Datasheet> 器件分类 > 无线/射频/通信> 电信电路> TMXL336251BL-21

文档预览

TMXL336251BL-21: 产品描述Support Circuit, 1-Func, PBGA1152, 45 X 45 MM, 2.38 MM HEIGHT, PLASTIC, BGA-1152; 产品类别无线/射频/通信电信电路; 文件大小2MB，共76页; 制造商LSC/CSI; 官网地址https://lsicsi.com

下载文档详细参数选型对比全文预览

TMXL336251BL-21概述

Support Circuit, 1-Func, PBGA1152, 45 X 45 MM, 2.38 MM HEIGHT, PLASTIC, BGA-1152

TMXL336251BL-21规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	LSC/CSI
零件包装代码	BGA
包装说明	BGA,
针数	1152
Reach Compliance Code	compliant
应用程序	SONET;SDH
JESD-30 代码	S-PBGA-B1152
JESD-609代码	e0
长度	45 mm
功能数量	1
端子数量	1152
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	SQUARE
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	225
认证状态	Not Qualified
座面最大高度	2.51 mm
标称供电电压	1.5 V
表面贴装	YES
电信集成电路类型	ATM/SONET/SDH SUPPORT CIRCUIT
温度等级	INDUSTRIAL
端子面层	TIN LEAD
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	45 mm

TMXL336251BL-21文档预览

Hardware Design Guide, Revision 6

March 8, 2005

TMXL33625

Hypermapper™

Lite

622/155 Mbits/s SONET/SDH x DS3/E3

1 Introduction

The last issue of this data sheet was July 12, 2004 - Revision 5. A change history is included in

Section 13, Change History,

on page 74.

Red change bars have been installed on all text, figures, and tables that were added or changed. All changes

to the text are highlighted in red. Changes within figures, and the figure title itself, are highlighted in red, if feasible.

Formatting or grammatical changes have not been highlighted. Deleted sections, paragraphs, figures, or tables will be

specifically mentioned.

The documentation package for the TMXL33625

HypermapperLite

622/155 Mbits/s SONET/SDH x DS3/E3 system chip

consists of the following documents:

The Register Description and the

Hypermapper

Family System Design Guide. These documents are available on a pass-

word protected website.

The

HypermapperLite

Product Description and the

HypermapperLite

Hardware Design Guide (this document). These

documents are available on the public website shown below (select Mappers/MUXes).

If the reader displays this document using

Acrobat

Reader

, clicking on any blue text will bring the reader to that refer-

ence point.

To access related documents, including the documents mentioned above, please go to the following public website, or con-

tact your Agere representative (see the last page of this document).

http://www.agere.com/enterprise_metro_access/index.html

This document describes the hardware interfaces of the Agere Systems TMXL33625

HypermapperLite

device. Information

relevant to the use of the device in a board design is covered. Pin descriptions, dc electrical characteristics, timing

diagrams, ac timing parameters, packaging, and operating conditions are covered.

622/155Mb/s

High-Speed IF

Clock & Data

622/155 Mbits/s SONET/SDH

ADM Front End

LOPOH

DS3/E3/DS1/E1/DS0 PDH

Tributary Termination

LOPOH

FRM (x12)

x28/x21

DS1/J1/E1

CDR

TMUX-A

STSPP

STS

From/To

TMUX A,B,C,D

SPEMPR x12

(3-5)

TPGM

(x4)

Clock/Sync 6

Clock & Data

CDR

TMUX-B

STSPP

STS

MRXC

VTMPR (x12)

x28/x21

System

Interfaces

168

Clock/Sync 6

SPEMPR x12

(0-2)

(x24) DS3/E3

(x12) STS-1

Clock & Data

CDR

TMUX-C

STSPP

STS

DS1/J1/E1

VT/TU

DS3/E3

(x12) NSMI

(x12) STS-1

(Total of 3 STS-1

max/partition)

Partitions A, B, C, and

D are totally separate

and cannot be intercon-

nected internally. For

example, a DS1 out of a

VTMPR from partition

A, cannot be sent to the

MRXC of partition B.

