IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56, 4.50 X 7MM, 0.65 MM HEIGHT, PLASTIC, MO-225, SOT-702-1, VFBGA-56, FF/Latch
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, |
| 针数 | 56 |
| 制造商包装代码 | SOT-702-1 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PBGA-B56 |
| 长度 | 7 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 14 |
| 功能数量 | 1 |
| 端子数量 | 56 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 2.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 2.7 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 4.5 mm |
| 最小 fmax | 200 MHz |
| 935272535151 | 935270668118 | 935268661118 | 935268661112 | 935272535157 | 935270668112 | 935272535118 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56, 4.50 X 7MM, 0.65 MM HEIGHT, PLASTIC, MO-225, SOT-702-1, VFBGA-56, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO48, 4.40 MM, PLASTIC, MO-153, SOT-480-1, TVSOP-48, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56, 4.50 X 7MM, 0.65 MM HEIGHT, PLASTIC, MO-225, SOT-702-1, VFBGA-56, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO48, 4.40 MM, PLASTIC, MO-153, SOT-480-1, TVSOP-48, FF/Latch | IC POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56, 4.50 X 7MM, 0.65 MM HEIGHT, PLASTIC, MO-225, SOT-702-1, VFBGA-56, FF/Latch |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | TSSOP | TSSOP | TSSOP | BGA | TSSOP | BGA |
| 包装说明 | VFBGA, | TSSOP, | TSSOP, | 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48 | 4.50 X 7MM, 0.65 MM HEIGHT, PLASTIC, MO-225, SOT-702-1, VFBGA-56 | TSSOP, | VFBGA, |
| 针数 | 56 | 48 | 48 | 48 | 56 | 48 | 56 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PBGA-B56 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B56 | R-PDSO-G48 | R-PBGA-B56 |
| 长度 | 7 mm | 9.7 mm | 12.5 mm | 12.5 mm | 7 mm | 9.7 mm | 7 mm |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 56 | 48 | 48 | 48 | 56 | 48 | 56 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | TSSOP | TSSOP | TSSOP | VFBGA | TSSOP | VFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.1 mm | 1.2 mm | 1.2 mm | 1 mm | 1.1 mm | 1 mm |
| 最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING | BALL |
| 端子节距 | 0.65 mm | 0.4 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.4 mm | 0.65 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 4.5 mm | 4.4 mm | 6.1 mm | 6.1 mm | 4.5 mm | 4.4 mm | 4.5 mm |
| 最小 fmax | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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