Bus Driver/Transceiver, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Mitsubishi(日本三菱) |
包装说明 | SOP, SOP20,.4 |
Reach Compliance Code | unknown |
控制类型 | COMMON CONTROL |
计数方向 | BIDIRECTIONAL |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
最大I(ol) | 0.024 A |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 2/6 V |
Prop。Delay @ Nom-Sup | 21 ns |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
翻译 | N/A |
M74HC640-1DWP | M74HC640FP | M74HC640DWP | M74HC640P | |
---|---|---|---|---|
描述 | Bus Driver/Transceiver, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20 | Bus Driver/Transceiver, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20 | Bus Driver/Transceiver, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20 | Bus Driver/Transceiver, 1-Func, 8-Bit, Inverted Output, CMOS, PDIP20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
包装说明 | SOP, SOP20,.4 | SOP, SOP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 |
最大I(ol) | 0.024 A | 0.006 A | 0.006 A | 0.006 A |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | DIP |
封装等效代码 | SOP20,.4 | SOP20,.3 | SOP20,.4 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 21 ns | 28 ns | 28 ns | 28 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
翻译 | N/A | N/A | N/A | N/A |
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