PRELIMINARY
KM736V587
Document Title
32Kx36-Bit Synchronous Burst SRAM, 3.3V Power
Datasheets for 100TQFP
32Kx36 Synchronous SRAM
Revision History
Rev . No.
Rev. 0.0
Rev. 1.0
History
Initial draft
Final spec release
Draft Date
Nov. 02. 1996
May. 27. 1997
Remark
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.
-1-
May 1997
Rev 1.0
PRELIMINARY
KM736V587
32Kx36-Bit Synchronous Burst SRAM
FEATURES
Synchronous Operation.
On-Chip Address Counter.
Write Self-Timed Cycle.
On-Chip Address and Control Registers.
Single 3.3V±5% Power Supply.
5V Tolerant Inputs except I/O Pins.
Byte Writable Function.
Global Write Enable Controls a full bus-width write.
Power Down State via ZZ Signal.
Asynchronous Output Enable Control.
ADSP, ADSC, ADV Burst Control Pins.
LBO Pin allows a choice of either a interleaved burst or a
linear burst.
• Three Chip Enables for simple depth expansion with No Data
Contention.
• TTL-Level Three-State Output.
• 100-TQFP-1420A
•
•
•
•
•
•
•
•
•
•
•
•
32Kx36 Synchronous SRAM
GENERAL DESCRIPTION
The KM736V587 is 1,179,648 bits Synchronous Static Random
Access Memory designed to support zero wait state perfor-
mance for advanced Pentium/Power PC based system. And
with CS
1
high, ADSP is blocked to control signals.
It can be organized as 32K words of 36bits. And it integrates
address and control registers, a 2-bit burst address counter and
high output drive circuitry onto a single integrated circuit for
reduced components counts implementation of high perfor-
mance cache RAM applications.
Write cycles are internally self-timed and synchronous.
The self-timed write feature eliminates complex off chip write
pulse shaping logic, simplifying the cache design and further
reducing the component count.
Burst cycle can be initiated with either the address status pro-
cessor(ADSP) or address status cache controller(ADSC)
inputs. Subsequent burst addresses are generated internally in
the system′s burst sequence and are controlled by the burst
address advance(ADV) input.
ZZ pin controls Power Down State and reduces Stand-by cur-
rent regardless of CLK.
The KM736V587 is implemented with SAMSUNG′s high perfor-
mance CMOS technology and is available in a 100pin TQFP
package. Multiple power and ground pins are utilized to mini-
mize ground bounce.
FAST ACCESS TIMES
Parameter
Cycle Time
Clock Access Time
Output Enable Access Time
Symbol
t
CYC
t
CD
t
OE
-8
12
8.5
4
-9
12
9
4
-10
15
10
5
Unit
ns
ns
ns
LOGIC BLOCK DIAGRAM
CLK
LBO
CONTROL
REGISTER
ADV
ADSC
BURST CONTROL
LOGIC
BURST
ADDRESS
COUNTER
A′
0
~A′
1
32Kx36
MEMORY
ARRAY
A
0
~A
1
ADDRESS
REGISTER
A
2
~A
14
ADSP
A
0
~A
14
CS
1
CS
2
CS
2
GW
BW
DATA-IN
REGISTER
CONTROL
REGISTER
WEa
WEb
WEc
WEd
OE
ZZ
DQa
0
~ DQd
7
DQPa, DQPb
CONTROL
LOGIC
OUTPUT
BUFFER
-2-
May 1997
Rev 1.0
PRELIMINARY
KM736V587
PIN CONFIGURATION
(TOP VIEW)
ADSC
ADSP
WEd
WEb
WEa
WEc
ADV
83
CLK
CS
1
CS
2
CS
2
V
DD
GW
V
SS
BW
OE
A
6
A
7
A
8
82
A
9
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
32Kx36 Synchronous SRAM
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
A
5
A
4
A
3
A
2
A
1
A
0
A
10
A
11
A
12
A
13
N.C.
N.C.
V
SS
N.C.
N.C.
A
14
N.C.
PIN NAME
SYMBOL
A
0
- A
14
PIN NAME
Address Inputs
TQFP PIN NO.
32,33,34,35,36,37,
44,45,46,47,48,81,
82,99,100
83
84
85
89
98
97
92
93,94,95,96
86
88
87
64
31
SYMBOL
V
DD
V
SS
N.C.
DQa
0
~a
7
DQb
0
~b
7
DQc
0
~c
7
DQd
0
~d
7
DQPa~Pd
V
DDQ
V
SSQ
PIN NAME
Power Supply(+3.3V)
Ground
No Connect
Data Inputs/Outputs
TQFP PIN NO.
15,41,65,91
17,40,67,90
14,16,38,39,42,43,49,50
,66
52,53,56,57,58,59,62,63
68,69,72,73,74,75,78,79
2,3,6,7,8,9,12,13
18,19,22,23,24,25,28,29
51,80,1,30
4,11,20,27,54,61,70,77
5,10,21,26,55,60,71,76
ADV
ADSP
ADSC
CLK
CS
1
CS
2
CS
2
WEx
OE
GW
BW
ZZ
LBO
Burst Address Advance
Address Status Processor
Address Status Controller
Clock
Chip Select
Chip Select
Chip Select
Byte Write Inputs
Output Enable
Global Write Enable
Byte Write Enable
Power Down Input
Burst Mode Control
Output Power Supply
(+3.3V)
Output Ground
N.C.
LBO
V
DD
50
DQPc
DQc
0
DQc
1
V
DDQ
V
SSQ
DQc
2
DQc
3
DQc
4
DQc
5
V
SSQ
V
DDQ
DQc
6
DQc
7
N.C.
V
DD
N.C.
V
SS
DQd
0
DQd
1
V
DDQ
V
SSQ
DQd
2
DQd
3
DQd
4
DQd
5
V
SSQ
V
DDQ
DQd
6
DQd
7
DQPd
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
100 Pin
TQFP
(20mm x 14mm)
DQPb
DQb
7
DQb
6
V
DDQ
V
SSQ
DQb
5
DQb
4
DQb
3
DQb
2
V
SSQ
V
DDQ
DQb
1
DQb
0
V
SS
N.C.
V
DD
ZZ
DQa
7
DQa
6
V
DDQ
V
SSQ
DQa
5
DQa
4
DQa
3
DQa
2
V
SSQ
V
DDQ
DQa
1
DQa
0
DQPa
-3-
May 1997
Rev 1.0
PRELIMINARY
KM736V587
FUNCTION DESCRIPTION
The KM736V587 is a synchronous SRAM designed to support the burst address accessing sequence of the Pentium and Power PC
based microprocessor. All inputs (with the exception of OE, LBO and ZZ) are sampled on rising clock edges. The start and duration
of the burst access is controlled by ADSC, ADSP and ADV and chip select pins.
When ZZ is pulled high, the SRAM will enter a Power Down State. At this time, internal state of the SRAM is preserved. When ZZ
returns to low, the SRAM normally operates after 2cycles of wake up time. ZZ pin is pulled down internally.
Read cycles are initiated with ADSP(or ADSC) using the new external address clocked into the on-chip address register when both
GW and BW are high or when BW is low and WEa, WEb, WEc, and WEd are high. When ADSP is sampled low, the chip selects
are sampled active, and the output buffer is enabled with OE. the data of cell array accessed by the current address are projected to
the output pins.
Write cycles are also initiated with ADSP(or ADSC) and are differentiated into two kinds of operations; All byte write operation and
individual byte write operation.
All byte write occurs by enabling GW(independent of BW and WEx.), and individual byte write is performed only when GW is high
and BW is low. In KM736V587, a 32Kx36 organization, WEa controls DQa
0
~ DQa
7
and DQPa, WEb controls DQb
0
~ DQb
7
and
DQPb, WEc controls DQc
0
~ DQc
7
and DQPc and WEd controls DQd
0
~ DQd
7
and DQPd.
CS
1
is used to enable the device and conditions internal use of ADSP and is sampled only when a new external address is loaded.
ADV is ignored at the clock edge when ADSP is asserted, but can be sampled on the subsequent clock edges. The address
increases internally for the next access of the burst when ADV is sampled low.
Addresses are generated for the burst access as shown below, The starting point of the burst sequence is provided by the external
address. The burst address counter wraps around to its initial state upon completion. The burst sequence is determined by the state
of the LBO pin. When this pin is Low, linear burst sequence is selected. And this pin is High, Interleaved burst sequence is selected.
