F-210
SEAM–20–02.0–S–10–2–A–K–TR
(1,27mm) .050"
SEAM SERIES
SEAM–30–03.5–S–08–2–A–K–TR
SEAM–30–02.0–S–08–2–A–K–TR
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Contact Resistance:
5.5 mΩ
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Mates with:
SEAF, SADL
(1,50mm)
.059"
NOMINAL
WIPE
Up to
500 Pins
5, 8 and 10 row
footprint compatible
with SamArray
®
.
Samples recommended.
Lead-Free Solder
ChargeTerminations
(Tin/Lead also available)
TM
EXTENDED LIFE PRODUCT
10 Year Mixed Flowing Gas (MFG)
Call Samtec for maximum cycles mated with SEAF
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Yes
®
Low Insertion/
Extraction Forces
7mm Stack Height
Rated @ -3dB Insertion Loss
Single-Ended Signaling
9.5 GHz / 19 Gbps
Differential Pair Signaling
10.5 GHz / 21 Gbps
Performance data for other stack heights and
complete test data available at www.samtec.com?SEAM
or contact sig@samtec.com
CURRENT RATING
AMBIENT
SEAM/SEAF
TEMP
2.3A
20°C
2A
40°C
1.75A
60°C
1.14A
95°C
30 ADJACENT
POSITIONS POWERED
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SEAM
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
K
–A
TR
–L
= 10µ"
(0,25µm)
Gold on
contact area,
Matte Tin on
solder tail
–2
– 04
=Four Rows
(–06.5 not
available)
= Lead-Free
Tin Alloy
95.5%
Sn/3.8%
Ag/0.7% Cu
Solder
Charge
Downloa
om/appnote
www.samtec.c mtec.com
@ sa
Contact SIG n protocols
o
for questions
MATED HEIGHTS*
B
SEAM
SEAF LEAD STYLE
LEAD
–06.5
STYLE –05.0 –06.0
7mm
8mm
8.5mm
–02.0
8mm
9mm
9.5mm
–03.0
8.5mm 9.5mm
10mm
–03.5
11.5mm 12.5mm
13mm
–06.5
–07.0
12mm 13mm 13.5mm
–09.0
14mm 15mm 15.5mm
(1,02)
–11.0
16mm 17mm 17.5mm
.040
*Processing conditions will affect
mated height.
nel
Fibre Chan
Rapid I/O
®
s
PCI Expres
SATA
Infiniband
at
d app notes
–10, –15, – 20,
– 30, –40, –50
(–10 only available in 04 row)
(–15 only available in 10 row)
NO. OF
ROWS
–04
–05, –06
–08
–10
= Alignment Pins
(Required. Arrays
will not self-center
on solder pads)
B
(7,06) .278
(9,60) .378
(12,14) .478
(14,68) .578
01
–S
= 30µ"
(0,76µm)
Gold on
contact area,
Matte Tin on
solder tail
– 05
=Five Rows
(–06.5 not
available)
–K
= Polyimide film
Pick & Place Pad
– TR
=Tape & Reel
– 06
=Six Rows
(–06.5 not
available)
(1,27)
.050
– 08
=Eight Rows
DIFFERENTIAL
APPLICATION
PAIR
ARRAY COUNT
125
50x10
100
50x8
100
40x10
80
40x8
60
40x6
75
30x10
60
30x8
45
30x6
50
20x10
40
20x8
25
20x10
– 10
=Ten Rows
08
(1,27) .050
(1,27)
.050
No. of positions x (1,27) .050 + (4,98) .196
(1,02)
.040
(1,27)
.050
A
LEAD
STYLE
–02.0
–03.0
–03.5
–06.5
–07.0
–09.0
–11.0
A
(4,60) .181
(5,59) .220
(6,10) .240
(6,40) .252
(9,60) .378
(11,60) .457
(13,60) .535
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(0,86)
(1,12)
(1,27)
.034
.044
.050
DIA
DIA
No. of positions x (1,27) .050 + (3,58) .141
(0,10)
.004
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