---|---|---|---|---|---|
描述 | MASK ROM, 8MX16, 120ns, MOS, PDSO44, 15.24MM, PLASTIC, SOP-44 | MASK ROM, 8MX16, 120ns, MOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 | MASK ROM, 8MX16, 120ns, MOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, REVERSE, TSOP1-48 | MASK ROM, 8MX16, 120ns, MOS, PDSO44, 15.24MM, PLASTIC, SOP-44 | MASK ROM, 8MX16, 120ns, MOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 |
是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 |
厂商名称 | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |
包装说明 | 15.24MM, PLASTIC, SOP-44 | 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 | 12 X 18 MM, LEAD FREE, PLASTIC, REVERSE, TSOP1-48 | 15.24MM, PLASTIC, SOP-44 | 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 |
JESD-609代码 | e0 | e0 | e3/e6 | e0 | e0 |
长度 | 27.83 mm | 16.4 mm | 16.4 mm | 27.83 mm | 16.4 mm |
内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 48 | 48 | 44 | 48 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSOP1-R | TSOP1-R | SOP | TSOP1-R |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3 mm | 1.2 mm | 1.2 mm | 3 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | MOS | MOS | MOS | MOS | MOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | MATTE TIN/TIN BISMUTH | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 13.24 mm | 12 mm | 12 mm | 13.24 mm | 12 mm |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-G48 | - | R-PDSO-G44 | R-PDSO-G48 |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
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