K4S283233F - F(H)E/N/G/C/L/F
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
FEATURES
• 3.0V & 3.3V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation.
• Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
• DQM for masking.
• Auto refresh.
•
•
•
•
64ms refresh period (4K cycle).
Commercial Temperature Operation (-25°C ~ 70°C).
Extended Temperature Operation (-25°C ~ 85°C).
90Balls FBGA with 0.8mm ball pitch
( -FXXX : Leaded, -HXXX : Lead Free).
Mobile-SDRAM
GENERAL DESCRIPTION
The K4S283233F is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 1,048,576 words by 32 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
ORDERING INFORMATION
Part No.
K4S283233F-F(H)E/N/G/C/L/F60
K4S283233F-F(H)E/N/G/C/L/F75
K4S283233F-F(H)E/N/G/C/L/F1H
K4S283233F-F(H)E/N/G/C/L/F1L
Max Freq.
166MHz(CL=3)
133MHz(CL=3)
105MHz(CL=2)
105MHz(CL=3)
*1
LVCMOS
90 FBGA
Leaded (Lead Free)
Interface
Package
- F(H)E/N/G : Normal / Low/ Low Power, Extended Temperature(-25°C ~ 85°C)
- F(H)C/L/F : Normal / Low / Low Power, Commercial Temperature(-25°C ~ 70°C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
February 2004
K4S283233F - F(H)E/N/G/C/L/F
FUNCTIONAL BLOCK DIAGRAM
Mobile-SDRAM
I/O Control
LWE
Data Input Register
Bank Select
LDQM
1M x 32
Sense AMP
1M x 32
1M x 32
1M x 32
Refresh Counter
Output Buffer
Row Decoder
Row Buffer
DQi
Address Register
LRAS
CLK
CKE
CLK
ADD
Column Decoder
Col. Buffer
LRAS
LCBR
Latency & Burst Length
LCKE
LCBR
LWE
LCAS
Programming Register
LWCBR
LDQM
Timing Register
CS
RAS
CAS
WE
DQM
February 2004
K4S283233F - F(H)E/N/G/C/L/F
Package Dimension and Pin Configuration
< Bottom View
*1
>
E
1
9
A
B
C
D
D
E
F
G
D
1
H
J
K
D/2
L
M
N
P
R
E
E/2
Pin Name
CLK
CS
A
A1
Substrate(2Layer)
Mobile-SDRAM
< Top View
*2
>
90Ball(6x15) FBGA
8
7
6
5
4
3
2
1
e
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
DQ26
DQ28
V
SSQ
V
SSQ
V
DDQ
V
SS
A4
A7
CLK
DQM1
V
DDQ
V
SSQ
V
SSQ
DQ11
DQ13
2
DQ24
V
DDQ
DQ27
DQ29
DQ31
DQM3
A5
A8
CKE
NC
DQ8
DQ10
DQ12
V
DDQ
DQ15
3
V
SS
V
SSQ
DQ25
DQ30
NC
A3
A6
NC
A9
NC
V
SS
DQ9
DQ14
V
SSQ
V
SS
7
V
DD
V
DDQ
DQ22
DQ17
NC
A2
A10
NC
BA0
CAS
V
DD
DQ6
DQ1
V
DDQ
V
DD
8
DQ23
V
SSQ
DQ20
DQ18
DQ16
DQM2
A0
BA1
CS
WE
DQ7
DQ5
DQ3
V
SSQ
DQ0
9
DQ21
DQ19
V
DDQ
V
DDQ
V
SSQ
V
DD
A1
A11
RAS
DQM0
V
SSQ
V
DDQ
V
DDQ
DQ4
DQ2
Pin Function
System Clock
Chip Select
Clock Enable
Address
Bank Select Address
Row Address Strobe
Column Address Strobe
Write Enable
Data Input/Output Mask
Data Input/Output
Power Supply/Ground
Data Output Power/Ground
[Unit:mm]
CKE
A
0
~ A
11
BA
0
~ BA
1
RAS
CAS
WE
DQM
0
~ DQM
3
DQ
0
~
31
b
z
< Top View
*2
>
#A1 Ball Origin Indicator
SAMSUNG
Week
V
DD
/V
SS
V
DDQ
/V
SSQ
K4S283233F-XXXX
Symbol
A
A
1
E
E
1
D
D
1
e
b
z
Min
-
0.30
-
-
-
-
-
0.40
-
Typ
1.10
0.35
8.00
6.40
13.00
11.20
0.80
0.45
-
Max
1.20
0.40
-
-
-
-
-
0.50
0.10
February 2004
K4S283233F - F(H)E/N/G/C/L/F
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to V
ss
Voltage on V
DD
supply relative to V
ss
Storage temperature
Power dissipation
Short circuit current
Symbol
V
IN
, V
OUT
V
DD
, V
DDQ
T
STG
P
D
I
OS
Value
-1.0 ~ 4.6
-1.0 ~ 4.6
Mobile-SDRAM
Unit
V
V
°C
W
mA
-55 ~ +150
1.0
50
NOTES:
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to V
SS
= 0V, T
A
= -25 to 85°C for Extended, -25 to 70°C for Commercial)
Parameter
Supply voltage
V
DDQ
Input logic high voltage
Input logic low voltage
Output logic high voltage
Output logic low voltage
Input leakage current
V
IH
V
IL
V
OH
V
OL
I
LI
2.7
2.2
-0.3
2.4
-
-10
3.0
3.0
0
-
-
-
3.6
V
DDQ
+ 0.3
0.5
-
0.4
10
V
V
V
V
V
uA
1
2
I
OH
= -2mA
I
OL
= 2mA
3
Symbol
V
DD
Min
2.7
Typ
3.0
Max
3.6
Unit
V
Note
NOTES :
1. VIH (max) = 5.3V AC.The overshoot voltage duration is
≤
3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is
≤
3ns.
