Datasheet> 器件分类 > 存储> 存储> IDT72T51258L6-7BB

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IDT72T51258L6-7BB: 产品描述FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324; 产品类别存储存储; 文件大小513KB，共56页; 制造商IDT (Integrated Device Technology)

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IDT72T51258L6-7BB概述

FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

IDT72T51258L6-7BB规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
针数	324
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	3.8 ns
最大时钟频率 (fCLK)	150 MHz
周期时间	6.7 ns
JESD-30 代码	S-PBGA-B324
JESD-609代码	e0
长度	19 mm
内存密度	2621440 bit
内存集成电路类型	OTHER FIFO
内存宽度	40
湿度敏感等级	3
功能数量	1
端子数量	324
字数	65536 words
字数代码	64000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	64KX40
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA324,18X18,40
封装形状	SQUARE
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
电源	1.5/2.5,2.5 V
认证状态	Not Qualified
座面最大高度	1.97 mm
最大供电电压 (Vsup)	2.625 V
最小供电电压 (Vsup)	2.375 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn63Pb37)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	19 mm

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2.5V MULTI-QUEUE DDR FLOW-CONTROL DEVICES

40 BITS WIDE WITH FIXED 4 QUEUES

8,192 x 40 x 4, 16,384 x 40 x 4

and 32,768 x 40 x 4

IDT72T51248

IDT72T51258

IDT72T51268

FEATURES

•

The multi-queue DDR flow-control device contains 4 Queues

each queue has a fixed size of:

IDT72T51248 — 8,192 x 40 or 16,384 x 20 or 32,768 x 10

IDT72T51258 — 16,384 x 40 or 32,768 x 20 or 65,536 x 10

IDT72T51268 — 32,768 x 40 or 65,536 x 20 or 131,072 x 10

Write to and Read from the same queue or different queues

simultaneously via totally independent ports

Up to 200MHz operating frequency or 8Gbps throughput in SDR mode

Up to 100MHz operating frequency or 8Gbps throughput in DDR mode

User selectable Single Data Rate (SDR) or Double Data Rate

(DDR) modes on both the write port and read port

100% Bus Utilization, Read and Write on every clock cycle

Global Bus Matching - All Queues have same Input bus width

and same Output bus width

User Selectable Bus Matching options:

- x40in to x40out

- x40in to x20out

- x40in to x10out

- x20in to x40out

- x20in to x20out

- x20in to x10out

- x10in to x40out

- x10in to x20out

- x10in to x10out

All I/O is LVTTL/ HSTL/ eHSTL user selectable

3.3V tolerant inputs in LVTTL mode

ERCLK &

EREN

Echo outputs on read port

•

Write Chip Select

WCS

input for write port

Read Chip Select

RCS

input for read port

User Selectable IDT Standard mode (using

and

FF)

or FWFT

mode (using

and

OR)

All 4 Queues have dedicated flag outputs

FF/IR, EF/OR, PAF

and

PAE

A Composite Full/ Input Ready Flag gives status of the queue

selected on the write port

A Composite Empty/ Output Ready flag gives status of the

queue selected on the read port

Programmable Almost Empty and Almost Full flags per Queue

Dedicated Serial Port for flag programming

A Partial Reset is provided for each queue

Power Down pin minimizes power consumption

2.5V Supply Voltage

Available in a 324-pin Plastic Ball Grid Array (PBGA)

19mm x 19mm, 1mm Pitch

JTAG port provides boundary scan function and optional

programming mode

Low Power, High Performance CMOS technology

Industrial temperature range (-40°C to +85°C)

FUNCTIONAL BLOCK DIAGRAM

MULTI-QUEUE DDR FLOW-CONTROL DEVICE

WCLK

WEN

WCS

IS[1:0]

Read Control

Write Control

8,192 x 40

16,384 x40

32,768 x 40

Queue 0

8,192 x 40

16,384 x40

32,768 x 40

Queue 1

8,192 x 40

16,384 x40

32,768 x 40

Queue 2

8,192 x 40

16,384 x40

32,768 x 40

Queue 3

RCLK

REN

RCS

OS[1:0]

D[39:0]

Data In

x10,x20,x40

Q[39:0]

