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IT
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AVAILA
Low-Power LCD Microcontroller
General Description
Features
♦
High-Performance, Low-Power, 16-Bit RISC Core
DC to 20MHz Operation, Approaching 1MIPS per MHz
Dual 1.8V Core/3V I/O Enables Low Power/Flexible
Interfacing
33 Instructions, Most Single Cycle
Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
16-Level Hardware Stack
16-Bit Instruction Word, 16-Bit Data Bus
16 x 16-Bit, General-Purpose Working Registers
Optimized for C-Compiler (High-Speed/Density Code)
♦
Program and Data Memory
32kWords Flash Memory, Mask ROM for High-
Volume Applications
10,000 Flash Write/Erase Cycles
1kWord of Internal Data RAM
JTAG/Serial Boot Loader for Programming
♦
Peripheral Features
Up to 50 General-Purpose I/O Pins
100/132 Segment LCD Driver
Up to 4 COM and 36 Segments
Static, 1/2, and 1/3 LCD Bias Supported
No External Resistors Required
SPI
TM
and 1-Wire
®
(-RAX/-RAX+/-RFX/-RFX+ Only)
Hardware I/O Ports
One or Two Serial UARTs
One-Cycle, 16 x 16 Hardware Multiply/Accumulate
with 48-Bit Accumulator
Three 16-Bit Programmable Timers/Counters
8-Bit, Subsecond, System Timer/Alarm
32-Bit, Binary Real-Time Clock with Time-of-Day Alarm
Programmable Watchdog Timer
♦
Flexible Programming Interface
Bootloader Simplifies Programming
In-System Programming Through JTAG
Supports In-Application Programming of Flash Memory
♦
Ultra-Low-Power Consumption
190µA typ at 8MHz Flash Operation, PMM1 at 2.2V
700nA typ in Lowest Power Stop Mode
Low-Power 32kHz Mode and Divide-by-256 Mode
MAXQ2000
The MAXQ2000 microcontroller is a low-power, 16-bit
device that incorporates a liquid-crystal display (LCD)
interface that can drive up to 100 (-RBX/-RBX+) or 132
(-RAX/-RAX+/-RFX/-RFX+) segments. The MAXQ2000
is uniquely suited for the blood-glucose monitoring mar-
ket, but can be used in any application that requires
high performance and low-power operation. The device
can operate at a maximum of either 14MHz (V
DD
>
1.8V) or 20MHz (V
DD
> 2.25V). The MAXQ2000 has
32kWords of flash memory, 1kWord of RAM, three 16-
bit timers, and one or two universal synchronous/asyn-
chronous receiver/transmitters (UARTs). Flash memory
aids prototyping and low-volume production. The
microcontroller core is powered by a 1.8V supply, with
a separate I/O supply for optimum flexibility. An ultra-
low-power sleep mode makes these parts ideal for bat-
tery-powered, portable equipment.
Applications
Medical Instrumentation
Battery-Powered and Portable Devices
Electrochemical and Optical Sensors
Industrial Control
Data-Acquisition Systems and Data Loggers
Home Appliances
Consumer Electronics
Thermostats/Humidity Sensors
Security Sensors
Gas and Chemical Sensors
HVAC
Smart Transmitters
Typical Operating Circuit, Pin Configurations, and
Ordering Information appear at end of data sheet.
MAXQ is a registered trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
1-Wire is a registered trademark of Dallas Semiconductor Corp.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of
any device may be simultaneously available through various sales channels. For information about device errata, go to:
www.maxim-ic.com/errata.
______________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Low-Power LCD Microcontroller
MAXQ2000
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to
Ground Except V
DD .................................
