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NCE30H12
NCE N-Channel
Enhancement Mode Power MOSFET
Description
The NCE30H12 uses advanced trench technology and
design to provide excellent R
DS(ON)
with low gate charge. It
can be used in a wide variety of applications.
General Features
●
V
DS
=30V,I
D
=120A
R
DS(ON)
<3.5mΩ @ V
GS
=10V (Typ:3.0mΩ)
●
High density cell design for ultra low Rdson
●
Fully characterized avalanche voltage and current
●
Good stability and uniformity with high E
AS
●
Excellent package for good heat dissipation
●
Special process technology for high ESD capability
Schematic diagram
Application
●
Power switching application
●
Hard switched and high frequency circuits
●
Uninterruptible power supply
Marking and pin assignment
100% UIS TESTED!
100%
∆Vds
TESTED!
TO-220-3L top view
Package Marking and Ordering Information
Device Marking
NCE30H12
Device
NCE30H12
Device Package
TO-220-3L
Reel Size
-
Tape width
-
Quantity
-
Absolute Maximum Ratings (T
A
=25℃unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous
Drain Current-Continuous(T
C
=100℃)
Pulsed Drain Current
Maximum Power Dissipation
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
Symbol
V
DS
V
GS
I
D
I
D
(100℃)
Limit
30
±20
120
84
400
120
350
-55 To 175
Unit
V
V
A
A
A
W
mJ
℃
I
DM
P
D
E
AS
T
J
,T
STG
Wuxi NCE Power Semiconductor Co., Ltd
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NCE30H12
R
θJC
1.25
℃
/W
Thermal Characteristic
Thermal Resistance,Junction-to-Case
(Note 2)
Electrical Characteristics (T
A
=25℃unless otherwise noted)
Parameter
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics
(Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
(Note 4)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
Diode Forward Current
(Note 2)
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Symbol
BV
DSS
I
DSS
I
GSS
V
GS(th)
R
DS(ON)
g
FS
C
lss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
V
SD
I
S
t
rr
Qrr
t
on
Condition
V
GS
=0V I
D
=250μA
V
DS
=30V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
V
DS
=V
GS
,I
D
=250μA
V
GS
=10V, I
D
=20A
V
DS
=10V,I
D
=20A
Min
30
-
-
1
-
50
Typ
-
-
-
1.6
3.0
-
3550
1350
120
Max
-
1
±100
3
3.5
-
Unit
V
μA
nA
V
mΩ
S
PF
PF
PF
V
DS
=25V,V
GS
=0V,
F=1.0MHz
-
VGS=10V,VDS=20V
RL=0.75Ω,RGEN=3Ω
-
-
-
VGS=10V,VDS=15V,ID=20A
11
10
38
11
48
11
10
-
-
-
-
nS
nS
nS
nS
nC
nC
nC
V
GS
=0V,I
S
=20A
-
TJ = 25°C, IF = 20A
di/dt = 100A/μs
(Note3)
-
-
-
-
-
-
21
58
1.2
120
-
-
V
A
nS
nC
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.
2.
Surface Mounted on FR4 Board, t
≤
10 sec.
3.
Pulse Test: Pulse Width
≤
300μs, Duty Cycle
≤
2%.
4.
Guaranteed by design, not subject to production
5.
EAS condition：Tj=25℃,V
DD
=15V,V
G
=10V,L=0.5mH,Rg=25Ω
Wuxi NCE Power Semiconductor Co., Ltd
Page 2
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Pb Free Product
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NCE30H12
Test Circuit
1) E
AS
Test Circuits
2) Gate Charge Test Circuit
3) Switch Time Test Circuit
Wuxi NCE Power Semiconductor Co., Ltd
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Typical Electrical and Thermal Characteristics
(Curves)
NCE30H12
I
D
- Drain Current (A)
Normalized On-Resistance
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 1 Output Characteristics
Figure 4 Rdson-Junction Temperature
Vgs Gate-Source Voltage (V)
I
D
- Drain Current (A)
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Rdson On-Resistance(mΩ)
Figure 5 Gate Charge
I
D
- Drain Current (A)
I
s
- Reverse Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson-
Drain Current
Figure 6 Source- Drain Diode Forward
Wuxi NCE Power Semiconductor Co., Ltd
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NCE30H12
C Capacitance (pF)
Normalized BVdss
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 BV
DSS
vs Junction Temperature
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 V
GS(th)
vs Junction Temperature
r(t),Normalized Effective
Transient Thermal Impedance
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
Wuxi NCE Power Semiconductor Co., Ltd
Page 5
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