Data Out

x10,x20,x40

FF0/IR0

PAF0

FF1/IR1

PAF1

FF2/IR2

PAF2

FF3/IR3

PAF3

CFF/CIR

EF0/OR0

PAE0

EF1/OR1

PAE1

EF2/OR2

PAE2

EF3/OR3

PAE3

CEF/COR

Read Port

Flag Outputs

6159 drw01

IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc

Write Port

Flag Outputs

FEBRUARY 20, 2009

DSC-6159/5

IDT72T51248/72T51258/72T51268 2.5V MULTI-QUEUE DDR FLOW-CONTROL DEVICES

8,192 x 40 x 4, 16,384 x 40 x 4 and 32,768 x 40 x 4

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

Table of Contents

Features ......................................................................................................................................................................................................................... 1

Description ...................................................................................................................................................................................................................... 3

Pin Configuration ............................................................................................................................................................................................................. 5

Pin Descriptions ............................................................................................................................................................................................................ 6-8

Device Characteristics ..................................................................................................................................................................................................... 9

DC Electrical Characteristics .......................................................................................................................................................................................... 10

AC Electrical Characteristics ........................................................................................................................................................................................... 11

AC Test Conditions ........................................................................................................................................................................................................ 12

Functional Descriptions ............................................................................................................................................................................................. 14-22

Signal Descriptions ................................................................................................................................................................................................... 23-28

JTAG Timing Specifications ....................................................................................................................................................................................... 29-33

List of Tables

Table 1 — Device Configuration .................................................................................................................................................................................... 14

Table 2 — Default Programmable Flag Offsets ................................................................................................................................................................ 14

Table 3 — Status Flags for IDT Standard Mode ............................................................................................................................................................. 17

Table 4 — Status Flags for FWFT Mode ........................................................................................................................................................................ 17

Table 5 — I/O Voltage Level Configuration ..................................................................................................................................................................... 18

Table 6 — TSKEW Measurement .................................................................................................................................................................................. 27

List of Figures

Figure 1. Multi-Queue DDR Flow-Control Device Block Diagram .................................................................................................................................... 4

Figure 2a. AC Test Load ................................................................................................................................................................................................ 12

Figure 2b. Lumped Capacitive Load, Typical Derating ................................................................................................................................................... 12

Figure 3. Programmable Flag Offset Programming Methods ........................................................................................................................................... 15

Figure 4. Offset Registers Serial Bit Sequence ................................................................................................................................................................ 16

Figure 5. Bus-Matching Byte Arrangement ................................................................................................................................................................ 19-21

Figure 6. Echo Read Clock and Data Output Relationship .............................................................................................................................................. 28

Figure 7. Standard JTAG Timing ................................................................................................................................................................................... 29

Figure 8. JTAG Architecture ........................................................................................................................................................................................... 30

Figure 9. TAP Controller State Diagram ......................................................................................................................................................................... 31

Figure 10. Master Reset Timing ..................................................................................................................................................................................... 34

Figure 11. Partial Reset Timing ...................................................................................................................................................................................... 35

Figure 12. Write Cycle and Full Flag Timing (IDT Standard mode, SDR to SDR, x40 In to x40 Out) ............................................................................... 36

Figure 13. Write Cycle and Full Flag Timing in DDR mode ( IDT Standard mode, DDR to DDR, x40 In to x40 Out) ...................................................... 37

Figure 14. Write Cycle and Full Flag Timing with bus-matching and rate matching (IDT Standard mode, DDR to SDR, x10 In to x20 Out) ..................... 38

Figure 15. Write Cycle and Full Flag Timing with rate matching (IDT Standard mode, SDR to DDR, x40 In to x40 Out) ................................................. 39

Figure 16. Write Timing in FWFT mode (FWFT mode, SDR to SDR, x40 In to x40 Out) ................................................................................................. 40

Figure 17. Write Cycle and First Word Latency Timing in DDR mode (FWFT mode, DDR to DDR, x40 In to x40 Out) .................................................... 41

Figure 18. Read Cycle, Empty Flag & First Word Latency (IDT Standard mode, SDR to SDR, x40 In to x40 Out) .......................................................... 42