Clock/Sync 6

STS1LT x12

E13 MUX

(x12)

M13 MUX

(x12)

Clock & Data

CDR

TMUX-D

JTAG

STSPP

STS

MCDR

Mate Interconnect

(x12)

DS1/E1 DJA

x28/x21 (x12)

TOAC

DS3/E3 DJA

x6 (x4)

Power & GND

pins not shown

Clock/Sync 6

A B C D

MPU

Miscellaneous

JTAG IF

MPU IF

A,B,C,D

DS1XCLK,

E1XCLK

DS3XCLK,

E3XCLK

020605

POAC

Figure 1-1.

HypermapperLite

Block Diagram and High-Level Interface Definition

TMXL33625

HypermapperLite

622/155 Mbits/s SONET/SDH x DS3/E3

Hardware Design Guide, Revision 6

April 5, 2005

Table of Contents

Contents

Page

1 Introduction ........................................................................................................................................................................1

2 Pin Information ...................................................................................................................................................................6

2.1 Ball Diagram ................................................................................................................................................................6

2.2 Pin Assignments ..........................................................................................................................................................7

2.3 Pin Matrix ...................................................................................................................................................................20

2.4 Pin Types ...................................................................................................................................................................24

2.5 Pin Definitions ............................................................................................................................................................25

3 Operating Condidtions and Reliability ..............................................................................................................................43

3.1 Absolute Maximum Ratings .......................................................................................................................................43

3.2 Recommended Operating Conditions .......................................................................................................................43

3.3 Handling Precautions ................................................................................................................................................43

3.4 Thermal Parameters (Definitions and Values) ...........................................................................................................44

3.5 Reliability ...................................................................................................................................................................45

3.6 Recommended Powerup Sequence ..........................................................................................................................45

3.7 Power Consumption ..................................................................................................................................................46

4 Electrical Characteristics .................................................................................................................................................47

4.1 LVCMOS Interface Characteristics ............................................................................................................................47

4.2 LVDS Interface Characteristics .................................................................................................................................49

5 Timing ..............................................................................................................................................................................50

5.1 TMUX High-Speed Interface Timing ..........................................................................................................................50

5.2 THSSYNC Characteristics .........................................................................................................................................51

5.3 STS-3/STM-1 Mate Interconnect Timing ...................................................................................................................53

5.4 TOAC, POAC, and LOPOH Timing ...........................................................................................................................54

5.5 DS3/E3/STS-1 Timing ...............................................................................................................................................55

5.6 NSMI Timing ..............................................................................................................................................................56

6 Reference Clocks ............................................................................................................................................................59

7 Microprocessor Interface Timing .....................................................................................................................................63

7.1 Synchronous Write Mode ..........................................................................................................................................63

7.2 Synchronous Read Mode ..........................................................................................................................................65

7.3 Asynchronous Write Mode ........................................................................................................................................66

7.4 Asynchronous Read Mode ........................................................................................................................................68

7.5 Accessing the Same Register Sequentially Across Multiple Partitions. .....................................................................69

8 Other Timing ....................................................................................................................................................................70

9 Hardware Design File References ...................................................................................................................................70

10 1152-Pin PBGA6 Diagrams ............................................................................................................................................71

11 Ordering Information ......................................................................................................................................................72

12 Glossary .........................................................................................................................................................................73

13 Change History ...............................................................................................................................................................74

13.1 Navigating Through an Adobe Acrobat Document .................................................................................................74

14 Appendix ........................................................................................................................................................................75

14.1 Input Capacitances .................................................................................................................................................75

Agere Systems Inc.

Hardware Design Guide, Revision 6

April 5, 2005

TMXL33625

HypermapperLite

622/155 Mbits/s SONET/SDH x DS3/E3

Tables of Contents

(continued)

Tables

Page

Table 2-1. Pin Assignments....................................................................................................................................................7

Table 2-2. Pin Matrix ............................................................................................................................................................20

Table 2-3. Pin Types ............................................................................................................................................................24

Table 2-4. TMUX Blocks, High-Speed Interface I/O.............................................................................................................25

Table 2-5. TMUX Blocks, Protection Link I/O .......................................................................................................................27

Table 2-6. TMUX Blocks, Clock and Sync I/O......................................................................................................................28

Table 2-7. STS Cross Connect (STSXC) Blocks, STS-3/STM-1 Mate Interconnect............................................................29

Table 2-8. Multirate Cross Connect (MRXC) Blocks, TOAC Input and Output Channels ....................................................30

