MN103SF73N, MN103SF73R
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
512K
32K
QFP100-P-1818B (ES (Engineering Sample) available)
25
ns (at
2.7
V to
3.6
V,
40
MHz)
MN103SF73N
FLASH
1024K
MN103SF73R
Interrupts
RESET, IRQ
×
8,
NMI, Timer
×
28,
SIF
×
10,
I²C
×
3,
Time base timer
×
2,
DMA
×
12,
WDT, A/D, System error, Remote control
×
4
Timer Counter
8-bit
timer
×
10
Reload-down count, Cascade connection possible (usable as a
16-bit
to
32-bit
timer)
16-bit
timer
×
6
Up-down count, Input capture function, PWM generating function, Compare/capture register
2-ch.
Time base timer
×
1
Watchdog timer
×
1
Serial interface
UART/synchronous/multi-master I²C interface selective :
3
UART/synchronous interface selective :
2
Remote Contorol Interface
Remote control reception : correspondence with low speed clock waiting, Correspondence with AEHA (Association for Electric
Home Appliances) format
CAN controller
DMA controller
Number of channels :
4
Unit of transfer :
8/16/32
bits
Max. Transfer cycles :
65535
Staring factor : external interrupt, timer factor, serial transmission/reception factor, I²C transmission/reception factor, external
trnsmission request factor, A/D conversion finish, software factor, Remote control data reception
Transfer method :
2-bus
cycle transfer
Adressing modes : fixed, increment, decrement
Transfer modes : word transfer, burst transfer, intermittent transfer
I/O Pins
I/O
Input
22
59
1
(5V I/O) Common use
(3V I/O) Common use
(3V I/O) Common use
A/D converter
10-bit
×
8-ch. 5V
input
8-ch.
ROM Correction
MAF00021AEM
MN103SF73N, MN103SF73R
Electrical Charactreistics (A/D converter characteristics)
Parameter
Resolution
Non-linear error
Differential non-linearity error
VDD5 = VREFH =
3.3
V, VSS =
0
V
VDD5 = VREFH =
5.0
V, VSS =
0
V
Symbol
Condition
Limit
min
typ
max
10
±
4
±
4
Unit
Bits
LSB
LSB
Development tools
In-circuit Emulator
PX-ICE-103S73
On-board Development Tools
PX-ODB103S-D0
Pin Assignment
P42, SBT4, SCL4, IRQ7, NMIRQ
P40, SBI4, TM13IOB, D15
P41, SBO4, SDA4, IRQ6
P87, TM13IOA, D14
P85, TM12IOA, D12
P86, TM12IOB, D13
P84, TM11IOB, D11
P83, TM11IOA, D10
P81, TM10IOA, D8
P82, TM10IOB, D9
P80, SDCLKI
P77, SDCLKO
P75, D7
P74, D6
P73, D5
P72, D4
P71, D3
P70, D2
P67, D1
P66, D0
53
P65, A0
52
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
P90, SBO0B
P91, SBI0B
P92, SBT0B
P93, SBO3B, SDA3B
P94, SBI3B
P95, SBT3B, SCL3B
PD0, SBO2B, SDA2B
PD1, SBI2B
PD2, SBT2B, SCL2B
PD3, IRQ0B
PD4, IRQ1B
PD5, IRQ2B
PD6, IRQ3B, TM15IOA
VDD5
PD7, IRQ4B, TM15IOB
VSS
PA0, AN0
PA1, AN1
PA2, AN2
PA3, AN3
PA4, AN4
PA5, AN5
PA6, AN6
PA7, AN7
VREFH
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
10
12
13
14
15
16
17
18
19
20
21
22
23
24
11
1
2
3
4
5
6
7
8
9
51
P64, A1
VDD18
VSS
VDD33
50
49
48
47
46
45
44
43
42
41
40
P63, A2
P62, A3
P61, A4
P60, A5
P57, A6
P56, A7
P55, A8
P54, A9
P53, A10
P52, A11
P51, A12
VSS
P50, A13
VDD18
P35, SBT3A, SCL3A, A14
P34, SBI3A, A15
P33, SBO3A, SDA3A, A16
P32, SBT1A, A17
P31, SBI1A, A18
P30, SBO1A, A19
P25, IRQ5A, A20
P24, IRQ4A, NCS3
P23, IRQ3A, NCS2
P22, IRQ2A, NCS1
P21, IRQ1A, RMIRQ, NCS0
MN103SF73R
MN103SF73N
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
P20, IRQ0A, DK(VPP)
P02, SBT0A, NRE
P05, SBT2A, SCL2A, NSCAS
P10, TM4IO, OCD_SDA
P15, SBO1B, TM14IOB
XI, P07
VSS
P06, IRQ5B, NSRAS
VDD33
NRST
OSCI
LON
XO
P14, SBT1B, TM14IOA
P12, TM6IO, SYSCLK
P16, SBI1B, TM7IO
P04, SBI2A, SCKE
MMOD
OSCO
P00, SBO0A, NWE0, NSDQM0
P01, SBI0A, NWE1, NSDQM1
P03, SBO2A, SDA2A, NSWE
P11, TM5IO, OCD_SCL
VDD18, VOUT
OCDMOD
VDD5 = VDD33 to 5.5 V
VDD33 = 2.7 V to 3.6 V
QFP100-P-1818B
MAF00021AEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
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