EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144
参数名称 | 属性值 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | MODULE |
包装说明 | DIMM, DIMM144,32 |
针数 | 144 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 60 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N144 |
内存密度 | 67108864 bit |
内存集成电路类型 | EDO DRAM MODULE |
内存宽度 | 64 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 144 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX64 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM144,32 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 25.4 mm |
自我刷新 | YES |
最大待机电流 | 0.0006 A |
最大压摆率 | 0.68 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 0.8 mm |
端子位置 | DUAL |
HB56HW165DB-6L | HB56HW164DB-7L | HB56HW165DB-7L | HB56HW164DB-7 | HB56HW164DB-6L | HB56HW164DB-6 | HB56HW165DB-7 | |
---|---|---|---|---|---|---|---|
描述 | EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 70ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 70ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 70ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 70ns, CMOS, SODIMM-144 |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
包装说明 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | SODIMM-144 |
针数 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 60 ns | 70 ns | 70 ns | 70 ns | 60 ns | 60 ns | 70 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bi |
内存集成电路类型 | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX64 | 1MX64 | 1MX64 | 1MX64 | 1MX64 | 1MX64 | 1MX64 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 4096 | 1024 | 4096 | 4096 | 4096 | 1024 |
自我刷新 | YES | YES | YES | NO | YES | NO | NO |
最大待机电流 | 0.0006 A | 0.0006 A | 0.0006 A | 0.004 A | 0.0006 A | 0.004 A | 0.004 A |
最大压摆率 | 0.68 mA | 0.36 mA | 0.6 mA | 0.36 mA | 0.4 mA | 0.4 mA | 0.6 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved