Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, PDSO8,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Comlinear Corporation |
| 包装说明 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | CURRENT-FEEDBACK |
| 最大平均偏置电流 (IIB) | 22 µA |
| 25C 时的最大偏置电流 (IIB) | 22 µA |
| 最小共模抑制比 | 46 dB |
| 标称共模抑制比 | 50 dB |
| 频率补偿 | YES (AVCL>=2) |
| 最大输入失调电压 | 5000 µV |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 低-失调 | NO |
| 负供电电压上限 | -7 V |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 最小摆率 | 2000 V/us |
| 标称压摆率 | 2600 V/us |
| 最大压摆率 | 12 mA |
| 供电电压上限 | 7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最小电压增益 | 2 |
| 宽带 | YES |
| CLC404AJE | CLC404A8D | CLC404ALC | CLC404AJP | CLC404AID | CLC404AMC | |
|---|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, PDSO8, | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, CDIP8, | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, PDIP8, | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, CDIP8, | Operational Amplifier, 1 Func, 5000uV Offset-Max, BIPolar, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK |
| 最大平均偏置电流 (IIB) | 22 µA | 22 µA | 22 µA | 22 µA | 22 µA | 22 µA |
| 25C 时的最大偏置电流 (IIB) | 22 µA | 22 µA | 22 µA | 22 µA | 22 µA | 22 µA |
| 最小共模抑制比 | 46 dB | 46 dB | 46 dB | 46 dB | 46 dB | 46 dB |
| 标称共模抑制比 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 频率补偿 | YES (AVCL>=2) | YES (AVCL>=2) | YES (AVCL>=2) | YES (AVCL>=2) | YES (AVCL>=2) | YES (AVCL>=2) |
| 最大输入失调电压 | 5000 µV | 5000 µV | 5000 µV | 5000 µV | 5000 µV | 5000 µV |
| JESD-30 代码 | R-PDSO-G8 | R-GDIP-T8 | X-XUUC-N5 | R-PDIP-T8 | R-GDIP-T8 | X-XUUC-N5 |
| 低-失调 | NO | NO | NO | NO | NO | NO |
| 负供电电压上限 | -7 V | -7 V | -7 V | -7 V | -7 V | -7 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 5 | 8 | 8 | 5 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| 封装代码 | SOP | DIP | DIE | DIP | DIP | DIE |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | DIE OR CHIP | DIP8,.3 | DIP8,.3 | DIE OR CHIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| 封装形式 | SMALL OUTLINE | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | UNCASED CHIP |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小摆率 | 2000 V/us | 2000 V/us | 2000 V/us | 2000 V/us | 2000 V/us | 2000 V/us |
| 标称压摆率 | 2600 V/us | 2600 V/us | 2600 V/us | 2600 V/us | 2600 V/us | 2600 V/us |
| 最大压摆率 | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| 供电电压上限 | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | UPPER | DUAL | DUAL | UPPER |
| 最小电压增益 | 2 | 2 | 2 | 2 | 2 | 2 |
| 宽带 | YES | YES | YES | YES | YES | YES |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
| 厂商名称 | Comlinear Corporation | - | Comlinear Corporation | Comlinear Corporation | Comlinear Corporation | Comlinear Corporation |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
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