Cache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | LCC |
| 包装说明 | PLASTIC, LCC-52 |
| 针数 | 52 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 10 ns |
| 其他特性 | BURST COUNTER |
| JESD-30 代码 | S-PQCC-J52 |
| JESD-609代码 | e0 |
| 长度 | 19.1262 mm |
| 内存密度 | 589824 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 18 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 52 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX18 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 225 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 19.1262 mm |
| IDT71420S10J8 | IDT71420S9J | IDT71420S9J8 | IDT71420S12J | IDT71420S12J8 | IDT71420S10J | |
|---|---|---|---|---|---|---|
| 描述 | Cache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 32KX18, 9ns, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 32KX18, 9ns, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 32KX18, 12ns, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 32KX18, 12ns, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | LCC | LCC | LCC | LCC | LCC |
| 包装说明 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | PLASTIC, LCC-52 | QCCJ, | PLASTIC, LCC-52 |
| 针数 | 52 | 52 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | compliant | not_compliant | compliant | not_compliant | compliant | not_compliant |
| ECCN代码 | 3A991.B.2.B | EAR99 | 3A991.B.2.B | EAR99 | 3A991.B.2.B | EAR99 |
| 最长访问时间 | 10 ns | 9 ns | 9 ns | 12 ns | 12 ns | 10 ns |
| 其他特性 | BURST COUNTER | BURST COUNTER; SELF TIMED WRITE; ADDRESS REGISTER | BURST COUNTER | BURST COUNTER; SELF TIMED WRITE; ADDRESS REGISTER | BURST COUNTER | BURST COUNTER; SELF TIMED WRITE; ADDRESS REGISTER |
| JESD-30 代码 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
| 内存密度 | 589824 bit | 589824 bit | 589824 bit | 589824 bit | 589824 bit | 589824 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 52 | 52 | 52 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX18 | 32KX18 | 32KX18 | 32KX18 | 32KX18 | 32KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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