Film Chip Capacitors
Catalogue
CONTENTS
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product code system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test method and performance . . . . . . . . . . . . . . . . . . . . . . . . . .
Capacitance and voltage range - size table . . . . . . . . . . . . . . . .
Max. voltage (Vr.m.s.) and current (Ir.m.s.) vs. frequency . . .
Mounting and soldering
...............................
Page
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6-8
9-10
11
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Caution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Although the text of this publication is accurate to the best of our knowledge when printed, we reserve the right
to make changes without prior notice.
Other catalogues and brochures:
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S
S
S
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Film Capacitors Catalogue
Film Capacitors for Lighting
Film Capacitors for Automotive
Capacitors for Power Electronics
Capacitors for A.C. Motor applications
S
S
S
S
Capacitors and Equipment for Power
Factor Correction applications
EMI-RFI Filters
Aluminum Electrolytic Capacitors
Nissei Film Capacitors
Film Chip capacitor
LDE series
GENERAL INFORMATION
Description
Film Chip capacitor using:
S
Non-encapsulated construction.
S
Stacked technology.
S
Metallized PolyEthylene Naphtalate (PEN)
and/or Metallized PolyEthylene Terephtalate high
temperature (PET H.T.).
PEN and PET belong to the same family: Polyester film.
Advantage
S
Stability versus temperature, frequency, voltage, time
and humidity.
S
Reliability, self-healing and typical failure mode at the
end of the life: open.
S
No cracking.
S
No piezoelectric effect..
S
Low noise level.
S
Low ESR.
S
Non-polar construction.
S
Environmentally friendly.
Application per Market sector
S
Telecom (Mobile phone, Mini link, XDSL, Multiplexer,
S
S
S
S
S
Base station, Public and private switching system).
Hi-Fi.
Automotive (Engine control system, Safety system,
Car radio, Navigation system, Air-conditioning).
Industrial.
DC/ DC converter, SMPS.
Consumer
Film Chip capacitor is complementary to MLC and Tantalum
capacitors for professional and critical application.
2
LDE Series
PEN -- PET H.T.
PRODUCT CODE SYSTEM
The part number, comprising 14 digits, is formed as follows:
1
2
3
4
-
-
5
-
-
6
-
-
7
-
-
8
-
-
9
-
-
10
-
-
11 12
-
-
-
-
13
-
-
14
-
-
L
D
E
Code example:
1 2
L D
3 4
E C
5 6
D 3
7
4
8 9 10 11 12 13 14
7 0 J A 5 N --
Digit 1 to 3 Series code (L = leadless; DE = polyester family)
Digit 4
d.c. or a.c. rated voltage (V
R
).
C = 50Vdc D = 63Vdc E =100Vdc
I = 250Vdc M = 400Vdc P =630Vdc
Digit 5
Size code:
12.06 12.10 18.12 22.20 28.24 40.30 50.40 60.54
A
B
C
D
E
F
G
H
Series
Rated voltage (C = 50Vdc)
Size code (D = 22.20)
Capacitance = 0.47mF
Tolerance (J =
5%)
Dielectric (A = PEN)
Version (5 = standard)
Packing (N= Tape)
Internal use
Digits 6 to 9 Digits 7 - 8 - 9 indicate the first three digits of
Capacitance value and the 6th digit indicates
the number of zeros that must be added to obtain the
Rated Capacitance in pF.
Digit 10
Capacitance tolerance:
5%
(J);
10%
(K);
20%
(M)
Digit 11
Dielectric (A = PEN; B = PET H.T.)
Digit 12
Version (0 = miniature; 5 = standard; A to Z = special)
Digit 13
Packing (Loose = M; Tape = N; A to Z = special)
Digit 14
Internal use.
PACKAGING
S
Taping and packaging characteristics
4.0 ± 0.1
2.0 ± 0.05
H
L
W
P ± 0.1
W2
BO
KO
W1
+0.1
1.5 0
1.75 ± 0.15
T
W
Film Chip
Chip dimensions
Size
code
12.06
12.10
18.12
22.20
Tape
AO
Reel
Packaging
q.ties
Reel dimensions
W1
W2
∅
(mm)
(mm)
(mm)
180
8
12
180
8
12
12
330
16
12
330
12
330
12
16
330
12
330
16
330
16
20
330
16
330
16
330
16
20
330
16
330
24
330
24
28
330
24
330
24
330
24
28
330
24
Reel
(pcs)
3000
2250
4000
3000
3000
2250
1750
2250
1750
1500
1500
1250
1000
1500
1250
1000
1000
750
750
Loose
(pcs)
2000
2000
1500
1500
Tape and Reel characteristics
A0
(mm)
2.00
2.90
3.50
4.00
5.40
5.40
5.40
6.60
6.60
6.60
8.40
8.40
8.60
10.90
10.90
11.00
14.40
14.40
14.40
B0
(mm)
3.60
3.60
5.10
5.30
6.20
6.20
6.20
7.90
7.90
7.90
11.00
11.00
11.00
13.50
13.50
13.50
16.00
16.00
16.00
Tape dimensions
K0
W
(mm)
(mm)
1.30
8
2.10
8
2.00
12
2.60
12
2.90
12
3.80
12
4.90
12
3.80
16
4.60
16
5.50
16
3.80
16
4.60
16
5.80
16
3.80
24
4.70
24
5.90
24
4.30
24
5.10
24
5.80
24
P
(mm)
4
4
8
8
8
8
8
8
8
8
12
12
12
12
12
12
16
16
16
T
(mm)
300
300
300
300
300
400
300
400
400
300
400
400
300
400
500
400
400
500
L
3.2
3.2
4.5
5.7
W
(mm)
1.6
2.5
3.2
5.1
H max
(mm)
1.1
1.5--2.0
1.7
2.3--2.6
2.3--2.7
3.3
4.2--4.4
3.5
4.5
5.4
3.6
4.5
5.4--5.6
3.6
4--4.5
5.5--5.7
3.6
4.5--4.9
5.5--5.7
28.24
7.1
6.1
1000
40.30
10.2
7.6
1000
50.40
12.7
10.2
500
60.54
15.2
13.7
500
All dimensions are in mm.
