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Datasheet

Datasheet> 器件分类 > 逻辑> 逻辑> IDTCSPT857CBVI8

IDTCSPT857CBVI8: 产品描述PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PBGA56, VFBGA-56; 产品类别逻辑逻辑; 文件大小145KB，共15页; 制造商IDT (Integrated Device Technology)

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IDTCSPT857CBVI8概述

PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PBGA56, VFBGA-56

IDTCSPT857CBVI8规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	VFBGA-56
针数	56
Reach Compliance Code	not_compliant
系列	857
输入调节	DIFFERENTIAL
JESD-30 代码	R-PBGA-B56
JESD-609代码	e0
长度	7 mm
逻辑集成电路类型	PLL BASED CLOCK DRIVER
最大I（ol）	0.012 A
湿度敏感等级	3
功能数量	1
反相输出次数
端子数量	56
实输出次数	10
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA56,6X10,25
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	225
电源	2.5 V
认证状态	Not Qualified
Same Edge Skew-Max（tskwd）	0.075 ns
座面最大高度	1.05 mm
最大供电电压 (Vsup)	2.7 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.65 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	4.5 mm
最小 fmax	220 MHz

IDTCSPT857CBVI8相似产品对比

	IDTCSPT857CBVI8	IDTCSPT857CBVGI	IDTCSPT857CNL8	IDTCSPT857CPAI8	IDTCSPT857CBV8	IDTCSPT857CPA8
描述	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PBGA56, VFBGA-56	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PBGA56, GREEN, VFBGA-56	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), VFQFPN-40	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PDSO48, TSSOP-48	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PBGA56, VFBGA-56	PLL Based Clock Driver, 857 Series, 10 True Output(s), 0 Inverted Output(s), PDSO48, TSSOP-48
是否Rohs认证	不符合	符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	BGA	QFN	TSSOP	BGA	TSSOP
包装说明	VFBGA-56	GREEN, VFBGA-56	HVQCCN, LCC40,.24SQ,20	TSSOP, TSSOP48,.3,20	VFBGA-56	TSSOP-48
针数	56	56	40	48	56	48
Reach Compliance Code	not_compliant	compliant	not_compliant	not_compliant	not_compliant	not_compliant
系列	857	857	857	857	857	857
输入调节	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL
JESD-30 代码	R-PBGA-B56	R-PBGA-B56	S-XQCC-N40	R-PDSO-G48	R-PBGA-B56	R-PDSO-G48
JESD-609代码	e0	e1	e0	e0	e0	e0
长度	7 mm	7 mm	6 mm	12.5 mm	7 mm	12.5 mm
逻辑集成电路类型	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER
最大I（ol）	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A
湿度敏感等级	3	3	3	1	3	1
功能数量	1	1	1	1	1	1
端子数量	56	56	40	48	56	48
实输出次数	10	10	10	10	10	10
最高工作温度	85 °C	85 °C	70 °C	85 °C	70 °C	70 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	HVQCCN	TSSOP	TFBGA	TSSOP
封装等效代码	BGA56,6X10,25	BGA56,6X10,25	LCC40,.24SQ,20	TSSOP48,.3,20	BGA56,6X10,25	TSSOP48,.3,20
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	225	260	NOT SPECIFIED	240	225	240
电源	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Same Edge Skew-Max（tskwd）	0.075 ns	0.075 ns	0.075 ns	0.075 ns	0.075 ns	0.075 ns
座面最大高度	1.05 mm	1.05 mm	1 mm	1.1 mm	1.05 mm	1.1 mm
最大供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
温度等级	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)
端子形式	BALL	BALL	NO LEAD	GULL WING	BALL	GULL WING
端子节距	0.65 mm	0.65 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	QUAD	DUAL	BOTTOM	DUAL
处于峰值回流温度下的最长时间	30	30	NOT SPECIFIED	20	30	20
宽度	4.5 mm	4.5 mm	6 mm	6.1 mm	4.5 mm	6.1 mm
最小 fmax	220 MHz	220 MHz	220 MHz	220 MHz	220 MHz	220 MHz

IDTCSPT857CBVI8

IDTCSPT857CBVI8概述

IDTCSPT857CBVI8规格参数

IDTCSPT857CBVI8相似产品对比

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