-0.5V to (V
DDIO
+ 0.5)V
Voltage Range on V
DD
Relative to Ground .........-0.5V to +2.75V
Voltage Range on V
DDIO
Relative to Ground........-0.5V to +3.6V
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature ....................See IPC/JEDEC J-STD-020
.................................................................................Specification
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= V
DD(MIN)
to V
DD(MAX)
, V
DDIO
= 2.7V to 3.6V, T
A
= -40°C to +85°C.) (Note 1)
PARAMETER
Core Supply Voltage
I/O Supply Voltage
SYMBOL
V
DD
V
DDIO
I
DD1
I
DD2
Active Current,
f
HFIN
= 14MHz
(Note 2)
I
DD3
I
DD4
I
DD5
I
DD6
I
DD1
I
DD2
Active Current,
f
HFIN
= 20MHz
(Note 2)
I
DD3
I
DD4
I
DD5
I
DD6
/1 mode
/2 mode
/4 mode
/8 mode
PMM1 mode
PMM2 mode;
32KIN = 32.768kHz
/1 mode
/2 mode
/4 mode
/8 mode
PMM1 mode
PMM2 mode;
32KIN = 32.768kHz
Rev A2
Rev A3
Rev A2
Rev A3
32k x 16 flash
Flash programming
CONDITIONS
MIN
1.8
2.25
V
DD
6.0
5.6
3.4
1.9
0.5
4.8
0.1
6.5
5.9
3.8
2.2
0.6
4.8
0.1
5.1
0.85
0.19
0.30
0.14
0.7
20
1
0.8 x
V
DDIO
55
550
50
V
DDIO
µA
µA
V
mA
TYP
2.5
2.5
MAX
2.75
2.75
3.6
9.2
8.6
5.1
2.9
0.7
7.6
0.95
10.4
9.6
6.2
3.8
1.4
7.6
0.95
mA
mA
UNITS
V
V
Execution from flash memory, 20MHz,
V
DD
= 2.2V, T
A
= +25°C
Execution from flash memory, 8MHz,
/8 mode, V
DD
= 2.2V, T
A
= +25°C
Active Current
Execution from flash memory, 8MHz,
PMM1 mode, V
DD
= 2.2V, T
A
= +25°C
Execution from RAM, 8MHz,
/8 mode, V
DD
= 2.2V, T
A
= +25°C
Execution from RAM, 1MHz,
/1 mode, V
DD
= 2.2V, T
A
= +25°C
Stop-Mode Current
Digital I/O Supply Current
Input High Voltage:
HFIN and 32KIN
I
STOP(VDD)
I
DDIO
V
IH1
-40°C < T
A
< +25°C
T
A
= +85°C
RTC enabled; HFIN
≥
14MHz;
all I/O disconnected
2
_____________________________________________________________________
Low-Power LCD Microcontroller
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= V
DD(MIN)
to V
DD(MAX)
, V
DDIO
= 2.7V to 3.6V, T
A
= -40°C to +85°C.) (Note 1)
PARAMETER
Input High Voltage:
P6.4–P6.5 and P7.0–P7.1
Input High Voltage:
All Other Pins
Input Low Voltage:
HFIN and 32KIN
Input Low Voltage:
All Other Pins
Output High Voltage:
P6.4–P6.5 and P7.0–P7.1
Output High Voltage:
All Other Pins
Output Low Voltage for
All Other Pins
Output Low Voltage for
P6.4–P6.5 and P7.0–P7.1
Input Leakage Current
Input Pullup Current
LCD INTERFACE
LCD Reference Voltage
LCD Bias Voltage 1
LCD Bias Voltage 2
LCD Adjustment Voltage
LCD Bias Resistor
LCD Adjustment Resistor
V
LCD
V
LCD1
V
LCD2
V
ADJ
R
LCD
R
LADJ
LRA4:LRA0 = 0
When segment is driven at V
LCD
level;
V
LCD
= 3V; I
SEGxx
= -3µA;
guaranteed by design
