PCM Codec, A-Law, 1-Func, CMOS, PDSO24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd |
| 包装说明 | SOP, SOP24,.5 |
| Reach Compliance Code | unknown |
| 压伸定律 | A-LAW |
| 滤波器 | YES |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 线性编码 | NOT AVAILABLE |
| 负电源额定电压 | -5 V |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.5 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 14 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | PCM CODEC |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| MSM6813GS-VK | MSM6810AS | MSM6810RS | MSM6810GS-VK | MSM6811RS | MSM6811GS-VK | MSM6813RS | |
|---|---|---|---|---|---|---|---|
| 描述 | PCM Codec, A-Law, 1-Func, CMOS, PDSO24, | PCM Codec, MU-Law, 1-Func, CMOS, CDIP16, | PCM Codec, MU-Law, 1-Func, CMOS, PDIP16, | PCM Codec, MU-Law, 1-Func, CMOS, PDSO24, | PCM Codec, A-Law, 1-Func, CMOS, PDIP16, | PCM Codec, A-Law, 1-Func, CMOS, PDSO24, | PCM Codec, A-Law, 1-Func, CMOS, PDIP20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | SOP, SOP24,.5 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP24,.5 | DIP, DIP16,.3 | SOP, SOP24,.5 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 压伸定律 | A-LAW | MU-LAW | MU-LAW | MU-LAW | A-LAW | A-LAW | A-LAW |
| 滤波器 | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PDSO-G24 | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G24 | R-PDIP-T16 | R-PDSO-G24 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 线性编码 | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE |
| 负电源额定电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 16 | 16 | 24 | 16 | 24 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP | DIP | SOP | DIP |
| 封装等效代码 | SOP24,.5 | DIP16,.3 | DIP16,.3 | SOP24,.5 | DIP16,.3 | SOP24,.5 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 14 mA | 10 mA | 10 mA | 14 mA | 10 mA | 14 mA | 14 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
FPGA/CPLD
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