CD
FM
2
SOT502B
CDFM2; blister pack; standard product orientation 12NC
ending 112
Rev. 1 — 30 November 2012
Packing information
1. Packing method
Blister cover
ESD Label
Foam
Blister bottom
ESD Label
Printed plano box
Space for additional label
Preprinted ESD warning
Barcode label
Tape
QA Seal
msc071
Fig 1.
Blister pack
NXP Semiconductors
SOT502B
CDFM2; blister pack; standard product orientation 12NC ending 112
Packing information
12NC
ending
112
SPQ per
carrier
20
PQ
(pcs)
60
Carriers
per box
3
Outer box dimensions
l x w x h (mm)
315 x 118 x 78
Table 1.
Package
version
SOT502B
Limited warranty and liability
Information in this document is believed to be accurate and reliable. However, NXP
Semiconductors does not give any representations or warranties, expressed or implied, as
to the accuracy or completeness of such information and shall have no liability for the
consequences of use of such information.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 November 2012
Document identifier: SOT502B_112