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IS42S16100B-10TI

产品描述Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50
产品类别存储    存储   
文件大小743KB,共78页
制造商Integrated Silicon Solution ( ISSI )
下载文档 详细参数 选型对比 全文预览

IS42S16100B-10TI概述

Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50

IS42S16100B-10TI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Integrated Silicon Solution ( ISSI )
零件包装代码TSOP2
包装说明TSOP2, TSOP50,.46,32
针数50
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式DUAL BANK PAGE BURST
最长访问时间7 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)100 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PDSO-G50
JESD-609代码e0
长度20.95 mm
内存密度16777216 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度16
湿度敏感等级3
功能数量1
端口数量1
端子数量50
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSOP50,.46,32
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
刷新周期4096
座面最大高度1.2 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.003 A
最大压摆率0.16 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10.16 mm

IS42S16100B-10TI相似产品对比

IS42S16100B-10TI IS42S16100B-7T IS42S16100B-10T IS42S16100B-10TL IS42S16100B-10TLI IS42S16100B-6T IS42S16100B-6TL IS42S16100B-7TLI IS42S16100B-7TI IS42S16100B-7TL
描述 Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Synchronous DRAM, 1MX16, 7ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50
是否无铅 含铅 含铅 含铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 符合 符合 不符合 符合 符合 不符合 符合
零件包装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
包装说明 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32 TSOP2, TSOP50,.46,32
针数 50 50 50 50 50 50 50 50 50 50
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
最长访问时间 7 ns 5.5 ns 7 ns 7 ns 7 ns 5.5 ns 5.5 ns 5.5 ns 5.5 ns 5.5 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
最大时钟频率 (fCLK) 100 MHz 143 MHz 100 MHz 100 MHz 100 MHz 166 MHz 166 MHz 143 MHz 143 MHz 143 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
交错的突发长度 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 代码 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50 R-PDSO-G50
JESD-609代码 e0 e0 e0 e3 e3 e0 e3 e3 e0 e3
长度 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm 20.95 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 16 16 16 16 16 16 16 16 16 16
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 50 50 50 50 50 50 50 50 50 50
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C
组织 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
封装等效代码 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32 TSOP50,.46,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 260 NOT SPECIFIED 260 260 NOT SPECIFIED 260
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096 4096 4096 4096 4096 4096
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
自我刷新 YES YES YES YES YES YES YES YES YES YES
连续突发长度 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
最大待机电流 0.003 A 0.002 A 0.002 A 0.002 A 0.003 A 0.002 A 0.002 A 0.003 A 0.003 A 0.002 A
最大压摆率 0.16 mA 0.14 mA 0.14 mA 0.14 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.14 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb) Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 40 40 NOT SPECIFIED 40 40 NOT SPECIFIED 40
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
厂商名称 Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )

 
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