qSI-3000KS
Series
SI-3000KS Series
Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type
sFeatures
•
•
•
•
•
•
•
•
•
Compact surface-mount package (SOP-8)
Output current: 1.0 A
Low-ESR capacitor can be used.
Low current consumption Iq
≤
350
µ
A (I
O
= 0 A, V
C
= 2 V)
Low current consumption Iq (OFF)
≤
1
µ
A (V
C
= 0 V)
Low dropout voltage V
DIF
≤
0.6 V (I
O
= 1 A)
4 types of output voltages (1.8 V, 2.5 V, 3.3 V, and variable type) available
Output ON/OFF control pin compatible with LS-TTL
Built-in dropping type overcurrent, thermal protection circuits
sApplications
• Local power supplies
• Battery-driven electronic equipment
sAbsolute
Maximum Ratings
Parameter
DC Input Voltage
Output Control Pin Voltage
Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
Thermal resistance (Junction to Lead (pin 7))
Symbol
V
IN*1
V
C
I
O*1
P
D*1, *2
T
j
T
stg
Rth
(j-a)*
Rth
(j-l)
Ratings
17
V
IN
1.0
0.76
–40 to +125
–40 to +125
130
22
Unit
V
V
A
W
°C
°C
°C/W
°C/W
(T
a
=25°C)
*1: V
IN
(max) and I
O
(max) are restricted by the relationship PD = (V
IN
- V
O
) x I
O
. Calculate these values referring to the
power dissipation vs. copper area data shown in this document.
*2: When mounted on a glass epoxy board measuring 1600 mm
2
(with 2% copper area).
qSI-3000KS
Series
sElectrical
Characteristics
Ratings
Parameter
Input Voltage
Output Voltage
(reference voltage for SI-3102KS)
Symbol
V
IN
V
O
(V
REF
)
Conditions
V
DIF
Dropout Voltage
Conditions
Conditions
Line Regulation
Load Regulation
Quiescent Circuit Current
Off Circuit Current
Temperature Coefficient
of Output Voltage
Ripple Rejection
Overcurrent Protection
Starting Current
*2
Control Voltage (Output ON)
*3
Control Voltage (Output OFF)
VC PIN Control Current (Output ON)
Control Current (Output OFF)
Output OFF Voltage
∆V
OLINE
∆V
OLOAD
Conditions
I
q
Conditions
I
q
(OFF)
Conditions
∆V
O
/∆T
a
Conditions
R
REJ
I
S1
Conditions
V
C
, IH
V
C
, IL
I
C
, IH
Conditions
I
C
, IL
Conditions
V
O
(OFF)
0.5
0.5
–5
0
–5
0
V
C
=0V
1.2
V
IN
=3.3V (V
O
=2.5V)
2.0
0.8
40
2.0
0.8
40
V
C
=2V
–5
V
IN
=3.3V, V
C
=0V
±0.3
T
j
=0 to 100°C (V
O
=2.5V)
55
1.2
V
IN
=2.5V
2.0
SI-3012KS (variable type)
min.
2.4
1.24
1.28
1.32
0.3
I
O
=0.5A (V
O
=2.5V)
0.6
I
O
=1A (V
O
=2.5V)
10
40
V
IN
=3.3V, I
O
=0 to 1A (V
O
=2.5V)
(Unless otherwise specified, T
a
= 25°C, V
c
= 2 V)
SI-3018KS
min.
*1
SI-3025KS
max.
1.836
min.
*1
SI-3033KS
max.
2.55
0.4
min.
*1
Unit
max.
3.366
0.4
typ.
max.
typ.
1.800
–
–
typ.
2.50
typ.
