REVISIONS
LTR
A
B
C
D
E
F
G
H
DESCRIPTION
Add device type 02. Add package Y. Add radiation features. Editorial
changes throughout. - drw
Add device type 03. - drw
Add appendix A, die requirements. Editorial changes throughout. - drw
Change to appendix A, figure A-1. - drw
Add case outline X for vendor CAGE 27014. -rrp
Add device types 04 and 05. Editorial changes throughout. - drw
Sheet 6, table I, I
CCZ
test for device types 04 and 05, change from 2.7 mA max
to 3.0 mA max. - drw
Make clarifications to 1.5, 4.4.4.1, 4.4.4.2, and A.1.2. Add a footnote to 1.5.
Add paragraph 3.1.1. - ro
Add device type 06. Add vendor CAGE F8859.
Add paragraphs 2.2, 4.4.4.1.1, and Table IB and Table IIB. Under Table IIA
device class V column; add subgroup1 to Interim electrical parameters, add
subgroups 7, 8, 9, 10, 11 to Group C end point electrical parameters, and
add subgroups 7, 9 to Group E end point electrical parameters. - ro
DATE (YR-MO-DA)
01-06-29
01-08-29
03-05-15
03-06-05
03-06-10
04-08-25
04-10-25
09-05-05
APPROVED
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Joseph D. Rodenbeck
J
10-06-28
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
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REV
SHEET
PREPARED BY
Dan Wonnell
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20
J
21
J
1
J
22
J
2
J
23
J
3
J
4
J
5
J
6
J
7
J
8
J
9
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10
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11
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Raymond Monnin
APPROVED BY
Raymond Monnin
DRAWING APPROVAL DATE
99-05-26
REVISION LEVEL
J
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, 3 VOLT LVDS QUAD
CMOS DIFFERENTIAL LINE DRIVER,
MONOLITHIC SILICON
SIZE
A
CAGE CODE
AMSC N/A
67268
SHEET
1 OF 23
5962-98651
DSCC FORM 2233
APR 97
5962-E236-10
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
98651
02
V
Y
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
DS90LV031A
UT54LVDS031LV
UT54LVDS031LV
UT54LVDS031LVE
Circuit function
3 V LVDS quad CMOS differential line driver
Radiation hardened, 3 V LVDS quad CMOS
differential line driver
Radiation hardened, 3 V LVDS quad CMOS
differential line driver
Radiation hardened, 3 V LVDS quad CMOS
differential line driver, with enhanced AC
parameters
Radiation hardened, 3 V LVDS quad CMOS
differential line driver, with enhanced AC
parameters
Radiation hardened, 3 V LVDS quad CMOS
differential line driver
05
UT54LVDS031LVE
06
STLVDS31
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
F
X
Y
Descriptive designator
GDFP2-F16 or CDFP3-F16
GDFP1-G16
CDFP4-F16
Terminals
16
16
16
Package style
Flat pack
Flat pack with gullwing leads
Flat pack
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98651
SHEET
J
2
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
CC
) :
Device types 01, 02, 03, 04, 05 ................................................................... -0.3 V to +4 V
Device type 06 ............................................................................................. -0.3 V to +4.5 V
Input voltage (D
IN
) .......................................................................................... -0.3 V to (V
CC
+ 0.3 V) 2/
Enable input voltage (EN,
EN
) ....................................................................... -0.3 V to (V
CC
+ 0.3 V)
Output voltage (D
OUT+
, D
OUT-
) ......................................................................
Storage temperature range .............................................................................
Maximum power dissipation (P
D
):
Cases F and X .............................................................................................
Case Y .........................................................................................................
Lead temperature (soldering, 4 seconds) ........................................................
Junction temperature (T
J
) ...............................................................................
Thermal resistance, junction-to-case (
JC
):
Cases F and X .............................................................................................
Case Y .........................................................................................................
Thermal resistance, junction-to-ambient (
JA
):
Cases F and X .............................................................................................
Case Y .........................................................................................................
1.4 Recommended operating conditions.
Supply voltage (V
CC
) ...................................................................................... 3.0 V to 3.6 V
Ambient operating temperature range (T
A
) ..................................................... -55C to +125C
1.5 Radiation features.
Maximum total dose available:
Device types 02 and 04 (effective dose rate = 1 rad(Si)/s) ..........................
Device types 03 and 05 (effective dose rate = 10 rad(Si)/s) ........................
Device type 06 (dose rate = 50 – 300 rads (Si)/s) .......................................
Neutron irradiation :
Device types 02, 03, 04, and 05 only ...........................................................
Single event latchup (SEL) at effective LET:
Device types 02, 03, 04, and 05 only ...........................................................
1 Mrads(Si) 5/
100 krads(Si) 5/
100 krads (Si)
1 X 10
13
-0.3 V to 3.9 V
-65C to +150C
845 mW 3/
1250 mW
+260C
+150C 4/
22C/W
20C/W
148C/W
120C/W
neutrons/cm
2
2
6/
100
Mev-cm /mg
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For device types 02, 03, 04, 05, and 06, maximum voltage on any pin during cold spare (V
DD
= V
SS
) –0.3 V to 4.3 V.
3/
4/
5/
At T
A
+25C, the derating factor for cases F and X is 6.8 mW/C.
For device types 02, 03, 04, 05, and 06, the maximum junction temperature may be increased to +175C during burn-in
and life test.
Device types 02, 03, 04, 05, are irradiated at dose rate = 50 – 300 rads (Si)/s in accordance with MIL-STD-883,
method 1019, condition A, and are guaranteed to the maximum total dose specified. The effective dose rate after
extended room temperature anneal = 1 rad (Si)/s for device types 02 and 04 and 10 rads (Si)/s for device types 03 and 05
per MIL-STD-883, method 1019, condition A section 3.11.2. The total dose specification for these devices only applies to
the specified effective dose rate, or lower, environment.
Guaranteed, but not tested.
6/
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98651
SHEET
J
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA, 19428-2959).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98651
SHEET
J
4
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 77 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98651
SHEET
J
5
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