Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDIP28, PLASTIC, DIP-28
参数名称 | 属性值 |
厂商名称 | Rochester Electronics |
包装说明 | DIP, |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-PDIP-T28 |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 28 |
标称断态隔离度 | 55 dB |
通态电阻匹配规范 | 16.2 Ω |
最大通态电阻 (Ron) | 450 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
最长断开时间 | 1000 ns |
最长接通时间 | 1000 ns |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
DG527CJ | DG528BK | DG526AK/883B | DG527CY | DG529CY | DG526BK | DG526AK | |
---|---|---|---|---|---|---|---|
描述 | Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDIP28, PLASTIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP18, CERAMIC, DIP-18 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, CERAMIC, DIP-28 | Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDSO28, SOIC-28 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDSO18, SOIC-18 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, CERAMIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, CERAMIC, DIP-28 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
包装说明 | DIP, | DIP, | DIP, | SOP, | SOP, | DIP, | DIP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDIP-T28 | R-GDIP-T18 | R-GDIP-T28 | R-PDSO-G28 | R-PDSO-G18 | R-GDIP-T28 | R-GDIP-T28 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | 8 | 8 | 16 | 8 | 4 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 18 | 28 | 28 | 18 | 28 | 28 |
标称断态隔离度 | 55 dB | 68 dB | 55 dB | 55 dB | 68 dB | 55 dB | 55 dB |
通态电阻匹配规范 | 16.2 Ω | 16.2 Ω | 16.2 Ω | 16.2 Ω | 16.2 Ω | 16.2 Ω | 16.2 Ω |
最大通态电阻 (Ron) | 450 Ω | 450 Ω | 400 Ω | 450 Ω | 450 Ω | 450 Ω | 400 Ω |
最高工作温度 | 70 °C | 85 °C | 125 °C | 70 °C | 70 °C | 85 °C | 125 °C |
最低工作温度 | - | -25 °C | -55 °C | - | - | -25 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | SOP | SOP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | OTHER | MILITARY | COMMERCIAL | COMMERCIAL | OTHER | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
最长断开时间 | 1000 ns | - | 1000 ns | - | - | 1000 ns | 1000 ns |
最长接通时间 | 1000 ns | - | 1500 ns | - | - | 1000 ns | 1500 ns |
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