Multiplexers/Switches, 3 Func, 2 Channel, CMOS, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | compli |
| JESD-30 代码 | R-XDIP-T16 |
| 湿度敏感等级 | 2A |
| 信道数量 | 2 |
| 功能数量 | 3 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 5962-01-144-7464 | 5962-01-259-1563 | 4051BDCQR | 4051BDC | 4052BDMQB | 4052BDM | 4051BDM | 4051BDCQM | 5962-01-101-9291 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexers/Switches, 3 Func, 2 Channel, CMOS, CDIP16, | Multiplexers/Switches, 3 Func, 2 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 8 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 8 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 4 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 4 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 8 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 8 Channel, CMOS, CDIP16, | Multiplexers/Switches, 1 Func, 8 Channel, CMOS, CDIP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compli | compli | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| 湿度敏感等级 | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| 信道数量 | 2 | 2 | 8 | 8 | 4 | 4 | 8 | 8 | 8 |
| 功能数量 | 3 | 3 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | - | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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