ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, CDIP16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | DIP |
| 包装说明 | , |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | 0.5 V |
| 最长转换时间 | 0.04 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 1.5625% |
| 模拟输入通道数量 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 4 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 采样速率 | 25 MHz |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |





| CA3304D | CA3304AE | CA3304AM | CA3304E | CA3304M | CA3304M96 | |
|---|---|---|---|---|---|---|
| 描述 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, CDIP16 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, PDIP16 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, PDSO16 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, PDIP16 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, PDSO16 | ADC, Flash Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, CMOS, PDSO16, SOIC-16 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | DIP | DIP | SOIC | DIP | SOIC | SOIC |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最小模拟输入电压 | 0.5 V | 0.5 V | 0.5 V | 0.5 V | 0.5 V | 0.5 V |
| 最长转换时间 | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs | 0.04 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| 最大线性误差 (EL) | 1.5625% | 0.7812% | 0.7812% | 1.5625% | 1.5625% | 1.5625% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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