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CY7C199-20PXC

产品描述32KX8 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, MO-095, DIP-28
产品类别存储    存储   
文件大小999KB,共12页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
下载文档 详细参数 选型对比 全文预览

CY7C199-20PXC概述

32KX8 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, MO-095, DIP-28

CY7C199-20PXC规格参数

参数名称属性值
厂商名称Rochester Electronics
零件包装代码DIP
包装说明0.300 INCH, LEAD FREE, PLASTIC, MO-095, DIP-28
针数28
Reach Compliance Codeunknown
最长访问时间20 ns
JESD-30 代码R-PDIP-T28
长度34.67 mm
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度8
功能数量1
端子数量28
字数32768 words
字数代码32000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
认证状态COMMERCIAL
座面最大高度4.82 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层NOT SPECIFIED
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm

CY7C199-20PXC文档预览

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CY7C199
32K x 8 Static RAM
Features
• High speed
— 12 ns
• Fast t
DOE
• CMOS for optimum speed/power
• Low active power
— 495 mW (Max, “L” version)
• Low standby power
— 0.275 mW (Max, “L” version)
• 2V data retention (“L” version only)
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• Available in pb-free 28-pin TSOP I and 28-pin (300-Mil)
Molded DIP
Functional Description
The CY7C199 is a high-performance CMOS static RAM
organized as 32,768 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE) and active
LOW Output Enable (OE) and tri-state drivers. This device has
an automatic power-down feature, reducing the power
consumption by 81% when deselected. The CY7C199 is in the
standard 300-mil-wide DIP, SOJ, and LCC packages.
An active LOW Write Enable signal (WE) controls the
writing/reading operation of the memory. When CE and WE
inputs are both LOW, data on the eight data input/output pins
(I/O
0
through I/O
7
) is written into the memory location
addressed by the address present on the address pins (A
0
through A
14
). Reading the device is accomplished by selecting
the device and enabling the outputs, CE and OE active LOW,
while WE remains inactive or HIGH. Under these conditions,
the contents of the location addressed by the information on
address pins are present on the eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and Write Enable
(WE) is HIGH. A die coat is used to improve alpha immunity.
Pin Configurations
DIP
Top View
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
I/O
0
I/O
1
I/O
2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
A
4
A
3
A
2
A
1
OE
A
0
CE
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
21
20
19
18
17
16
15
14
13
12
11
10
9
8
Logic Block Diagram
I/O
0
INPUT BUFFER
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
CE
WE
OE
I/O
1
ROW DECODER
I/O
2
SENSE AMPS
32K x 8
ARRAY
I/O
3
I/O
4
I/O
5
COLUMN
DECODER
POWER
DOWN
I/O
6
I/O
7
A
10
A
12
A
13
A
11
Selection Guide
Maximum Access Time
Maximum Operating Current
L
Maximum CMOS Standby Current
L
10
–12
12
160
–15
15
155
90
10
0.05
–20
20
150
10
Unit
ns
mA
mA
A
14
OE
A
1
A
2
A
3
A
4
WE
V
CC
A
5
A
6
A
7
A
8
A
9
A
10
A
11
22
23
24
25
26
27
28
1
2
3
4
5
6
7
TSOP I
Top View
(not to scale)
A
0
CE
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A
14
A
13
A
12
Cypress Semiconductor Corporation
Document #: 38-05160 Rev. *B
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised August 3, 2006
CY7C199
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground Potential
(Pin 28 to Pin 14) ........................................... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High-Z State
[1]
....................................–0.5V to V
CC
+ 0.5V
DC Input Voltage
[1]
................................ –0.5V to V
CC
+ 0.5V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Range
Commercial
Ambient Temperature
[2]
0
°
C to +70
°
C
V
CC
5V
±
10%
Electrical Characteristics
Over the Operating Range
[3]
-12
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage Current
GND < V
I
< V
CC
Output Leakage Current GND < V
O
< V
CC
, Output
Disabled
V
CC
Operating Supply
Current
Automatic CE
Power-down Current—
TTL Inputs
Automatic CE
Power-down Current—
CMOS Inputs
V
CC
= Max.,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
Com’l
L
30
Test Conditions
V
CC
= Min., I
OH
=–4.0 mA
V
CC
= Min., I
OL
=8.0 mA
2.2
–0.5
–5
–5
Min.
2.4
0.4
V
CC
+
0.3V
0.8
+5
+5
160
2.2
–0.5
–5
–5
Max.
Min.
2.4
0.4
V
CC
+
0.3V
0.8
+5
+5
155
90
30
5
10
10
0.05
10
30
2.2
–0.5
–5
–5
-15
Max.
Min.
2.4
0.4
V
CC
+
0.3V
0.8
+5
+5
150
-20
Max.
Unit
V
V
V
V
µA
µA
mA
mA
mA
mA
mA
mA
I
SB1
Max. V
CC
, CE > V
IH
, Com’l
V
IN
> V
IH
or
L
V
IN
< V
IL
, f = f
MAX
Max. V
CC
,
Com’l
CE > V
CC
– 0.3V L
V
IN
> V
CC
– 0.3V
or V
IN
< 0.3V, f = 0
I
SB2
Notes:
1. V
IL
(min.) = –2.0V for pulse durations of less than 20 ns.
2. T
A
is the “instant on” case temperature.
3. See the last page of this specification for Group A subgroup testing information.
Document #: 38-05160 Rev. *B
Page 2 of 11
CY7C199
Capacitance
[4]
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
CC
= 5.0V
Max.
8
8
Unit
pF
pF
AC Test Loads and Waveforms
[5]
R1 481Ω
5V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Equivalent to:
R2
255
5V
OUTPUT
5 pF
INCLUDING
JIG AND
SCOPE
R2
255Ω
3.0V
10%
GND
≤t
r
R1 481Ω
ALL INPUT PULSES
90%
90%
10%
≤t
r
(a)
(b)
THÉVENIN EQUIVALENT
167
1.73V
OUTPUT
Data Retention Characteristics
Over the Operating Range (L-version only)
Parameter
V
DR
I
CCDR
t
CDR[4]
t
R [5]
Description
V
CC
for Data Retention
Data Retention Current
V
CC
= V
DR
= 2.0V,
CE > V
CC
– 0.3V,
Chip Deselect to Data Retention Time V > V – 0.3V or V < 0.3V
IN
CC
IN
Operation Recovery Time
Conditions
[6]
Min.
2.0
10
0
200
Max.
Unit
V
µA
ns
µs
Data Retention Waveform
DATA RETENTION MODE
V
CC
3.0V
t
CDR
CE
Notes:
4. Tested initially and after any design or process changes that may affect these parameters.
5. t
R
< 3 ns for the -12 and the -15 speeds. t
R
< 5 ns for the -20 and slower speeds.
6. No input may exceed V
CC
+ 0.5V.
V
DR
> 2V
3.0V
t
R
Document #: 38-05160 Rev. *B
Page 3 of 11
CY7C199
Switching Characteristics
Over the Operating Range
[3,7]
-12
Parameter
Read Cycle
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU
t
PD
Write Cycle
[10, 11]
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
HZWE
t
LZWE
Write Cycle Time
CE LOW to Write End
Address Set-up to Write End
Address Hold from Write End
Address Set-up to Write Start
WE Pulse Width
Data Set-up to Write End
Data Hold from Write End
WE LOW to High-Z
[9]
WE HIGH to Low-Z
[8]
3
12
9
9
0
0
8
8
0
7
3
15
10
10
0
0
9
9
0
7
3
20
15
15
0
0
15
10
0
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to
Low-Z
[8]
0
5
3
5
0
12
0
15
3
7
0
20
OE HIGH to High-Z
[8, 9]
CE LOW to Low-Z
[8]
CE HIGH to High-Z
[8, 9]
CE LOW to Power-up
CE HIGH to Power-down
3
12
5
0
7
3
9
12
12
3
15
7
0
9
15
15
3
20
9
20
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Description
Min.
Max.
Min.
-15
Max.
Min.
-20
Max.
Unit
Notes:
7. Test conditions assume signal transition time of 3 ns or less for -12 and -15 speeds and 5 ns or less for -20 and slower speeds, timing reference levels of 1.5V,
input pulse levels of 0 to 3.0V, and output loading of the specified I
OL
/I
OH
and 30-pF load capacitance.
8. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
9. t
HZOE
, t
HZCE
, and t
HZWE
are specified with C
L
= 5 pF as in part (b) of AC Test Loads. Transition is measured
±500
mV from steady-state voltage.
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a
write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
11. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of t
HZWE
and t
SD
.
Document #: 38-05160 Rev. *B
Page 4 of 11

