Ref. No.
- L -
MS-L330CBHU
MOK SAN ELECTRONIC CO., LTD.
Q.A
CHECKED
APPROVED
1. General Description
The MS-L330CBHU of reflecting Ultra brightness Blue lamp has a uniquely designed
shape and encapsulated in water clear epoxy resin
with 3mm diameter.
2. Feature
1) All epoxy resin mold type
2) Water clear lamp type
3) Wide viewing angle
4) InGaN LED
3. Absolute Maximum Ratings.
Parameter
Forward Current
Power Dissipation
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
PD
VR
Topr
Tstg
Tsol
Ratings
30
120
5
- 25 ½ + 80
- 30 ½ + 100
* 260
(Ta=25℃)
Unit
㎃
mW
V
℃
℃
℃
* = for within 5sec
4. Electro - Optical Characteristics.
Parameter
Reverse Current
Luminous Intensity
Angle Sensitivity at 50%
Dominant Wavelength
Spectrum radiation bandwidth
Symbol
IR
Iv
θ
λ
D
Δλ
IF=20㎃
IF=20㎃
Test Condition
VR=5V
IF=20mA
2600
±30
470
35
Min
Typ
Max
10
(Ta=25℃)
Unit
㎂
mcd
deg
nm
nm
5. Forward Voltage
Rank
VF
H
3.0 ½ 3.2
M
3.2 ½ 3.4
L
3.4½ 3.6
If=20㎃
Unit
V
6. Dimension
Tolerance : ±0.2mm
7. Typical Characteristics
8. Precautions in Handling
(1) Safety Precautions
The light output of the products may cause injuries to human eyes in circumstances
where the products are viewed directly with unshielded eyes for more than a few seconds.
(2) Static Electricity
Products are sensitive to static electricity and a high standard of care must be taken when
handling products. Particularly if an over-voltage which exceeds the Absolute Maximum
Rating of products is applied the overflow in energy may cause damage to, or possibly
result in destruction of the products.
To touch the lead directly must be avoided. Customer shall take absolute secure counter
measures against static electricity and surge when handling products.
(3) Soldering Conditions
․When
soldering leave 2.0mm of minimum clearance between the resin and the soldering
point.
․Maximum
allowable soldering conditions are :
Solder dipping : Max 260 ℃, Max 5 seconds
․Bringing
the resin in contact with moltes metal must be avoided.
․Correcting
the soldered position after soldering must be avoided.
․In
soldering, do not apply any stress to the lead frame, particularly when heated.
(4) Lead Forming and Cut
․Lead
forming must be mode under the tie bar cutting portion.
․When
forming a lead, make sure not to apply any stress inside the resin.
․lead
forming must be done before soldering.
․Cutting
the lead frame at high temperature may result in accidents.
It is necessary to cut the lead frame at normal temperature.
(5) Assembly
․Do
not apply any stress to the lead frame while assembling.
․When
mounting products on to boards such as printed wired board, the pitch
between the two holes of such boards must match the pitch of the products.
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