13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Winbond(华邦电子) |
| Objectid | 1443035803 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | _compli |
| compound_id | 6912083 |
| 晶体频率 | 3.58 MHz |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 20.06 mm |
| 破损率 | 2:3 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/5.5 V |
| 认证状态 | Not Qualified |
| 储备 | REPERTORY |
| 座面最大高度 | 4.45 mm |
| 最大压摆率 | 0.0006 mA |
| 标称供电电压 | 2.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 电信集成电路类型 | TELEPHONE DIALER CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| W91530AN | W91530 | W91534AN | W91532AN | W91532N | W91531ALN | W91531LN | W91530N | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION | 13-MEMORY TONE/PULSE DIALER WITH SAVE, KEYTONE, LOCK,AND HANDFREE FUNCTION |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
| 晶体频率 | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz |
| JESD-30 代码 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 20 | 18 | 20 | 20 | 18 | 20 | 18 | 18 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP20,.3 | DIP18,.3 | DIP20,.3 | DIP20,.3 | DIP18,.3 | DIP20,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 储备 | REPERTORY | REPERTORY | REPERTORY | REPERTORY | REPERTORY | REPERTORY | REPERTORY | REPERTORY |
| 最大压摆率 | 0.0006 mA | 0.5 mA | 0.0006 mA | 0.0006 mA | 0.0006 mA | 0.0006 mA | 0.0006 mA | 0.0006 mA |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Winbond(华邦电子) | - | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP20,.3 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP18,.3 | DIP, DIP20,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 20 | - | 20 | 20 | 18 | 20 | 18 | 18 |
| 破损率 | 2:3 | - | 2:3 | 2:3 | 2:3 | 2:3 | 2:3 | 2:3 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称供电电压 | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 电信集成电路类型 | TELEPHONE DIALER CIRCUIT | - | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