CY7C199-20PXC相似产品对比

CY7C199-20PXC CY7C199-15ZXC
描述 32KX8 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, MO-095, DIP-28 32KX8 STANDARD SRAM, 15ns, PDSO28, 8 X 13.40 MM, LEAD FREE, TSOP1-28
厂商名称 Rochester Electronics Rochester Electronics
零件包装代码 DIP TSOP
包装说明 0.300 INCH, LEAD FREE, PLASTIC, MO-095, DIP-28 8 X 13.40 MM, LEAD FREE, TSOP1-28
针数 28 28
Reach Compliance Code unknown unknown
最长访问时间 20 ns 15 ns
JESD-30 代码 R-PDIP-T28 R-PDSO-G28
长度 34.67 mm 11.8 mm
内存密度 262144 bit 262144 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM
内存宽度 8 8
功能数量 1 1
端子数量 28 28
字数 32768 words 32768 words
字数代码 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 32KX8 32KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSOP1
封装形状 RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
认证状态 COMMERCIAL COMMERCIAL
座面最大高度 4.82 mm 1.02 mm
最大供电电压 (Vsup) 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V
表面贴装 NO YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子形式 THROUGH-HOLE GULL WING
端子节距 2.54 mm 0.55 mm
端子位置 DUAL DUAL
宽度 7.62 mm 8 mm
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