Flash, 256KX8, 120ns, PDSO48, PLASTIC, TSOP1-48
| 参数名称 | 属性值 |
| 厂商名称 | SPANSION |
| 零件包装代码 | TSOP1 |
| 包装说明 | PLASTIC, TSOP1-48 |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| 其他特性 | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN |
| 启动块 | TOP |
| JESD-30 代码 | R-PDSO-G48 |
| 长度 | 18.4 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 类型 | NOR TYPE |
| 宽度 | 12 mm |
| MBM29LV200TC-12PFTN-E1 | MBM29LV200BC-12PFTN | MBM29LV200BC-12PFTN-E1 | MBM29LV200TC-12PFTR | MBM29LV200BC-12PFTR | 550222T450CF2B | MBM29LV200TC-12PFTN | MBM29LV200TC-12PFTR-E1 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | High Ripple, Long Life, Computer Grade | Flash, 256KX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 256KX8, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 |
| 厂商名称 | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | - | SPANSION | SPANSION |
| 零件包装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | - | TSOP1 | TSOP1 |
| 包装说明 | PLASTIC, TSOP1-48 | PLASTIC, TSOP1-48 | PLASTIC, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 | - | PLASTIC, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 |
| 针数 | 48 | 48 | 48 | 48 | 48 | - | 48 | 48 |
| Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | not_compliant | - | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | - | 120 ns | 120 ns |
| 其他特性 | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | - | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN | CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN |
| 启动块 | TOP | BOTTOM | BOTTOM | TOP | BOTTOM | - | TOP | TOP |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | - | R-PDSO-G48 | R-PDSO-G48 |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | - | 18.4 mm | 18.4 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | - | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | - | 3 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | - | 48 | 48 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | - | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | - | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | - | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1-R | TSOP1-R | - | TSOP1 | TSOP1-R |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | - | 240 | 260 |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | - | 30 | 40 |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE |
| 宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | - | 12 mm | 12 mm |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 符合 |
| JESD-609代码 | - | e0 | - | e0 | e0 | - | e0 | e3 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | MATTE TIN |
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