CURRENT SENSOR-LOW TCR
PR2010
5%,1%
RoHS Compliant
Product specification
–
Feb. 22, 2010 V1
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1
Chip Resistor Surface Mount
PR
SERIES
2010 (RoHS Compliant)
5
SCOPE
This specification describes PR2010 series current sensor
–
low TCR chip resistors with
lead-free terminations made by metal substrate.
FEATURES
●
Products with lead free terminations meet RoHS requirements.
●
High component and equipment reliability
●
Low thermal EMF(<1uV/℃).
●
Ultra-low resistance and narrow tolerance can suitable for current detection.
●
Low inductance 0.5nH to 5nH.
Product Applications
●
Battery Pack,
●
Inverter/ Converter (DC-DC/AC-DC/DC-AC)
●
Consumer Electrics
●
Laptop
ORDERING INFORMATION
Part number is identified by the series name, size, tolerance, packaging type, temperature
coefficient of resistance, taping reel, resistance value and special packing quantity.
PR2010
X
(1)
X
(2)
X
XX XXXXX
(5)
Z
(6)
(3) (4)
MARKING
PR2010
(1) TOLERANCE
J =
±5%
F =
±1%
(2) PACKAGING TYPE
K = Embossed taping reel
Fig.1 Value=4mΩ
( 4 digits, resistance greater or equal than 4mΩ)
(3) TEMPERATURE COEFFICIENT OF
RESISTANCE
E=±50ppm/°C
(4) TAPING REEL
07 = 7“ dia. Reel & 0.5W
7W = 7“ dia. Reel & 1W
(5) RESISTANCE VALUE
Fig.2 Value=1mΩ
( 4 digits, resistance below or equal than 3mΩ)
ORDERING EXAMPLE
The ordering code for a PR2010 0.5W chip resistor, value
0.015Ω with
±1%
tolerance, supplied in 7-inch tape reel
with 2Kpcs quantify is:
PR2010FKE070R015Z.
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PR: 0R001~ 0R1
(1mΩ~100mΩ)
(6) Special Packaging Quantity
Z = 2,000 units/reel
2
Chip Resistor Surface Mount
PR
SERIES
2010 (RoHS Compliant)
5
DIMENSION
Table 1
PR2010
L (mm)
W (mm)
H (mm)
I1 (mm)
1 mΩ
~
3 mΩ
5.10±0.25
2.54±0.25
0.80±0.25
1.30±0.25
4 mΩ
~
100 mΩ
5.10±0.25
2.54±0.25
0.64±0.25
0.80±0.25
For dimension see Table 1
Fig.3
CONSTRUCTION
The resistors are constructed in high
grade materials. Internal metal
electrodes are added at each end and
connected by a resistive paste that is
applied to the top surface of metal alloy.
See fig. 3.
Fig.4 Chip resistor outlines
POWER RATING
PR2010 rated power at 70°C is 0.5W & 1W
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
Operating Temperature Range
PR2010
0.5W & 1W
–55°C
to +155°C
Maximum Working Voltage
(
P
*
R
)
1mΩ~100mΩ
±50ppm/℃
Resistance Range
Temperature Coefficient
RATED VOLTAGE:
The DC or AC (rms) continuous working voltage corresponding
to the rated power is determined by the following formula:
U=
(
P
*
R
)
Where
U=Continuous rated DC
or AC (rms) working voltage
P=Rated power
R=Resistance value
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3
Chip Resistor Surface Mount
PR
SERIES
2010 (RoHS Compliant)
5
TAPING REEL
Table 3
DIMENSION
Tape Width(mm)
2010
12
12
178.0±1.0
60.0±0.5
13.50±0.5
17.70±0.5
13.0±0.5
16.2±0.5
ØA
(mm)
ØN
(mm)
ØC
(mm)
ØD
(mm)
W1 (mm)
W2 (mm)
Fig.5 Reel
EMBOSSED TAPE SPECIFICATION
Table 4
DIMENSION
2010
A
0
(mm)
B
0
(mm)
W (mm)
E (mm)
F (mm)
P
0
(mm)
P
1
(mm)
P
2
(mm)
D
0
(mm)
D
1
(mm)
T (mm)
2.90±0.10
5.45±0.10
12.00±0.15
1.75±0.10
5.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10
1.50±0.05
1.50±0.10
1.10±0.10
Fig.6 Embossed Dimensions
PACKING STYLE AND PACKAGING QUATITY
PACKING STYLE
Embossed Taping Reel
REEL
DIMENSION
2010
2,000 Units
7" (178 mm)
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4
Chip Resistor Surface Mount
PR
SERIES
2010 (RoHS Compliant)
5
TESTS AND REQUIREMENTS
TEST
T.C.R
TEST METHOD
IEC 60115-1 4.8
PROCEDURE
At +25/+125
°C
Formula:
R2-R1
T.C.R= -------------------------
×10
(ppm/°C)
6
REQUIREMENT
Refer to table 2
R1(t2-t1)
Where
t1=+25
°C
or specified room temperature
t2=+125
°C
test temperature
R1=resistance at room temperature in ohms
R2=resistance at test temperature in ohms
Life/Endurance
High
Temperature
Exposure/
Endurance at
upper category
temperature
Moisture
Resistance
Short time
overload
Board Flex/
Bending
IEC 60115-1 4.25.1
IEC 60068-2-2
1,000 hours at 70±5
°C
applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at maximum operating temperature
depending on specification, un-powered
No direct impingement of forced air to the parts
Tolerances: 155±3
°C
±(1%+0.0005Ω)
±(1%+0.0005Ω)
MIL-STD-202 Method
106G
IEC 60115-1 4.13
IEC 60068-2-21
Mil-STD-202, Method 106,0% power,7a and 7b
not required, t=24h/cycle,10 cycles, Unpowered.
4 times RCWV, rating power 5 secs
Device mounted on PCB test board as
described,
only 1 board bending required
2
mm bending
Bending time: 60±1 seconds
Ohmic value checked during bending
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: Method B, aging 4 hours at 155
°C
dry heat
2nd step: leadfree solder bath at 245±3
°C
Dipping time: 3±0.5 seconds
Condition B, no pre-heat of samples
Leadfree solder, 260±5
°C,
10±1seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±85 °C,85%
RH,10% Bias, Extended Life Test:
1,000 hours, 1.5 hours On, 0.5 hours Off
±(0.5%+0.0005Ω)
±(0.5%+0.0005Ω)
±(1%+0.0005Ω)
Solder-ability
- Wetting
IPC/JEDEC
J-STD-002B test B
Well tinned (>95%
covered)
No visible damage
- Resistance to
Soldering Heat
IEC 60068-2-58
±(0.5%+0.0005Ω)
No visible damage
Bias Humidity
JIS C5202-7.9
±(0.5%+0.0005Ω)
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