BC637; BCP55; BCX55
60 V, 1 A NPN medium power transistors
Rev. 07 — 25 June 2007
Product data sheet
1. Product profile
1.1 General description
NPN medium power transistor series.
Table 1.
Product overview
Package
NXP
BC637
[2]
BCP55
BCX55
[1]
[2]
Type number
[1]
PNP complement
JEITA
SC-43A
SC-73
SC-62
JEDEC
TO-92
-
TO-243
BC638
BCP52
BCX52
SOT54
SOT223
SOT89
Valid for all available selection groups.
Also available in SOT54A and SOT54 variant packages (see
Section 2).
1.2 Features
I
High current
I
Two current gain selections
I
High power dissipation capability
1.3 Applications
I
I
I
I
Linear voltage regulators
Low-side switches
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
I
CM
h
FE
Quick reference data
Parameter
collector-emitter voltage
collector current
peak collector current
DC current gain
h
FE
selection -10
h
FE
selection -16
single pulse; t
p
≤
1 ms
V
CE
= 2 V; I
C
= 150 mA
V
CE
= 2 V; I
C
= 150 mA
V
CE
= 2 V; I
C
= 150 mA
Conditions
open base
Min
-
-
-
63
63
100
Typ
-
-
-
-
-
-
Max
60
1
1.5
250
160
250
Unit
V
A
A
NXP Semiconductors
BC637; BCP55; BCX55
60 V, 1 A NPN medium power transistors
2. Pinning information
Table 3.
Pin
SOT54
1
2
3
base
collector
emitter
1
2
3
001aab347
Pinning
Description
Simplified outline
Symbol
2
1
3
sym056
SOT54A
1
2
3
base
collector
emitter
1
2
3
001aab348
2
1
3
sym056
SOT54 variant
1
2
3
base
collector
emitter
1
2
3
001aab447
2
1
3
sym056
SOT223
1
2
3
4
base
collector
emitter
collector
1
2
3
3
sym016
4
1
2, 4
SOT89
1
2
3
emitter
collector
base
3
2
1
3
1
sym042
2
BC637_BCP55_BCX55_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 25 June 2007
2 of 15
NXP Semiconductors
BC637; BCP55; BCX55
60 V, 1 A NPN medium power transistors
3. Ordering information
Table 4.
Ordering information
Package
Name
BC637
[2]
BCP55
BCX55
[1]
[2]
Type number
[1]
Description
plastic single-ended leaded (through hole) package;
3 leads
plastic surface-mounted package with increased
heatsink; 4 leads
Version
SOT54
SOT223
SC-43A
SC-73
SC-62
plastic surface-mounted package; collector pad for good SOT89
heat transfer; 3 leads
Valid for all available selection groups.
Also available in SOT54A and SOT54 variant packages (see
Section 2
and
Section 9).
4. Marking
Table 5.
BC637
BC637-16
BCP55
BCP55-10
BCP55-16
BCX55
BCX55-10
BCX55-16
Marking codes
Marking code
C637
C63716
BCP55
BCP55/10
BCP55/16
BE
BG
BM
Type number
BC637_BCP55_BCX55_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 25 June 2007
3 of 15
NXP Semiconductors
BC637; BCP55; BCX55
60 V, 1 A NPN medium power transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
BC637
BCP55
BCX55
single pulse;
t
p
≤
1 ms
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
[1]
[1]
[2]
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
Min
-
-
-
-
-
-
Max
60
60
5
1
1.5
0.2
Unit
V
V
V
A
A
A
-
-
-
-
-
-
-
−65
−65
0.83
0.64
0.96
0.5
0.85
1.25
150
+150
+150
W
W
W
W
W
W
°C
°C
°C
T
j
T
amb
T
stg
[1]
[2]
[3]
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
BC637_BCP55_BCX55_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 25 June 2007
4 of 15
NXP Semiconductors
BC637; BCP55; BCX55
60 V, 1 A NPN medium power transistors
1.6
P
tot
(W)
1.2
006aaa085
1.6
P
tot
(W)
1.2
(1)
006aaa086
0.8
0.8
(2)
0.4
0.4
0
−75
−25
0
25
75
125
175
T
amb
(°C)
0
−75
−25
0
25
75
125
175
T
amb
(°C)
FR4 PCB, standard footprint
(1) FR4 PCB, mounting pad for collector 1 cm
2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curve SOT54
1.6
P
tot
(W)
1.2
Fig 2. Power derating curves SOT223
006aaa087
(1)
(2)
0.8
(3)
0.4
0
−75
−25
0
25
75
125
175
T
amb
(°C)
(1) FR4 PCB, mounting pad for collector 6 cm
2
(2) FR4 PCB, mounting pad for collector 1 cm
2
(3) FR4 PCB, standard footprint
Fig 3. Power derating curves SOT89
BC637_BCP55_BCX55_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 25 June 2007
5 of 15
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