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HB28B320C8C: 产品描述160MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50; 产品类别存储存储; 文件大小283KB，共68页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HB28B320C8C概述

160MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50

HB28B320C8C规格参数

参数名称	属性值
厂商名称	Renesas(瑞萨电子)
零件包装代码	CARD
包装说明	CARD-50
针数	50
Reach Compliance Code	unknown
ECCN代码	3A991.B.1.A
最长访问时间	250 ns
其他特性	CAN ALSO OPERATE WITH 5V SUPPLY
JESD-30 代码	R-XXMA-X50
内存密度	2684354560 bit
内存集成电路类型	FLASH CARD
内存宽度	16
功能数量	1
端子数量	50
字数	167772160 words
字数代码	160000000
工作模式	ASYNCHRONOUS
最高工作温度	60 °C
最低工作温度
组织	160MX16
封装主体材料	UNSPECIFIED
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL
编程电压	3.3 V
认证状态	Not Qualified
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	UNSPECIFIED
端子位置	UNSPECIFIED
类型	NOR TYPE

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better

and more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corporation product best suited to the customer's application; they do not convey any

license under any intellectual property rights, or any other rights, belonging to Renesas Technology

Corporation or a third party.

2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any

third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corporation without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corporation

or an authorized Renesas Technology Corporation product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss

rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various

means, including the Renesas Technology Corporation Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams,

charts, programs, and algorithms, please be sure to evaluate all information as a total system before

making a final decision on the applicability of the information and products. Renesas Technology

Corporation assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor

when considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be

exported under a license from the Japanese government and cannot be imported into a country other

than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corporation for further details on these materials or the products

contained therein.

HB28B320C8C相似产品对比

	HB28B320C8C	HB28B128C8C	HB28B256C8C	HB28B064C8C	HB28B512C8C	HB28B192C8C	HB28B448C8C
描述	160MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	64MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	128MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	32MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	256MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	96MX16 FLASH 3.3V PROM CARD, 250ns, XMA50, CARD-50	224M X 16 FLASH 3.3V PROM CARD, 250 ns, XMA50, CARD-50
零件包装代码	CARD	CARD	CARD	CARD	CARD	CARD	CARD
包装说明	CARD-50	CARD-50	CARD-50	CARD-50	CARD-50	CARD-50	CARD-50
针数	50	50	50	50	50	50	50
Reach Compliance Code	unknown	compliant	unknown	compliant	compliant	unknown	compliant
ECCN代码	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
最长访问时间	250 ns	250 ns	250 ns	250 ns	250 ns	250 ns	250 ns
其他特性	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY
JESD-30 代码	R-XXMA-X50	R-XXMA-X50	R-XXMA-X50	R-XXMA-X50	R-XXMA-X50	R-XXMA-X50	R-XXMA-X50
内存密度	2684354560 bit	1073741824 bit	2147483648 bit	536870912 bit	4294967296 bit	1610612736 bit	3758096384 bit
内存集成电路类型	FLASH CARD	FLASH CARD	FLASH CARD	FLASH CARD	FLASH CARD	FLASH CARD	FLASH CARD
内存宽度	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1
端子数量	50	50	50	50	50	50	50
字数	167772160 words	67108864 words	134217728 words	33554432 words	268435456 words	100663296 words	234881024 words
字数代码	160000000	64000000	128000000	32000000	256000000	96000000	224000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	60 °C	60 °C	60 °C	60 °C	60 °C	60 °C	60 °C
组织	160MX16	64MX16	128MX16	32MX16	256MX16	96MX16	224MX16
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
编程电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
端子位置	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Base Number Matches	-	1	1	1	1	-	-

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