KMY
Last update: 2012.8.30 No.FMC-K-HTS-0001-3
(Uncontrolled copy)
Sp e c i f i c a t i o n
(Reference)
Title:
Style:
CHIP FUSE; RECTANGULAR TYPE
FMC10, 16
RoHS COMPLIANCE ITEM
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Issue Dept.: Research & Development Department Hokkaido Research Center
KMY
Title:
CHIP FUSES; RECTANGULAR TYPE
FMC10, 16
Drawing No:
FMC−K−HTS−0001
Page:
1/7
/3
1. Scope
1.1 This specification covers the detail requirements for chip fuses; rectangular type, style of FMC10, 16.
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
2. Classification
Type designation shall be the following form.
(Example)
FMC
16
AB
TP
202
1
2
3
4
5
1 Chip fuses; rectangular type
Style
2 Size
3 Rated current Example: 202
→
2.0 (A)
4 Optional code
Symbol
Optional code
AB
AH
5 Packaging form
3. Safety standard approval
•
UL248−1 and UL248−14
•
CSA C22.2, No.
248.1−00 and
CSA C22.2, No.
248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847
4. Rating
The ratings shall be in accordance with Table−1.
4.1 Optional code: AB
Table−1(1)
Rated current
Style
Symbol
(A)
Marking
symbol
Internal resistance value
(mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A)
Time / current characteristic
Current
Pre−arcing time
Standard
FMC10
FMC16
501
751
102
132
152
202
252
302
501
751
102
132
152
202
252
302
402
502
0.5
0.75
1.0
1.25
1.5
2.0
2.5
3.0
0.5
0.75
1.0
1.25
1.5
2.0
2.5
3.0
4.0
5.0
F
A
L
M
H
S
T
R
F
A
L
M
H
S
T
R
X
Y
240
140
95
73
60
41
32
25
260
140
110
80
65
45
32
26
18
14
DC24
35
100%
200%
300%
4 h min.
5 s max.
0.2 s max.
DC32
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
KMY
Title:
CHIP FUSES; RECTANGULAR TYPE
FMC10, 16
Drawing No:
FMC−K−HTS−0001
Page:
2/7
/3
4.2 Optional code: AH
Table−1(2)
Rated current
Style
Symbol
(A)
Marking
symbol
Internal resistance value
(mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A)
Time / current characteristic
Current
Pre−arcing time
FMC16
501
631
751
801
102
132
152
162
202
252
302
322
402
502
0.5
0.63
0.75
0.8
1.0
1.25
1.5
1.6
2.0
2.5
3.0
3.15
4.0
5.0
HF
HI
HA
HK
HL
HM
HH
HN
HS
HT
HR
HU
HX
HY
400
300
210
180
115
90
70
60
50
37
28
26
18
14
DC32
35
100%
200%
300%
4 h min.
5 s max.
0.2 s max.
4.3 Working temperature range:
−55
to
+125(°C)
5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol
B
TH
TP
Packaging form
Bulk (loose package)
Paper taping
8mm width, 2mm pitches
Paper taping
8mm width, 4mm pitches
Standard packaging
quantity / units
1,000 pcs.
10,000 pcs.
5,000 pcs.
Application
FMC10, 16
FMC10
FMC16
6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.
L
c
c
H
d
d
Figure
−1
Table−3
Style
FMC10
FMC16
L
1.0±0.05
1.6±0.1
W
0.5±0.05
0.8
+0.15
−0.
05
H
0.38±0.05
0.45±0.10
c
0.2±0.10
0.3±0.15
W
Unit : mm
d
0.25±0.10
0.3±0.1
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
KMY
Title:
CHIP FUSES; RECTANGULAR TYPE
FMC10, 16
Drawing No:
FMC−K−HTS−0001
Page:
3/7
/3
6.2 Net weight (Reference)
Style
Net weight(mg)
FMC10
0.6
FMC16
2
7. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example)
Style
Optional code
Marking symbol
Content
FMC10
S
FMC10 202 AB
AB
FMC16
S
FMC16 202 AB
FMC16
AH
HS
FMC16 202 AH
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5
°C
to 35
°C,
Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20
°C ±
2
°C,
Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
Table−4(1)
No.
Test items
Condition of test
Performance requirements
1
Temperature rise
The fuse shall be mounted on the test substrate as 75
°C
max.
shown in Figure−2.
Measurement temp.: 10
°C
to 30
°C
Test current: Rated current
The temperature at the hottest point on the surface
of the fuse shall be measured after temperature
equilibrium has been attained.
2
Time / current characteristic The fuse shall be mounted on the test substrate as Current Pre−arcing time
shown in Figure−2.
100%
4 h min.
Test current shall be applied for continuously.
200%
5 s. max.
300%
0.2 s max.
Change of internal resistance:
3
Terminal bond strength of
ＪＩＳ
C 60068-2-21 Ue1
the face plating
The fuse shall be mounted on the test substrate as
±10%
No evidence of mechanical
shown in Figure−2.
Bending value: 3 mm(Among the fulcrums: 90 mm) damage.
Duration: 10 s
±
1 s
4
Resistance to soldering Test by a piece.
Change of internal resistance:
heat
Temp. of solder bath: 260
°C ±
5
°C
±10%
No evidence of appearance
Immersion time: 10 s
±
1 s
After immersion into solder, leaving the room temp. damage
for 1h or more, and then measure the internal
resistance.
•
Reflow soldering
Pre−heating: 150
°C ∼
180
°C,
120 s max.
Peak: 260
°C ±
5
°C,
10 s max.
Reflow cycle: 2 times
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
KMY
Title:
CHIP FUSES; RECTANGULAR TYPE
FMC10, 16
Drawing No:
FMC−K−HTS−0001
Page:
4/7
/3
No.
5
Test items
Solderability
6
Rapid change temperature
Table−4(2)
Condition of test
ＪＩＳ
C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235
°C ±
5
°C
Immersion time: 2 s
±
0.5 s
ＪＩＳ
C 60068-2-14 Na
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Lower temperature:
−55 °C
Upper temperature:
+125 °C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles
Performance requirements
The surface of terminal immersed
shall be min. of 95 % covered with
a new coating of solder.
Change of internal resistance:
±10%
No evidence of appearance
damage
9. Test substrate
φ3
φ4.2
10
0.5
33
20
Unit: mm
:Copper
clad
:Solder
resist
a
90
100
c
b
c
Style
FMC10
FMC16
Figure−2 FMC TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm Thickness of copper clad: 0. 035mm
a
0.3
0.6
b
0.6
1.0
c
0.65
0.5
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
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