Analog Circuit, Hybrid, PBGA20,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Vishay Telefunken (Vishay) |
Reach Compliance Code | unknown |
最大输入电压 | 6 V |
最小输入电压 | 2.5 V |
JESD-30 代码 | R-PBGA-B20 |
JESD-609代码 | e0 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出电压 | 3.3 V |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA20,4X5,100 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | HYBRID |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子节距 | 2.54 mm |
端子位置 | BOTTOM |
FX5545G0023V3T2 | FX5545G0026V0B1 | FX5545G002ADJB5 | FX5545G002ADJB1 | FX5545G0026V0T2 | FX5545G0023V3B1 | FX5545G0023V3T1 | FX5545G0023V3B5 | FX5545G0026V0T1 | |
---|---|---|---|---|---|---|---|---|---|
描述 | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, | Analog Circuit, Hybrid, PBGA20, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最大输入电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
JESD-30 代码 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
厂商名称 | Vishay Telefunken (Vishay) | - | - | Vishay Telefunken (Vishay) | Vishay Telefunken (Vishay) | Vishay Telefunken (Vishay) | Vishay Telefunken (Vishay) | Vishay Telefunken (Vishay) | Vishay Telefunken (Vishay) |
标称输出电压 | 3.3 V | 6 V | - | - | 6 V | 3.3 V | 3.3 V | 3.3 V | 6 V |
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