1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, PQFP48, MS-026BBC, LQFP-48
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 2 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PQFP-G48 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 最大线性误差 (EL) | 0.0038% |
| 湿度敏感等级 | 3 |
| 模拟输入通道数量 | 1 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL, PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 采样速率 | 0.57 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 1.6 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7 mm |
| AD7664AST | AD7664ASTZ | AD7664ACP | AD7664ACPZ | |
|---|---|---|---|---|
| 描述 | 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, PQFP48, MS-026BBC, LQFP-48 | 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, PQFP48, MS-026BBC, LQFP-48 | 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, QCC48, MO-220VKKD, LFCSP-48 | 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, QCC48, MO-220VKKD, LFCSP-48 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFP | QFP | QFN | QFN |
| 包装说明 | LFQFP, | LFQFP, | HVQCCN, | HVQCCN, |
| 针数 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V |
| 最长转换时间 | 2 µs | 2 µs | 2 µs | 2 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PQFP-G48 | S-PQFP-G48 | S-XQCC-N48 | S-XQCC-N48 |
| JESD-609代码 | e0 | e3 | e0 | e3 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm |
| 最大线性误差 (EL) | 0.0038% | 0.0038% | 0.0038% | 0.0038% |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | LFQFP | LFQFP | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | 260 | 240 | 260 |
| 采样速率 | 0.57 MHz | 0.57 MHz | 0.57 MHz | 0.57 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1 mm | 1 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 40 |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm |
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