Table 2-9. Multirate Cross Connect (MRXC) Blocks, POAC Input and Output Channels ....................................................31

Table 2-10. DS3/E3/STS-1 Out ............................................................................................................................................32

Table 2-11. DS3/E3/STS-1 In...............................................................................................................................................33

Table 2-12. NSMI/STS-1 In ..................................................................................................................................................34

Table 2-13. NSMI/STS-1 Out ...............................................................................................................................................35

Table 2-14. Reference Clocks ..............................................................................................................................................36

Table 2-15. Low-Order Path Overhead Access, Transmit Direction ....................................................................................36

Table 2-16. Low-Order Path Overhead Access, Receive Direction .....................................................................................37

Table 2-17. Clock Generator ................................................................................................................................................37

Table 2-18. Microprocessor Interface...................................................................................................................................38

Table 2-19. Boundary Scan (IEEE

1149.1) ........................................................................................................................39

Table 2-20. General-Purpose Interface ................................................................................................................................40

Table 2-21. CDR Interface....................................................................................................................................................40

Table 2-22. Analog Power and Ground Signals ...................................................................................................................41

Table 2-23. Digital Power and Ground Signals ....................................................................................................................42

Table 2-24. No Connects......................................................................................................................................................42

Table 3-1. Absolute Maximum Ratings.................................................................................................................................43

Table 3-2. Recommended Operating Conditions .................................................................................................................43

Table 3-3. ESD Tolerance ....................................................................................................................................................43

Table 3-4. Thermal Parameter Values .................................................................................................................................44

Table 3-5. Reliability Data ....................................................................................................................................................45

Table 3-6. Moisture Sensitivity Level....................................................................................................................................45

Table 3-7. Typical Power Consumption Per Block ...............................................................................................................46

Table 4-1. LVCMOS Input Specifications 1 ..........................................................................................................................47

Table 4-2. LVCMOS Input Specifications 2 ..........................................................................................................................47

Table 4-3. LVCMOS Input Specifications 3 ..........................................................................................................................47

Table 4-4. LVCMOS Output Specifications ..........................................................................................................................48

Table 4-5. LVCMOS Bidirectional Specifications .................................................................................................................48

Table 4-6. LVDS Interface dc Characteristics ......................................................................................................................49

Table 5-1. High-Speed Interface Input Specifications ..........................................................................................................50

Table 5-2. Protection Link Input Specifications ....................................................................................................................50

Table 5-3. High-Speed Interface Output Specifications .......................................................................................................51

Table 5-4. Protection Link Output Specifications..................................................................................................................51

Table 5-5. STS-3/STM-1 Mate Interconnect Input Specifications ........................................................................................53

Table 5-6. STS-3/STM-1 Mate Interconnect Output Specifications......................................................................................53

Table 5-7. TOAC and POAC and LOPOH Input Specifications ...........................................................................................54

Table 5-8. TOAC and POAC and LOPOH Output Specifications.........................................................................................54

Table 5-9. DS3/E3 Input Specifications................................................................................................................................55

Table 5-10. STS-1 Input Specifications ................................................................................................................................55

Table 5-11. DS3/E3/STS-1 Output Specifications................................................................................................................55

Table 5-12. NSMI Input Specifications .................................................................................................................................58

Table 5-13. NSMI Output Specifications ..............................................................................................................................58

Table 6-1. High-Speed Interface Input Clocks Specifications ..............................................................................................59

Table 6-2. Protection Link Input Clock Specifications ..........................................................................................................59

Table 6-3. DS3/E3/STS-1 Input Clocks Specifications.........................................................................................................59

Table 6-4. DS1/E1 DJA Input Clocks Specifications ............................................................................................................59

Table 6-5. DS3/E3 DJA Input Clocks Specifications ............................................................................................................60

Agere Systems Inc.

