8K X 8 High Speed CMOS Static RAM
| W2465A-20 | 291C4022R832AA | W2465AK-15 | W2465AK-12 | W2465AJ-20 | W2465AJ-15 | W2465AJ-12 | W2465A-15 | W2465A-12 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8K X 8 High Speed CMOS Static RAM | Precision, Long-life Compact 12mm Size Optical Encoder | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM | 8K X 8 High Speed CMOS Static RAM |
| 厂商名称 | - | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - | - |
| 零件包装代码 | - | - | DIP | DIP | SOJ | SOJ | SOJ | - | - |
| 包装说明 | - | - | 0.300 INCH, SKINNY, PLASTIC, DIP-28 | DIP, DIP28,.3 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | - | - |
| 针数 | - | - | 28 | 28 | 28 | 28 | 28 | - | - |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow | unknow | - | - |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 最长访问时间 | - | - | 15 ns | 12 ns | 20 ns | 15 ns | 12 ns | - | - |
| I/O 类型 | - | - | COMMON | COMMON | COMMON | COMMON | COMMON | - | - |
| JESD-30 代码 | - | - | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | - | - |
| 长度 | - | - | 35.26 mm | 35.26 mm | 18.03 mm | 18.03 mm | 18.03 mm | - | - |
| 内存密度 | - | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | - | - |
| 内存集成电路类型 | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | - |
| 内存宽度 | - | - | 8 | 8 | 8 | 8 | 8 | - | - |
| 功能数量 | - | - | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | - | - | 28 | 28 | 28 | 28 | 28 | - | - |
| 字数 | - | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | - | - |
| 字数代码 | - | - | 8000 | 8000 | 8000 | 8000 | 8000 | - | - |
| 工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| 最高工作温度 | - | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - |
| 组织 | - | - | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | - | - |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | - | - | DIP | DIP | SOJ | SOJ | SOJ | - | - |
| 封装等效代码 | - | - | DIP28,.3 | DIP28,.3 | SOJ28,.34 | SOJ28,.34 | SOJ28,.34 | - | - |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | - | - | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - |
| 并行/串行 | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | - | - | 4.45 mm | 4.45 mm | 3.56 mm | 3.56 mm | 3.56 mm | - | - |
| 最大待机电流 | - | - | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | - | - |
| 最小待机电流 | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 最大压摆率 | - | - | 0.15 mA | 0.18 mA | 0.12 mA | 0.15 mA | 0.18 mA | - | - |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | - | - | NO | NO | YES | YES | YES | - | - |
| 技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - |
| 端子形式 | - | - | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | - | - |
| 端子节距 | - | - | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 宽度 | - | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - |
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