Analog Circuit, Hybrid, MDIP10
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LSC/CSI |
包装说明 | DIP, DIP10/24,.6 |
Reach Compliance Code | unknown |
最大输入电压 | 75 V |
最小输入电压 | 36 V |
JESD-30 代码 | R-MDIP-T10 |
JESD-609代码 | e0 |
端子数量 | 10 |
最高工作温度 | 70 °C |
最低工作温度 | -25 °C |
最大输出电流 | 1 A |
标称输出电压 | 5 V |
封装主体材料 | METAL |
封装代码 | DIP |
封装等效代码 | DIP10/24,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | HYBRID |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
LAW005A8 | LAW005B | LAW005BK8 | LAW005B8 | LAW005C | LAW005CL | LAW005CL8 | LAW005F8 | |
---|---|---|---|---|---|---|---|---|
描述 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 | Analog Circuit, Hybrid, MDIP10 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI |
包装说明 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 | DIP, DIP10/24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最大输入电压 | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V |
最小输入电压 | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V |
JESD-30 代码 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 | R-MDIP-T10 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
最大输出电流 | 1 A | 0.47 A | 0.23 A | 0.47 A | 0.4 A | 0.19 A | 0.19 A | 1 A |
标称输出电压 | 5 V | 12 V | 12 V | 12 V | 15 V | 15 V | 15 V | 3.3 V |
封装主体材料 | METAL | METAL | METAL | METAL | METAL | METAL | METAL | METAL |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 | DIP10/24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | - |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved