D a t a S he et , V 1. 1, J u l y 2 00 3
HYS[64/72]D64x20GU-x-B
HYS[64/72]D32x00[G/E]U-x-B
HYS64D16301GU-x-B
1 8 4 - P i n U n b u f f er e d D u a l - I n- L i n e M e m o r y M o d u l es
U D IM M
DDR SDRAM
M e m or y P r o du c t s
N e v e r
s t o p
t h i n k i n g .
Edition 2003-07
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
©
Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
D a t a S he et , V 1. 1, J u l y 2 00 3
HYS[64/72]D64x20GU-x-B
HYS[64/72]D32x00[G/E]U-x-B
HYS64D16301GU-x-B
1 8 4 - P i n U n b u f f er e d D u a l - I n- L i n e M e m o r y M o d u l es
U D IM M
DDR SDRAM
M e m or y P r o du c t s
N e v e r
s t o p
t h i n k i n g .
HYS[64/72]D64x20GU-x-B, HYS[64/72]D32x00[G/E]U-x-B, HYS64D16301GU-x-B
Revision History:
Previous Version:
Page
all
all
10
19ff
20ff
24f
26f
29ff
41ff
8
9
44ff
V1.1
V1.01
2003-07
2003-01
Subjects (major changes since last revision)
new data sheet template
replace bank by rank if DIMM related (4 bank SDRAM on 1 or 2 rank DIMM)
Table 6:
Address Table updated
Table 10ff:
IDD conditions now in seperate table
Table 11ff:
added part numbers to IDD tables
Table 15:
split in two tables (now 15 & 16)
Table 16:
add –5 (DDR400)
Chapter 4:
added part numbers to SPD tables
Table 21:
set Bytes 47-55 to not used (00hex); set byte 62 to SPD rev. 0.0 (00hex); update
Checksum (TPCR)
Table 4:
Changed RAS/CAS/WE description to command inputs and amended CLK to CK
Table 5:
Changed CLK to CK
Figure 7
-
Figure 13
Amended and updated package outline drawings
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
techdoc.mp@infineon.com
Template: mp_a4_v2.0_2003-06-06.fm
HYS[64/72]D[16x01/32x00/64x20][G/E]U-[5/6/7/8]-B
Unbuffered DDR SDRAM Modules
Table of Contents
1
1.1
1.2
2
3
3.1
3.2
3.3
4
5
Overview
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configuration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Conditions and Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
17
19
24
SPD Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Package Outlines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Data Sheet
5
V1.1, 2003-07
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