IC LED DISPLAY DRIVER, PDSO8, 3 X 3 MM, 0.80 MM HEIGHT, MSOP-8, Display Driver
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | MSOP |
包装说明 | HVSON, |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
接口集成电路类型 | LED DISPLAY DRIVER |
JESD-30 代码 | S-PDSO-N8 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
复用显示功能 | NO |
功能数量 | 1 |
区段数 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 | 7 V |
最小供电电压 | 2.5 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3 mm |
最小 fmax | 1.2 MHz |
CAT37RD4-TE13 | CAT37TDI | CAT37EKK-TE7 | CAT37EKK | |
---|---|---|---|---|
描述 | IC LED DISPLAY DRIVER, PDSO8, 3 X 3 MM, 0.80 MM HEIGHT, MSOP-8, Display Driver | LED DISPLAY DRIVER, PDSO5, 1 MM HEIGHT, LEAD FREE, SOT-23, 5 PIN | LED DISPLAY DRIVER, PDSO5, 1 MM HEIGHT, SOT-23, 5 PIN | LED DISPLAY DRIVER, PDSO5, SOT-23, 5 PIN |
是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
零件包装代码 | MSOP | SOT-23 | SOT-23 | SOT-23 |
包装说明 | HVSON, | VSSOP, | 1 MM HEIGHT, SOT-23, 5 PIN | SOT-23, 5 PIN |
针数 | 8 | 5 | 5 | 5 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
接口集成电路类型 | LED DISPLAY DRIVER | LED DISPLAY DRIVER | LED DISPLAY DRIVER | LED DISPLAY DRIVER |
JESD-30 代码 | S-PDSO-N8 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
JESD-609代码 | e0 | e3 | e0 | e0 |
长度 | 3 mm | 2.9 mm | 2.9 mm | 2.9 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
复用显示功能 | NO | NO | NO | NO |
功能数量 | 1 | 1 | 1 | 1 |
区段数 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 5 | 5 | 5 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | VSSOP | VSSOP | VSSOP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 260 | 240 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 1 mm | 1 mm | 1 mm |
最大供电电压 | 7 V | 7 V | 7 V | 7 V |
最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.95 mm | 0.95 mm | 0.95 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 30 |
宽度 | 3 mm | 1.625 mm | 1.625 mm | 1.625 mm |
最小 fmax | 1.2 MHz | - | 1.2 MHz | 1.2 MHz |
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