EE PLD, 9.5ns, 32-Cell, CMOS, PQCC44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | XILINX(赛灵思) |
Reach Compliance Code | not_compliant |
其他特性 | YES |
系统内可编程 | YES |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e0 |
JTAG BST | YES |
湿度敏感等级 | 3 |
宏单元数 | 32 |
端子数量 | 44 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 9.5 ns |
认证状态 | Not Qualified |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
PZ5032NS7A44 | PZ5032NS10A44 | PZ5032NS10BC | PZ5032NS7BC | PZ5032CS6A44 | PZ5032CS10BC | PZ5032CS6BC | PZ5032CS7BC | |
---|---|---|---|---|---|---|---|---|
描述 | EE PLD, 9.5ns, 32-Cell, CMOS, PQCC44 | EE PLD, 12.5ns, 32-Cell, CMOS, PQCC44 | EE PLD, 12.5ns, 32-Cell, CMOS, PQFP44 | EE PLD, 9.5ns, 32-Cell, CMOS, PQFP44 | EE PLD, 8ns, 32-Cell, CMOS, PQCC44 | EE PLD, 12.5ns, 32-Cell, CMOS, PQFP44 | EE PLD, 8ns, 32-Cell, CMOS, PQFP44 | EE PLD, 10ns, 32-Cell, CMOS, PQFP44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | not_compliant | unknown | unknown | unknown |
其他特性 | YES | YES | YES | YES | YES | YES | YES | YES |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
宏单元数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QFP | QFP | QCCJ | QFP | QFP | QFP |
封装等效代码 | LDCC44,.7SQ | LDCC44,.7SQ | TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | LDCC44,.7SQ | TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | TQFP44,.47SQ,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 9.5 ns | 12.5 ns | 12.5 ns | 9.5 ns | 8 ns | 12.5 ns | 8 ns | 10 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | GULL WING | GULL WING | J BEND | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
包装说明 | - | - | QFP, TQFP44,.47SQ,32 | QFP, TQFP44,.47SQ,32 | - | QFP, TQFP44,.47SQ,32 | QFP, TQFP44,.47SQ,32 | QFP, TQFP44,.47SQ,32 |
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