Figure 19. Read Cycle, Empty Flag & First Word Latency in DDR mode (IDT Standard mode, DDR to DDR, x40 In to x40 Out) ................................... 43

Figure 20. Read Cycle, Empty Flag & First Word Latency w/ bus-matching and rate-matching (IDT Standard mode, DDR to SDR, x40 In to x20 Out) ... 44

Figure 21. Read Cycle and Empty Flag Timing with bus-matching and rate-matching (IDT Standard mode, SDR to DDR, x10 In to x20 Out) ................ 45

Figure 22. Read Timing at Full Boundary (FWFT mode, SDR to SDR, x40 In to x40 Out) ............................................................................................. 46

Figure 23. Composite Empty Flag (IDT Standard mode, SDR to SDR, x40 In to x40 Out) .............................................................................................. 47

Figure 24. Composite Output Ready Flag (FWFT mode, SDR to SDR, x40 In to x40 Out) ............................................................................................. 47

Figure 25. Composite Full Flag (IDT Standard mode, SDR to SDR, x40 In to x40 Out) .................................................................................................. 48

Figure 26. Composite Input Ready Flag (FWFT mode, SDR to SDR, x40 In to x40 Out) ................................................................................................ 48

Figure 27. Queue Switch at Every Clock Cycle (IDT Standard mode, SDR to SDR, x40 In to x40 Out) .......................................................................... 49

Figure 28. Echo Read Clock and Read Enable Operation (IDT Standard mode, SDR to SDR, x40 In to x40 Out) .......................................................... 50

Figure 29. Echo RCLK and Echo Read Enable Operation (FWFT mode, SDR to SDR, x40 In to x40 Out) .................................................................... 51

Figure 30. Echo Read Clock and Read Enable Operation (IDT Standard mode, DDR to DDR, x10 In to x10 Out) ......................................................... 52

Figure 31. Loading of Programmable Flag Registers (IDT Standard and FWFT modes) ................................................................................................ 53

Figure 32. Reading of Programmable Flag Registers (IDT Standard and FWFT modes) ................................................................................................ 53

Figure 33. Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT mode, SDR to SDR, x40 In to x40 Out) .............................. 54

Figure 34. Synchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT mode, SDR to SDR, x40 In to x40 Out) ........................... 54

Figure 35. Power Down Operation ................................................................................................................................................................................ 55

FEBRUARY 20, 2009

IDT72T51258L6-7BB相似产品对比

	IDT72T51258L6-7BB	IDT72T51248L6-7BBI	IDT72T51248L6-7BB	IDT72T51258L5BB	IDT72T51248L5BB	IDT72T51258L6-7BBI
描述	FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 64KX40, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
针数	324	324	324	324	324	324
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	3.8 ns	3.8 ns	3.8 ns	3.6 ns	3.6 ns	3.8 ns
最大时钟频率 (fCLK)	150 MHz	150 MHz	150 MHz	200 MHz	200 MHz	150 MHz
周期时间	6.7 ns	6.7 ns	6.7 ns	5 ns	5 ns	6.7 ns
JESD-30 代码	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324
JESD-609代码	e0	e0	e0	e0	e0	e0
长度	19 mm	19 mm	19 mm	19 mm	19 mm	19 mm
内存密度	2621440 bit	1310720 bit	1310720 bit	2621440 bit	1310720 bit	2621440 bit
内存集成电路类型	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
内存宽度	40	40	40	40	40	40
湿度敏感等级	3	3	3	3	3	3
功能数量	1	1	1	1	1	1
端子数量	324	324	324	324	324	324
字数	65536 words	32768 words	32768 words	65536 words	32768 words	65536 words
字数代码	64000	32000	32000	64000	32000	64000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
组织	64KX40	32KX40	32KX40	64KX40	32KX40	64KX40
可输出	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	225	225	225	225	225	225
电源	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.97 mm	1.97 mm	1.97 mm	1.97 mm	1.97 mm	1.97 mm
最大供电电压 (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
最小供电电压 (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	30
宽度	19 mm	19 mm	19 mm	19 mm	19 mm	19 mm
Base Number Matches	-	1	1	1	1	-

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