In accordance with IEC 60286-3.
Material used:
- Carrier tape:
antistatic material
- Cover tape:
polyester + PE
- Reel:
recyclable polystyrene
All parts in bulk or on reel are packed in hermetically sealed moisture barrier bag (MBB).
3
LDE Series
POLYESTER FAMILY - TYPICAL GRAPHS
PEN -- PET H.T.
Capacitance change vs. temperature at 1kHz
Capacitance change vs. frequency (Room temperature)
Dissipation factor vs. temperature at 1kHz
Dissipation factor vs. frequency (Room temperature)
Time constant vs. temperature
Impedance vs. frequency
PEN
PET H.T.
4
LDE Series
PEN -- PET H.T.
GENERAL TECHNICAL DATA
Dielectric
Plates
Winding
Termination
Marking
Climatic category
PEN
PET
Test method
Aluminium layer deposited by evaporation under vacuum.
Non inductive type - Stacked technology.
Three layers: Aluminium, Brass and Tin alloy.
On packing only.
55/125/56
IEC 60068-1
ELECTRICAL CHARACTERISTICS
Item
Working temperature
Rated voltage (V
R
)
Category voltage (V
C
)
Size range
Capacitance range
Capacitance values
Capacitance tolerance
Dissipation factor (tgδ)
Dielectric absorption (%)
1
01GΩ
for C0.33mF
400
s for C>0.33mF
1.4
×
V
R
100V/ms
Coverage
75%
at each end-termination
PEN
PET
Test method
-55 to 125° C
50Vdc - 63Vdc - 100Vdc - 250Vdc - 400Vdc - 630Vdc
V
C
= V
R
up to 105° C
Decreasing factor of 1.25% per degree
°
C
1 25%
for temperature from 105 to 125° C
12.06 to 60.54
28.24 to 60.54
1000pF to 4.7mF
0.082mF to 4.7mF
E6 - E12
5%
(J);
10%
(K);
20%
(M)
0.8% max.
0.5
IEC 60063
Frequency: 1kHz
Temperature:
255° C
Frequency:
1kHz
Temperature:
255° C
Voltage charge time: 1 min
Voltage charge:
010Vdc
for V
R
<100Vdc
100Vdc for V
R
≥100Vdc
Temperature:
255° C
Application time:
2s
Dipping in solder bath at 2355° C for 3s
Insulation resistance
Surge voltage test
Max pulse rise time (dv/dt)
Solderability
TEST METHOD AND PERFORMANCE
Test
Damp heat
PEN
PET
Test conditions
Temperature:
Relative humidity:
Duration:
402° C
93%
2%
56 days
Endurance
|∆C/C|
7%
Dissipation factor change:
50⋅10
-4
Insulation resistance:
50%
of limit value
|∆C/C|
5%
Dissipation factor change:
50⋅10
-4
Insulation resistance:
50%
of limit value
Capacitance change:
|∆C/C|
3%
size
22.20
|∆C/C|
2%
size
>
22.20
|∆C/C|
3%
Insulation resistance:
limit
value
No mechanical damage
∆tgδ:
50⋅10
-4
Temperature: 1255° C
Duration:
2000 h
Voltage:
1.25× V
C
Ambient conditions:
- temperature:
255° C
- relative humidity:
75%
1 hour at -55° C
1 hour at +125° C
Changing time: 30 s
Cycle:
1000
Bend the test board as shown in the test
set-up:
FR4 test board
1.6 mm
Long term stability
(after one year)
Rapid change of temperature
Bending
Deflection: 1 to 6 mm.
No visible damage on the terminations (pealing)
No damage on the body (cracking)
|∆C/C|
1%
Reliability
Ref. MIL HDB 217
Failure rate:
1
Fit
(1 Fit = 1×10
-9
failiures/components×hour)
Temperature:
40_C2_C
Voltage:
0.5×V
R
Failure criteria:
(according to DIN 44122)
Short or open circuit
Capacitance change
(|∆C/C|):
>10%
DF change
(∆tgδ):
>2×initial limit.
Insulation resistance: <0.005×initial limit.
5
FPGA/CPLD
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