TMXL33625

HypermapperLite

622/155 Mbits/s SONET/SDH x DS3/E3

Hardware Design Guide, Revision 6

April 5, 2005

Table of Contents

(continued)

Tables

Page

Table 6-6. LOPOH Input Clock Specifications......................................................................................................................60

Table 6-7. Microprocessor Interface Input Clocks Specifications.........................................................................................60

Table 6-8. PLL Input Clock Specifications............................................................................................................................60

Table 6-9. High-Speed Interface Output Clocks Specifications............................................................................................60

Table 6-10. Protection Link Output Clocks Specifications....................................................................................................60

Table 6-11. Line Timing Interface Output Clocks Specifications ..........................................................................................60

Table 6-12. TOAC Output Clocks Specifications..................................................................................................................61

Table 6-13. POAC Output Clocks Specifications .................................................................................................................61

Table 6-14. DS3/E3/STS-1 Output Clocks Specifications ....................................................................................................61

Table 6-15. LOPOH Output Clock Specifications.................................................................................................................62

Table 6-16. PLL Output Clocks Specifications .....................................................................................................................62

Table 6-17. NSMI Input/Output Clocks Specifications..........................................................................................................62

Table 7-1. Microprocessor Interface Synchronous Write Cycle Specifications ....................................................................64

Table 7-2. Microprocessor Interface Synchronous Read Cycle Specifications ....................................................................65

Table 7-3. Microprocessor Interface Asynchronous Write Cycle Specifications ..................................................................67

Table 7-4. Microprocessor Interface Asynchronous Read Cycle Specifications ..................................................................69

Table 8-1. General-Purpose Input Specifications.................................................................................................................70

Table 8-2. Miscellaneous Output Specifications...................................................................................................................70

Table 8-3. General-Purpose Output Specifications ..............................................................................................................70

Table 11-1. Ordering Information .........................................................................................................................................72

Table 13-1. Document Changes...........................................................................................................................................74

Table 14-1. Input Capacitances for Specific LVCMOS Input Pins (Specification 1).............................................................75

Table 14-2. Input Capacitances for Specific LVCMOS Input Pins (Specification 2)............................................................75

Table 14-3. Input Capacitances for Specific LVCMOS Input Pins (Specification 3)............................................................75

Agere Systems Inc.

Hardware Design Guide, Revision 6

April 5, 2005

TMXL33625

HypermapperLite

622/155 Mbits/s SONET/SDH x DS3/E3

Table of Contents

(continued)

Figures

Page

Figure 1-1. HypermapperLite Block Diagram and High-Level Interface Definition .................................................................1

Figure 2-1. HypermapperLite Pin-Package Diagram (Top View) ...........................................................................................6

Figure 5-1. TMUX LVDS Signal Rise/Fall Timing.................................................................................................................50

Figure 5-2. TMUX LVDS Clock and Data Timing .................................................................................................................50

Figure 5-3. THSSYNC Timing Diagram (MPU_MASTER_SLAVE = 1)................................................................................51

Figure 5-4. THSSYNC Timing Diagram (MPU_MASTER_SLAVE = 0)................................................................................51

Figure 5-5. THSSYNC Timing Diagram for Synchronized VTs ............................................................................................52

Figure 5-6. Relationship Between THSSYNC and THSD ....................................................................................................52

Figure 5-7. STS-3/STM-1 Mate Rise/Fall Timing .................................................................................................................53

Figure 5-8. STS-3/STM-1 Mate Clock and Data Timing.......................................................................................................53

Figure 5-9. TOAC, POAC Timing .........................................................................................................................................54

Figure 5-10. LOPOH Timing.................................................................................................................................................54

Figure 5-11. DS3/E3 Interface Diagram in M13/E13 Block ..................................................................................................55

Figure 5-12. NSMI Clock and Data Timing for the STS-1 Mode ..........................................................................................56

Figure 5-13. NSMI Clock and Data Diagram for SPEMPR NSMI Mode...............................................................................56

Figure 5-14. NSMI Clock and Data Diagram for M13 NSMI Mode (NSMI <---> M13 <---> DS3 External I/O).....................57

Figure 5-15. NSMI Clock and Data Diagram for E13 NSMI Mode 1 (NSMI <---> E13 <---> E3 External I/O)......................57

Figure 5-16. NSMI Clock and Data Diagram for E13 NSMI Mode 2 (NSMI <--> E13 <--> SPEMPR <--> STM-N) .............58

Figure 7-1. Microprocessor Interface Synchronous Write Cycle (MPMODE = 1).................................................................63

Figure 7-2. Microprocessor Interface Synchronous Read Cycle (MPMODE = 1) ................................................................65

Figure 7-3. Microprocessor Interface Asynchronous Write Cycle (MPMODE = 0)...............................................................66

Figure 7-4. Microprocessor Interface Asynchronous Read Cycle (MPMODE = 0)...............................................................68

Figure 10-1. 1152-Pin PBGA6 Physical Dimensions............................................................................................................71

Agere Systems Inc.

