Line Receiver, 1 Func, 1 Rcvr, BICMOS, CQCC28, CERAMIC, QCC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, QCC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 输入特性 | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER |
| 接口标准 | GENERAL PURPOSE |
| JESD-30 代码 | S-CQCC-N28 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 接收器位数 | 1 |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 5962-9689601Q3A | CY7B933-155JCT | CY7B933-155JIT | 5962-9689501Q3A | CY7B923-155JCT | CY7B923-155JIT | |
|---|---|---|---|---|---|---|
| 描述 | Line Receiver, 1 Func, 1 Rcvr, BICMOS, CQCC28, CERAMIC, QCC-28 | Telecom Circuit, 1-Func, BICMOS, PQCC28, PLASTIC, LCC-28 | Telecom Circuit, 1-Func, BICMOS, PQCC28, PLASTIC, LCC-28 | Line Driver, 1 Func, 1 Driver, BICMOS, CQCC28, CERAMIC, QCC-28 | Telecom Circuit, 1-Func, BICMOS, PQCC28, PLASTIC, LCC-28 | Telecom Circuit, 1-Func, BICMOS, PQCC28, PLASTIC, LCC-28 |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | QLCC | QLCC | QLCC | QLCC | QLCC | QLCC |
| 包装说明 | CERAMIC, QCC-28 | QCCJ, | PLASTIC, LCC-28 | CERAMIC, QCC-28 | QCCJ, | PLASTIC, LCC-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | unknown | not_compliant |
| JESD-30 代码 | S-CQCC-N28 | S-PQCC-J28 | S-PQCC-J28 | S-CQCC-N28 | S-PQCC-J28 | S-PQCC-J28 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 70 °C | 85 °C | 125 °C | 70 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -40 °C | -55 °C | - | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | QCCJ | QCCJ | QCCN | QCCJ | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | J BEND | J BEND | NO LEAD | J BEND | J BEND |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 |
| 长度 | - | 11.5316 mm | 11.5316 mm | - | 11.5316 mm | 11.5316 mm |
| 座面最大高度 | - | 4.572 mm | 4.572 mm | - | 4.572 mm | 4.572 mm |
| 最大压摆率 | - | 155 mA | 0.16 mA | - | 85 mA | 0.095 mA |
| 电信集成电路类型 | - | TELECOM CIRCUIT | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 端子节距 | - | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 宽度 | - | 11.5316 mm | 11.5316 mm | - | 11.5316 mm | 11.5316 mm |
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