Crystal oscillator
SOJ HIGH-FREQUENCY CRYSTAL OSCILLATOR
SG-615 series
• High-density mounting-type SMD.
• A general-purpose SMD with heat-resisting cylindrical AT-cut
crystal unit and allowing almost the same soldering temperature
as SMD IC.
• Cylindrical AT crystal unit builtin, thus assuring high reliability.
• Provided with output enable function.
• Low current consumption.
Actual size
Specifications (characteristics)
Item
Output frequency range
Power source
voltage
Temperature
range
Max. supply voltage
Operating voltage
Storage temperature
Operating temperature
Symbol
f
0
V
DD
-GND
V
DD
T
STG
T
OPR
T
SOL
∆f/f
0
Iop
t
w
/
t
V
OH
(I
OH
)
V
OL
(I
OL
)
C
L
N
V
IH
V
IL
I
OE
t
TLH
8ns max.
t
THL
t
OSC
fa
S.R.
SG-615P
SG-615PTJ
Specifications
SG-615PH
Remarks
1.0250 MHz to 26.0000 MHz
26.0001 MHz to 66.6667 MHz
-0.3V to +7.0V
5.0V±0.5V
-55˚C to +125˚C
Soldering condition
Frequency stability
Current consumption
C-MOS level
Duty
TTL level
Output voltage
Output load
condition (fan out)
C-MOS
TTL
-20˚C to 70˚C (-40˚C to 85˚C)
Twice at under 260˚C within 10 sec.
or under 230˚C within 3 min.
B: ±50ppm
C: ±100ppm
Stored as bare product after unpacking
55MHz max.(-40˚C to +85˚C)
B type is possible up to 55 MHz
No load condition
C-MOS load: 1/2V
DD
TTL load: 1.4V
Output enable/disable input voltage
Output disable current
Output rise time
C-MOS level
TTL level
Output fall time
C-MOS level
TTL level
Oscillation start up time
Aging
Shock resistance
Note:
23mA max.
35mA max.
40% to 60%
—
40% to 60%
45% to 55%
—
V
DD
-0.4V min.
2.4V min.
V
DD
-0.4V min.
-400µA
-4mA
0.4V max.
16mA
8mA
4mA
50pF max.
—
50pF max.
10TTL max.
5TTL max.
—
2.0V min.
3.5V min.
2.0V min.
0.8V max.
1.5V max.
0.8V max.
_
C
L
<
15
PF
I
IH
=1µA max.(OE=V
DD
)
I
IL
=-100µA min.(OE=GND) I
IL
=-500µA min.(OE=GND) PTJ
OE=GND
C-MOS load: 20
%→
80
%
V
DD
TTL load: 0.4V
→
2.4V
C-MOS load: 80
%→
20
%
V
DD
TTL load: 2.4V
→
0.4V
Time at 4.5V to be 0 sec.
Ta= 25˚C, V
DD
= 5V, first year
12mA max.
28mA max.
—
5ns max.
—
5ns max.
20mA max.
7ns max.
—
7ns max.
—
4ms max.
10ms max.
±5ppm/year max.
±20ppm max.
Three drops on a hard board from 75 cm or
excitation test with 3000G x 0.3ms x 1/2sine
wave in 3 directions
• Unless otherwise stated, characteristics (specifications) shown in the above table are based on the rated operating temperature and voltage condition.
•
External by-pass capacitor is recommended.
(Unit: mm)
NO.
Pin terminal
1
2
3
4
OE
GND
OUT
V
DD
9.8 max
External dimensions
#4
#3
Recommended soldering pattern
1.3
3.8
1.3
(Unit: mm)
#1
#2
14.0 max.
5.8
4.7 max.
4.06
0.25
5.08
0.51
0.25 min.
7.62
3.0
3.0
SG-615P C
20.0000M
E 9352A
8.65
32
THE CRYSTALMASTER
ENERGY SAVING EPSON
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Energy Saving
Space saving technology
provides further reductions
in product size and weight
Power Saving
through super-precise pro-
cessing and high-density
assembly technology.
Space Saving
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shortens the time required
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Our concept of Energy Saving technology conserves
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In the industrial sector, leading priorities include mea-
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although the contribution of energy-
Resource
saving technology developed by
Saving
EPSON may appear insignificant,
we seek to contribute to the develop-
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EPSON is committed to the conservation of energy, both
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SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification
by B.V.Q. I. (Bureau Veritas Quality International) .
ISO9001 in October, 1992.
ISO14001 in November,1997.
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