This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it
other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
2. Customer’s special requirements are also welcome.
3. * For each die.
4. *
2
When all LED dies are operated simultaneously.
5. *
3
For one circuit.
Important Notice:
This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it
other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it
other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
703-1042_5.0 X 5.0 SMD Type_White | 11 January 2012 4:54 PM
5.0 x 5.0mm SMD Type
Recommended Storage Environment:
• Temperature: 5°C ~ 30°C (41°F ~ 86°F)
• Humidity: 60% RH Max.
• Use within 7 days after opening of sealed vapour/ESD barrier bags.
If moisture absorbent material (silica gel) has faded away or LEDs have exceeded the storage time, baking treatment should
be performed using the following conditions:
• Baking Treatment: 60 ± 5°C for 24 hours
• Fold the opened bag firmly and keep in dry environment.
Soldering
Reflow Soldering
Lead Solder
Pre-heat
Pre-heat Time
Peak Temperature
Soldering Time
Condition
12 ~ 150°C
120sec. Max.
240°C Max.
10sec Max.
Refer to Temperature
profile 1
Lead-free Solder
180 ~ 200°C
120sec. Max
260°C Max.
10sec. Max
Refer to Temperature
profile 2
Soldering Time
3sec. Max
(one time only)
Temperature
350°C Max.
Hand Soldering
*After reflow soldering rapid cooling should be avoided.
Temperature-profile (surface of circuit board)
Use the conditions shown under figure.
Recommended Soldering Pad Design
Use the conditions shown under figure.
Important Notice:
This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it
other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
2008年8月26-29日，华南地区的五大品牌工业展会——NEPCON / EMT 华南展（第十四届华南国际电子生产设备暨微电子工业展/华南国际电子制造技术展览会）、华南国际汽车电子展（AE South China）、华南国际工业组装技术与装备展览会（ATE South China）和华南国际平面显示器制造技术展（Finetech South China）将在深圳会展中心隆重举行。从组委会获...[详细]
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