Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SAMSUNG(三星) |
包装说明 | TSOP, TSOP50,.46,32 |
Reach Compliance Code | unknown |
最长访问时间 | 60 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G50 |
JESD-609代码 | e0 |
内存密度 | 67108864 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 16 |
端子数量 | 50 |
字数 | 4194304 words |
字数代码 | 4000000 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP |
封装等效代码 | TSOP50,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
自我刷新 | NO |
最大待机电流 | 0.0005 A |
最大压摆率 | 0.11 mA |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
K4F641612B-TC60R0 | K4F641612B-TC45R0 | K4F641612B-TC50M0 | K4F641612B-TC50R0 | K4F641612C-TL50R0 | KM416C4000B-45 | KM416V4000BS-L5K | K4F641612B-TC6053 | K4F641612B-TL45R0 | K4F641612B-TL60R0 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 45ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 45ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 45ns, CMOS, PDSO50 | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 | TSOP, TSOP50,.46,32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 60 ns | 45 ns | 50 ns | 50 ns | 50 ns | 45 ns | 50 ns | 60 ns | 45 ns | 60 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G50 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP |
封装等效代码 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 8192 | 8192 | 4096 | 4096 | 4096 |
自我刷新 | NO | NO | NO | NO | YES | NO | YES | NO | YES | YES |
最大待机电流 | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0002 A | 0.001 A | 0.0003 A | 0.0005 A | 0.0003 A | 0.0003 A |
最大压摆率 | 0.11 mA | 0.13 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.1 mA | 0.09 mA | 0.11 mA | 0.13 mA | 0.11 mA |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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