查看更多（仅显示前5页内容，查看全部内容请下载文档。）>

TMXL336251BL-21相似产品对比

	TMXL336251BL-21	TMXL336251BL-3	L-TMXL336251BL-3
描述	Support Circuit, 1-Func, PBGA1152, 45 X 45 MM, 2.38 MM HEIGHT, PLASTIC, BGA-1152	Support Circuit, 1-Func, PBGA1152, 45 X 45 MM, 2.38 MM HEIGHT, PLASTIC, BGA-1152	Support Circuit, 1-Func, PBGA1152, 45 X 45 MM, 2.38 MM HEIGHT, ROHS COMPLIANT, PLASTIC, BGA-1152
是否无铅	含铅	含铅	不含铅
是否Rohs认证	不符合	不符合	符合
厂商名称	LSC/CSI	LSC/CSI	LSC/CSI
零件包装代码	BGA	BGA	BGA
包装说明	BGA,	BGA,	BGA,
针数	1152	1152	1152
Reach Compliance Code	compliant	unknown	unknown
JESD-30 代码	S-PBGA-B1152	S-PBGA-B1152	S-PBGA-B1152
长度	45 mm	45 mm	45 mm
功能数量	1	1	1
端子数量	1152	1152	1152
最高工作温度	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	225	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.51 mm	2.51 mm	2.51 mm
标称供电电压	1.5 V	1.5 V	1.5 V
表面贴装	YES	YES	YES
电信集成电路类型	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	NOT SPECIFIED	NOT SPECIFIED
宽度	45 mm	45 mm	45 mm
应用程序	SONET;SDH	SONET;SDH	-
JESD-609代码	e0	-	e1
端子面层	TIN LEAD	-	TIN SILVER COPPER
湿度敏感等级	-	3	3

推荐资源

lc谐振，rc谐振，lrc谐振。。。频率响应等问题。: lc谐振，rc谐振，lrc谐振。。。频率响应等问题。...; moon2163913 嵌入式系统

一个问题，大家帮帮我，谢谢ALL: 公司让我用EVC做个图形程序。就是，一个对话框内，一个随时间变化而温度发生变化的曲线，横坐标是时间t，纵坐标是温度T，我自己理解就是正弦曲线那种。小弟刚刚学习EVC图形编程，别说动的曲 ......; 2512a2512 嵌入式系统

【颁奖礼】学TI 降压稳压器架构，晒成绩赢大礼获奖名单公布！: 活动详情：https://bbs.eeworld.com.cn/thread-370328-1-1.html 感谢大家对抢楼活动的支持与参与，活动主题帖设置的压缩密码：power-wenyaqijiaogou 恭喜以下获奖网友，并请更新个人信息 ......; EEWORLD社区模拟与混合信号

电源杂讯干扰的处理: 电源杂讯干扰的处理创易电子整理出品，创易更懂电子， http://52edk.taobao.com/ 全系列阻容感一本全掌控。...; liuyanliuyan 模拟电子

如何调试跟踪Android源代码 ZT: Android平台代码很多，关系也很复杂，通常我们调试程序的时候是无法跟踪到Android framework code里的，如果能调试跟踪Android source code将给我们这些初学者带来很多便利，本文将给出一个调试 ......; qfc 嵌入式系统

mega128串口问题求教: 请大家帮忙看下这段mega128串口程序有什么问题，ICCAVR下的，没法接收数据啊 #include #include //================================== void port_init(void) { PORTA = 0xFF; DDRA ......; zengmingxia 嵌入式系统

单片机main函数退出后发生什么——以stm32为例

网上搜索可能因为大家不太关心这种情况，我没有找到有关论述单片机main函数退出的文章。不过在ST Community、阿莫BBS、StackOverflow看到有人在问同样的问题，下面摘录了一些不同角度的回答： C语言环境角度，三种可能性编译器在main函数后加入隐性的无限循环编译器在main外面添加一层无限循环 CPU继续向下取址运行（也就是跑飞了）单片机设计角度，退出会引发异常、...[详细]
450Wh/kg！融捷集团发布第二代硫化物全固态电池

