8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFN |
包装说明 | 4 X 4 MM, CSP-20 |
针数 | 20 |
Reach Compliance Code | unknown |
其他特性 | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e0 |
长度 | 4 mm |
湿度敏感等级 | 3 |
负电源电压最大值(Vsup) | -2.75 V |
负电源电压最小值(Vsup) | -2.25 V |
标称负供电电压 (Vsup) | -2.5 V |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 20 |
标称断态隔离度 | 60 dB |
通态电阻匹配规范 | 0.4 Ω |
最大通态电阻 (Ron) | 4.5 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
座面最大高度 | 0.9 mm |
最大供电电压 (Vsup) | 2.75 V |
最小供电电压 (Vsup) | 2.25 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
最长断开时间 | 15 ns |
最长接通时间 | 25 ns |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4 mm |
ADG758BCP | ADG758BCP-REEL | ADG758BCP-REEL7 | ADG759BCP-REEL | ADG759BCP-REEL7 | ADG759BCP | |
---|---|---|---|---|---|---|
描述 | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN |
包装说明 | 4 X 4 MM, CSP-20 | HVQCCN, | 4 X 4 MM, CSP-20 | 4 X 4 MM, CSP-20 | 4 X 4 MM, CSP-20 | 4 X 4 MM, CSP-20 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
负电源电压最大值(Vsup) | -2.75 V | -2.75 V | -2.75 V | -2.75 V | -2.75 V | -2.75 V |
负电源电压最小值(Vsup) | -2.25 V | -2.25 V | -2.25 V | -2.25 V | -2.25 V | -2.25 V |
标称负供电电压 (Vsup) | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V |
信道数量 | 8 | 8 | 8 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
标称断态隔离度 | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB |
通态电阻匹配规范 | 0.4 Ω | 0.4 Ω | 0.4 Ω | 0.4 Ω | 0.4 Ω | 0.4 Ω |
最大通态电阻 (Ron) | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 |
座面最大高度 | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm |
最大供电电压 (Vsup) | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
最小供电电压 (Vsup) | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
最长断开时间 | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
最长接通时间 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
厂商名称 | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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