SPECIALTY ANALOG CIRCUIT, DMA9
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最大工作温度 | 100 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 50 V |
| 最小供电/工作电压 | 5 V |
| 状态 | ACTIVE |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | MICROELECTRONIC ASSEMBLY |
| 端子形式 | PIN/PEG |
| 端子涂层 | TIN LEAD |
| 端子位置 | DUAL |
| 包装材料 | UNSPECIFIED |
| 温度等级 | INDUSTRIAL |
| 模拟IC其它类型 | ANALOG CIRCUIT |
| VI-RAM | VI-RAM-M1 | VI-RAM-I1 | VI-RAM-E1 | VI-RAM-C2 | VI-RAM-M2 | VI-RAM-I2 | VI-RAM-E2 | VI-RAM-C1 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 | SPECIALTY ANALOG CIRCUIT, DMA9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 温度等级 | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER | OTHER | OTHER | INDUSTRIAL | OTHER | OTHER |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | VICOR | VICOR | VICOR | VICOR | VICOR | VICOR | VICOR | VICOR |
| Reach Compliance Code | - | _compli | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
| 模拟集成电路 - 其他类型 | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 | R-XDMA-P9 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最高工作温度 | - | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C |
| 最低工作温度 | - | -55 °C | -40 °C | -10 °C | -25 °C | -55 °C | -40 °C | -10 °C | -25 °C |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | - | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
| 最小供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD OVER COPPER | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 |
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