当固态电池行业仍在为电动汽车的“终极方案”进行漫长的技术马拉松时，部分企业已开始寻找更切近的商业化落地场景。近日，融捷集团旗下的融捷能源科技有限公司（以下简称“融捷能源”）正式推出其第二代全固态硫化物电池，能量密度达到450 Wh/kg。固态电池迈向实处，三赛道精准卡位 2025年，全球固态电池产业进入了一个关键的“去芜存菁”阶段。在经历多轮资本与产业的热潮起伏后，市场正...[详细]
这可能是你没见过的！R型电梯变压器的神奇之处！

现在我们住的房子大部分都是电梯楼，主要原因是上下楼梯比较方便！它还能让生活更舒适。它甚至有助于提高房地产的附加值。最重要的是，别墅用的电梯不贵，一台几万元。有了这个装置，可以节省老人和孩子上下楼梯的时间，方便、安全、快捷。为了降低振动和噪声，使电梯环境质量达到相关标准的要求，目前许多电梯厂家。通常配电设备会选择使用r型电梯变压器来改变电压。在安全改变电压的同时，其多重保护功能也可以降低电梯的事故...[详细]
新能源汽车的不稳定因素目前都有哪些

随着汽车的逐渐增多，环境压力也逐渐变得越来越大。也是这个时候，有人说新能源汽车节能环保，和传统用油的汽车有很大不同，这着实吸引了一大批受众。那么新能源到底能不能买呢？这个问题其实是非常困扰消费者的。如果你在北上广一线城市的话，新能源汽车是没有什么大问题的。毕竟现在的大环境下，大城市还是非常主要节能的，而新能源车牌也确实是一个非常有诱惑力的标签。但如果你所在的城市限行，上牌不需要摇号等，还是...[详细]
同功率的电动汽车与燃油车相比谁的表现更好

同功率的电动机与内燃机，其扭矩大小是接近的。动力强需要高扭矩的支持，扭矩大小决定了一辆车加速快慢，也就是俗说的劲头大小。但是有时候同功率的电动机其扭矩并不会比内燃机高。例如比亚迪秦pro采用的电动机功率为110kw、最大扭矩为250Nm，而比亚迪秦pro采用的1.5T发动机，其最大功率为113kw，最大扭矩240牛米，可以说同功率的电机发动机扭矩也是接近的。又如大众1.4T发动机，最大功率...[详细]
纯电动汽车智能供电系统对我们生活的影响

纯电动汽车作为新能源汽车中的主推车型，近年来得到了国家的大力支持与鼓励，发展也是日新月异，对于纯电动汽车在我们之前的认知，它是一个需要进行充电才能够提供动力输出的一个庞大的耗电体，而在近期发布的车型不知道大家有没有发现，不管是北汽EX5、还是最新发布的几何A都增加了对外放电功能，纯电动汽车摇身一变成为了可充放电的智能移动终端，今天小编就带大家一起纯电动汽车的对外放电功能，看看它究竟会为我们带来哪...[详细]
STM32必学的时钟系统

相较于51单片机，stm32的时钟系统可以说是非常复杂了，我们现在看下面的一张图：上图说明了时钟的走向，是从左至右的从时钟源一步步的分配给外设时钟。需要注意的是，上图左侧一共有四个时钟源，从上到下依次是：高速内部时钟（HSI）：以内部RC振荡器产生，频率为8Mhz,但相较于外部时钟不稳定。高速内部时钟（HSE）：以外部晶振作为时钟源，晶振频率可取范围为4~16Mhz,一般采用8Mhz的...[详细]
工信部推动制定首个电器电子产品有害物质管控强制性国家标准

8 月 22 日消息，据工信部官网消息，近日，我国电器电子产品有害物质管控领域首个强制性国家标准《电器电子产品有害物质限制使用要求》（GB 26572—2025）经国家标准化管理委员会批准发布，将于 2027 年 8 月 1 日正式实施。该标准由工业和信息化部提出并归口管理，中国电子技术标准化研究院联合电器电子行业生产制造企业、认证检测机构、行业协会及科研院所等 60 余家单位共同研制。从官方...[详细]
电动汽车的轮胎真的是越大就越费电吗

轮胎对于汽车来说，是很重要的一个部件，关乎车辆的用车体验，我们在日常生活中和汽车几乎是分不开的对于轮胎来说，根据轮胎对于车辆在行车当中的作用来说，轮胎越大对于车辆的稳定性就越好，但是不足点就是车辆会导致车辆的对于车辆的在运转的过程当中加大轮胎与路面之间的阻力，而不管是纯电动汽车还是燃油车，都会有这种的影响，对于电动汽车来说，轮胎越大是费电的。首先从轮胎的结构上面来说，轮胎在结构上面，是由轮...[详细]
MCX E系列5V MCU发布：应对严苛环境，保障系统安全

MCX E系列是恩智浦丰富的MCX产品组合中最注重可靠性与安全性的系列。随着该系列的推出，恩智浦进一步丰富了其5V兼容的MCU产品线，为从3V到5V的设计提供一致的开发体验，帮助工程师在复杂环境中打造高可靠性的系统。随着边缘应用所处的环境日益严苛，对微控制器的韧性也提出了更高要求。MCX E系列应运而生，基于 Arm ® Cortex ® -M4F内核，专为在电气和热环境极端复杂的场景中...[详细]
高频开关整流器用功率管是啥

自20世纪70年代开关电源实现“20 kHz”的革命之后的一段时间内，虽然在电路技术方面进行了改进和提高，但局限于当时半导体器件工业的发展水平，作为开关电源主要部件的大功率开关管的主要参数均满足不了更高频率、更大功率开关电源的设计要求。高频开关整流器用功率管是什么自20世纪80年代以来大功率、高反压的绝缘栅场效应功率管问世之后，伴随着开关电源专用集成控制电路的应用，已逐步将开关电源的工作...[详细]
高精度电流传感器如何实现电压信号输出

随着科学技术的发展以及绿色节约循环发展方针的推进，精确控制，精准测量的需求越来越多。在电力行业，电流电压检测的技术要求越来越严格，精度要求越来越高，航智高精度电流传感器、电压传感器应运而生。航智传感器是基于磁通门技术的闭环传感器，具有高稳定度(温漂低、长期稳定性好)、高精度（可达10ppm）、高线性( 1ppm)等特点，可满足客户各种严苛需求，广泛应用于需要高精度测量电流电压的功率分析、高稳定电...[详细]
带你看看扫地机器人的内在

作为智能家居新概念的领跑者，扫地机器人已获得了较大的市场。扫地机器人，又称自动打扫机、智能吸尘、机器人吸尘器等，是智能家用电器的一种，能凭借一定的人工智能，自动在房间内完成地板清理工作。一般采用刷扫和真空方式，将地面杂物先吸纳进入自身的垃圾收纳盒，从而完成地面清理的功能。扫地机器人的功能： 1.每分钟5000转的旋转刷子，能够同时从4个方向清洁污垢； 2.使用镍氢(Ni-MH)电池或锂(Li)...[详细]
纳芯微推出三款用于 GaN、汽车和电池安全的芯片

纳芯微正在推出涵盖各种电源应用的器件，包括氮化镓 (GaN) 驱动器、双通道汽车驱动器和电池保护 MOSFET。随着各行各业的电源系统日益紧凑和复杂，工程师们不得不重新思考如何在高压、汽车和电池供电设计中管理效率、控制和保护。氮化镓技术有望实现更高的功率密度，汽车电子设备需要具有严格 EMC 限制的多电机控制，而锂电池系统的能量和电流需求也在迅速增长。挑战在于找到既能满足这些需求，又不会增...[详细]
逐点半导体携手真我为P4系列智能手机带来旗舰级视觉体验

AI分布式渲染架构提升手机渲染能力，游戏性能测试实时可查帧生成指标中国上海，2025年8月20日——专业的图像和显示处理方案提供商逐点半导体今日宣布，新发布的真我P4 5G、真我P4 Pro 5G智能手机搭载逐点半导体X7 Gen 2视觉处理器。该处理器通过集成的分布式渲染解决方案，可降低GPU算力负担，大幅提升手机渲染能力。这也是海外中端市场同级产品中，首个集成专业视觉处理器的智能手...[详细]

器件捷径: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多