32Kx36 Synchronous SRAM
BURST SEQUENCE TABLE
LBO PIN
HIGH
First Address
Case 1
A
1
0
0
1
1
A
0
0
1
0
1
A
1
0
0
1
1
Case 2
A
0
1
0
1
0
A
1
1
1
0
0
Case 3
A
0
0
1
0
1
(Interleaved Burst)
Case 4
A
1
1
1
0
0
A
0
1
0
1
0
Fourth Address
BURST SEQUENCE TABLE
LBO PIN
LOW
First Address
Case 1
A
1
0
0
1
1
A
0
0
1
0
1
A
1
0
1
1
0
Case 2
A
0
1
0
1
0
A
1
1
1
0
0
Case 3
A
0
0
1
0
1
A
1
1
0
0
1
(Linear Burst)
Case 4
A
0
1
0
1
0
Fourth Address
NOTE
: 1. LBO pin must be tied to High or Low, and Floating State must not be allowed.
ASYNCHRONOUS TRUTH TABLE
(See Notes 1 and 2)
:
Operation
Sleep Mode
Read
Write
Deselected
ZZ
H
L
L
L
L
OE
X
L
H
X
X
I/O Status
High-Z
DQ
High-Z
Din, High-Z
High-Z
NOTE
1. X means "Don′t Care".
2. ZZ pin is pulled down internally
3. For write cycles that following read cycles, the output buffers must
be disabled with OE, otherwise data bus contention will occur.
4. Sleep Mode means power down state of which stand-by current
does not depend on cycle time.
5. Deselected means power down state of which stand-by current
depends on cycle time.
-4-
May 1997
Rev 1.0
PRELIMINARY
KM736V587
SYNCHRONOUS TRUTH TABLE
CS
1
H
L
L
L
L
L
L
L
X
H
X
H
X
H
X
H
CS
2
X
L
X
L
X
H
H
H
X
X
X
X
X
X
X
X
CS
2
X
X
H
X
H
L
L
L
X
X
X
X
X
X
X
X
ADSP
X
L
L
X
X
L
H
H
H
X
H
X
H
X
H
X
ADSC
L
X
X
L
L
X
L
L
H
H
H
H
H
H
H
H
ADV
X
X
X
X
X
X
X
X
L
L
L
L
H
H
H
H
WRITE
X
X
X
X
X
X
L
H
H
H
L
L
H
H
L
L
CLK
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
Address Accessed
N/A
N/A
N/A
N/A
N/A
External Address
External Address
External Address
Next Address
Next Address
Next Address
Next Address
Current Address
Current Address
Current Address
Current Address
Operation
Not Selected
Not Selected
Not Selected
Not Selected
Not Selected
Begin Burst Read Cycle
Begin Burst Write Cycle
Begin Burst Read Cycle
Continue Burst Read Cycle
Continue Burst Read Cycle
Continue Burst Write Cycle
Continue Burst Write Cycle
Suspend Burst Read Cycle
Suspend Burst Read Cycle
Suspend Burst Write Cycle
Suspend Burst Write Cycle
32Kx36 Synchronous SRAM
NOTE
: 1. X means "Don′t Care".
2. The rising edge of clock is symbolized by
↑.
3. WRITE = L means Write operation in WRITE TRUTH TABLE.
WRITE = H means Read operation in WRITE TRUTH TABLE.
4. Operation finally depends on status of asynchronous input pins(ZZ and OE).
WRITE TRUTH TABLE
GW
H
H
H
H
H
H
L
BW
H
L
L
L
L
L
X
WEa
X
H
L
H
H
L
X
WEb
X
H
H
L
H
L
X
WEc
X
H
H
H
L
L
X
WEd
X
H
H
H
L
L
X
Operation
READ
READ
WRITE BYTE a
WRITE BYTE b
WRITE BYTE c and d
WRITE ALL BYTEs
WRITE ALL BYTEs
NOTE
: 1. X means "Don′t Care".
2. All inputs in this table must meet setup and hold time around the rising edge of CLK(↑).
ABSOLUTE MAXIMUM RATINGS*
Parameter
Voltage on V
DD
Supply Relative to V
SS
Voltage on V
DDQ
Supply Relative to V
SS
Voltage on Input Pin Relative to V
SS
Voltage on I/O Pin Relative to V
SS
Power Dissipation
Storage Temperature
Operating Temperature
Storage Temperature Range Under Bias
Symbol
V
DD
V
DDQ
V
IN
V
IO
P
D
T
STG
T
OPR
T
BIAS
Rating
-0.3 to 4.6
V
DD
-0.3 to 6.0
-0.3 to V
DDQ
+ 0.5
1.2
-65 to 150
0 to 70
-10 to 85
Unit
V
V
V
V
W
°C
°C
°C
*NOTE
: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
-5-
May 1997
Rev 1.0
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