BZT52C2V4S
THRU
BZT52C43S
Technical Data
Data Sheet N1449, Rev. B
BZT52C2V4S-BZT52C43S
ZENER DIODES
Features
Planar Die Construction
200mW Power Dissipation
General purpose, medium current
Ideally suited for automated assembly processes
Available in lead free version
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon
request
SOD-323
Schematic & Pin Configuration
Mechanical Characteristics
Case: SOD-323, Molded plastic
Terminals: Plated Leads Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Weight: 0.04 grams(approx)
Maximum Ratings
@T
A
=25°C unless otherwise specified
Characteristic
Forward Voltage (Note 2) @ I
F
= 10mA
Power Dissipation (Note 1)
Thermal Resistance from Junction to Ambient
Junction Temperature
Storage Temperature Range
Symbol
V
F
P
D
R
ΘJA
T
J
T
STG
Value
0.9
200
625
150
-55 to +150
Units
V
mW
C/W
C
C
Ordering Information
Device
BZT52C2V4S-
BZT52C43S
Marking Diagram
Shipping
3000pcs / reel
Package
SOD-323
(Pb-Free)
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
WX
= Marking Code
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BZT52C2V4S
THRU
BZT52C43S
Technical Data
Data Sheet N1449, Rev. B
Electrical Characteristics
@T
A
=25°C unless otherwise specified
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 .
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1kHz.
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BZT52C2V4S
THRU
BZT52C43S
Technical Data
Data Sheet N1449, Rev. B
Ratings and Characteristics Curves
China - Germany - Korea - Singapore - United States
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BZT52C2V4S
THRU
BZT52C43S
Technical Data
Data Sheet N1449, Rev. B
Mechanical Dimensions SOD-323
SYMBOL
A
A1
A2
b
c
D
E
E1
L
L1
θ
Millimeters
MIN.
-
0.000
0.800
0.250
0.080
MAX.
1.000
0.100
0.900
0.350
0.150
Inches
MIN.
-
0.000
0.031
0.010
0.003
MAX.
0.039
0.004
0.035
0.014
0.006
1.200
1.400
1.600
1.800
2.500
2.700
0.475 REF.
0.250
0.400
0°
8°
0.047
0.055
0.063
0.071
0.098
0.106
0.019 REF.
0.010
0.016
0°
8°
SOD-323 Suggested Pad Layout
Carrier Tape Specification SOD-323
SYMBOL
B
C
d
E
F
P
P0
P1
W
Millimeters
Min.
Max.
2.85
1.20
1.40
1.65
3.40
3.90
3.90
1.90
7.90
2.95
1.30
1.60
1.85
3.60
4.10
4.10
2.10
8.30
China - Germany - Korea - Singapore - United States
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BZT52C2V4S
THRU
BZT52C43S
Technical Data
Data Sheet N1449, Rev. B
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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