GD74HC191概述

Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,

GD74HC191规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	LG Semicon Co Ltd
包装说明	DIP, DIP16,.3
Reach Compliance Code	unknown
计数方向	BIDIRECTIONAL
JESD-30 代码	R-PDIP-T16
JESD-609代码	e0
负载电容（CL）	50 pF
负载/预设输入	YES
逻辑集成电路类型	BINARY COUNTER
最大频率@ Nom-Sup	12000000 Hz
最大I（ol）	0.004 A
工作模式	SYNCHRONOUS
功能数量	1
端子数量	16
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	2/6 V
认证状态	Not Qualified
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL

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GD74HC191相似产品对比

	GD74HC191	GD54HCT191J	GD54HC191J	GD74HC191D	GD74HCT191D	GD74HC191J	GD74HCT191J	GD74HCT191
描述	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
计数方向	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
JESD-30 代码	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDSO-G16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
负载/预设输入	YES	YES	YES	YES	YES	YES	YES	YES
逻辑集成电路类型	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
最大频率@ Nom-Sup	12000000 Hz	11000000 Hz	10000000 Hz	12000000 Hz	13000000 Hz	12000000 Hz	13000000 Hz	13000000 Hz
最大I（ol）	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
功能数量	1	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16	16
最高工作温度	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	SOP	SOP	DIP	DIP	DIP
封装等效代码	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
电源	2/6 V	5 V	2/6 V	2/6 V	5 V	2/6 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	NO	NO	NO	YES	YES	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	LG Semicon Co Ltd	-	-	-	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd

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