3. Any input 0V
≤
VIN
≤
VDDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with tri-state outputs.
4. Dout is disabled, 0V
≤
VOUT
≤
VDDQ.
CAPACITANCE
(V
DD
= 3.0V & 3.3V, T
A
= 23°C, f = 1MHz, V
REF
=0.9V
±
50 mV)
Pin
Clock
RAS, CAS, WE, CS, CKE
DQM
Address
DQ
0
~ DQ
31
Symbol
C
CLK
C
IN
C
IN
C
ADD
C
OUT
Min
-
-
-
-
-
Max
4.0
4.0
4.0
4.0
6.0
Unit
pF
pF
pF
pF
pF
Note
February 2004
K4S283233F - F(H)E/N/G/C/L/F
DC CHARACTERISTICS
Mobile-SDRAM
Recommended operating conditions (Voltage referenced to V
SS
= 0V, T
A
= -25 to 85°C for Extended, -25 to 70°C for Commercial)
Version
Parameter
Symbol
Test Condition
-60
Operating Current
(One Bank Active)
Precharge Standby Current
in power-down mode
Burst length = 1
t
RC
≥
t
RC
(min)
I
O
= 0 mA
CKE
≤
V
IL
(max), t
CC
= 10ns
-75
-1H
-1L
Unit
Note
I
CC1
100
85
85
80
mA
1
I
CC2
P
0.5
mA
0.5
16
mA
8
5
mA
5
26
mA
I
CC2
PS CKE & CLK
≤
V
IL
(max), t
CC
=
∞
I
CC2
N
CKE
≥
V
IH
(min), CS
≥
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during
20ns
CKE
≥
V
IH
(min), CLK
≤
V
IL
(max), t
CC
=
∞
Input signals are stable
CKE
≤
V
IL
(max), t
CC
= 10ns
Precharge Standby Current
in non power-down mode
I
CC2
NS
Active Standby Current
in power-down mode
I
CC3
P
I
CC3
PS CKE & CLK
≤
V
IL
(max), t
CC
=
∞
I
CC3
N
CKE
≥
V
IH
(min), CS
≥
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during
20ns
CKE
≥
V
IH
(min), CLK
≤
V
IL
(max), t
CC
=
∞
Input signals are stable
I
O
= 0 mA
Page burst
4Banks Activated
t
CCD
= 2CLKs
t
RC
≥
t
RC
(min)
-E/C
-N/L
Active Standby Current
in non power-down mode
(One Bank Active)
I
CC3
NS
22
mA
Operating Current
(Burst Mode)
I
CC
4
110
85
80
80
mA
1
Refresh Current
I
CC
5
180
160
150
130
mA
uA
2
4
5
1500
800
Max 40
500
460
440
Max 85/70
800
650
550
uA
°C
Self Refresh Current
I
CC
6
CKE
≤
0.2V
-G/F
Internal TCSR
Full Array
1/2 of Full Array
1/4 of Full Array
3
6
NOTES:
1. Measured with outputs open.
2. Refresh period is 64ms.
3. Internal TCSR can be supported.
In commercial Temp : Max 40°C/Max 70°C, In extended Temp : Max 40°C/Max 85°C
4. K4S283233F-F(H)E/C**
5. K4S283233F-F(H)N/L**
6. K4S283233F-F(H)G/F**
7. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ).
February 2004
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