When segment is driven at V
LCD1
level;
V
LCD1
= 2V; I
SEGxx
= -3µA;
guaranteed by design
LCD Segment Voltage
V
SEGxx
When segment is driven at V
LCD2
level;
V
LCD2
= 1V; I
SEGxx
= -3µA;
guaranteed by design
When segment is driven at V
ADJ
level;
V
ADJ
= 0V; I
SEGxx
= 3µA;
guaranteed by design
V
LCD2
-
0.02
V
LCD2
V
LCD
-
0.02
1/3 bias
1/3 bias
Guaranteed by design
2.7
3.3
3.6
V
V
V
V
kΩ
kΩ
V
LCD
V
ADJ
+ 2/3 (V
LCD
- V
ADJ
)
V
ADJ
+ 1/3 (V
LCD
- V
ADJ
)
0
100
200
0.4 x
SYMBOL
V
IH2
V
IH3
V
IL1
V
IL2
V
OH1
V
OH2
V
OL1
V
OL2
I
L
I
IP
SVS on; I
OH(MAX)
= 0.75mA; V
LCD
= 2.7V
I
OH(MAX)
= 0.75mA; V
DDIO
=1.8V
I
OL
= 1.0mA; V
DDIO
= 1.8V
I
OL
= 1.4mA; V
DDIO
= 2.7V
Internal pullup disabled
Internal pullup enabled
CONDITIONS
SVS on, V
LCD
= 3.3V
MIN
0.8 x
V
LCD
0.8 x
V
DDIO
0
0
V
LCD
-
0.2
V
DDIO
-
0.2
GND
GND
-100
-20
0.2
0.2
+100
-5
TYP
MAX
V
LCD
V
DDIO
0.2 x
V
DDIO
0.2 x
V
DDIO
UNITS
V
V
V
V
V
V
V
V
nA
µA
MAXQ2000
V
LCD1
-
0.02
V
LCD1
V
V
ADJ
0.1
_____________________________________________________________________
3
Low-Power LCD Microcontroller
MAXQ2000
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= V
DD(MIN)
to V
DD(MAX)
, V
DDIO
= 2.7V to 3.6V, T
A
= -40°C to +85°C.) (Note 1)
PARAMETER
EXTERNAL CLOCK SOURCE
External oscillator, V
DD
≥
2.25V
External oscillator, V
DD
< 2.25V
External-Clock Frequency
f
HFIN
External crystal, V
DD
≥
2.25V
External crystal, V
DD
< 2.25V
Flash programming, V
DD
≥
2.25V
Flash programming, V
DD
< 2.25V
External-Clock Period
System-Clock Frequency
System-Clock Period
REAL-TIME CLOCK
RTC Input Frequency
JTAG/FLASH PROGRAMMING
Flash Erase Time
Flash Programming Time
Write/Erase Cycles
Data Retention
SPI TIMING
SPI Master Operating
Frequency
SPI Slave Operating
Frequency
SCLK Output Pulse-Width
High/Low
SCLK Input Pulse-Width
High/Low
MOSI Output Hold Time
after SCLK Sample Edge
MOSI Output Valid to
Sample Edge
MISO Input Valid to SCLK
Sample Edge Rise/Fall
Setup
MISO Input to SCLK
Sample Edge Rise/Fall
Hold
1/t
MCK
1/t
SCK
t
MCH
, t
MCL
t
SCH
, t
SCL
t
MOH
t
MOV
C
L
= 50pF
t
MCK
/ 2
- 25
t
MCK
/ 2
- 25
30
t
MCK
/ 2
- 25
t
SCK
/ 2
f
CK
/ 2
f
CK
/ 8
MHz
MHz
ns
ns
ns
ns
T
A
= +25°C
T
A
= +25°C
Mass erase
Page erase
200
20
2.5
10,000
100
5.0
ms
ms
cycles
years
f
32KIN
32kHz watch crystal
32.768
kHz
t
CLCL
f
CK
t
CK
48% minimum duty cycle
2.25V
≤
V
DD
≤
2.75V
1.8V
≤
V
DD
≤
2.75V
0
0
3
3
2
2
50
0
0
50
20
14
20
14
20
14
20
14
ns
MHz
ns
MHz
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
t
MIS
ns
t
MIH
0
ns
4
_____________________________________________________________________
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