3.300
1.764
2.45
3.234
V
IN
=3.3V, I
O
=10mA
V
IN
=2.5V, I
O
=10mA
V
IN
=3.3V, I
O
=10mA
I
O
=0.5A
V
IN
=5V, I
O
=10mA
I
O
=0.5A
V
V
0.6
0.6
I
O
=1A
10
V
IN
=2.5 to 6V, I
O
=10mA
40
V
IN
=2.5V, I
O
=0 to 1A
350
V
IN
=2.5V, I
O
=0A, V
C
=2V
1
V
IN
=2.5V, V
C
=0V
±0.3
T
j
=0 to 100°C
55
V
IN
=3.3V, f=100 to 120H
Z
1.2
V
IN
=3.3V
V
IN
=3.3V, V
C
=0V
±0.3
T
j
=0 to 100°C
55
I
O
=1A
0.6
I
O
=1A
10
V
IN
=3.3 to 8V, I
O
=10mA
40
V
IN
=3.3V, I
O
=0 to 1A
350
V
IN
=3.3V, I
O
=0A, V
C
=2V
1
V
IN
=5V, V
C
=0V
±0.3
T
j
=0 to 100°C
55
15
V
IN
=5 to 10V, I
O
=10mA
50
V
IN
=5V, I
O
=0 to 1A
350
V
IN
=5V, I
O
=0A, V
C
=2V
1
mV
mV
Conditions
V
IN
=3.3 to 8V, I
O
=10mA (V
O
=2.5V)
350
V
IN
=3.3V, I
O
=0A, V
C
=2V, R2=24kΩ
µ
A
µ
A
mV/°C
dB
A
V
1
Conditions
V
IN
=3.3V, f=100 to 120H
Z
(V
O
=2.5V)
V
IN
=3.3V, f=100 to 120H
Z
V
IN
=5V, f=100 to 120H
Z
1.2
V
IN
=5V
2.0
0.8
40
0
0.5
–5
0
0.8
40
µ
A
µ
A
0.5
V
*1 : Refer to the description on the dropout voltage.
*2 : The I
s1
is specified as the 5% drop point of output voltage V
O
on the condition that V
IN
= V
O
+ 1 V, and I
O
= 10 mA.
*3 : Output is OFF when the output control pin (V
C
pin) is open. Each input level is equivalent to that for LS-TTL. Therefore, the device can be driven
directly by an LS-TTL circuit.
sExternal
Dimensions
5.1
±0.4
1.27
0.4
±0.1
0.15
+0.1
–0.05
(Unit : mm)
8
7
6
5
0.5
±0.1
Pin Arrangement
q
V
C
w
V
IN
e
V
O
r
Sence (ADJ for SI-3012KS)
t
GND
y
GND
u
GND
4.4
±0.2
1
2
3
4
6.2
0.995max.
1.55
±0.15
0~
10
1.27
i
GND
Plastic Mold Package Type
Flammability: UL 94V-0
Weight: Approx. 0.1 g
0.10
0.4
±0.1
0.12 M
0.05
±0.05
1.5
±0.1
°
qSI-3000KS
Series
sBlock
Diagram
qSI-3012KS
qSI-3018KS,
SI-3025KS, SI-3033KS
V
IN
2
3 V
OUT
V
IN
2
3 V
OUT
4
V
C
1
-
+
4 ADJ
TSD
8
7
REF
6
5 GND
V
C
1
-
+
Sense
TSD
8
7
REF
6
5 GND
sStandard
Circuit Connection Diagram
qSI-3012KS
qSI-3018KS,
SI-3025KS, SI-3033KS
V
IN
2
+
V
O
3
R1
C
O
V
IN
2
V
O
3
C
O
C
IN
V
C
GND ADJ
1
4
5 to 8
Load
C
IN
sense
V
C
GND 4
1
5 to 8
Load
R2
R2
R
1
, R
2
: Output voltage setting resistors
The output voltage can be set by connecting R
1
and R
2
as shown above.
The recommended value of R
2
is 24 kΩ.
R1=(V
O
–V
ADJ
)
÷
(V
ADJ
/R2)
C
IN
: Input capacitor (22
µ
F or larger)
This capacitor is necessary if an inductance is included in the input line or if the wiring length is long.
C
O
: Output capacitor (22
µ
F or larger)
The SI-3000KS series designed for use with very low-ESR ceramics output capacitor.
When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature.
qSI-3000KS
Series
sExample
of Solder Pattern Design
L
L
b2
e1
l2
e1
B
1
L
e
b
e
α
e
e
e
e
*1
B
2
Symbol
e1
e
α
β
1
β
2
L
b2
l2
Dimensions (mm)
5.72
1.27±0.15
0.2
0.2 to 0.5
0.2
0.6
0.76
L+
β
1+
β
2
GND pattern
b2
8
7
6
5
l2
(Reference value conforming to EIAJ
Standard ED-7402-1)
*1 The inner frame stage on which a monolithic IC is mounted is
directly connected to the GND pins (pins 5 through 8). By
expanding the area of the copper connected to the GND pins,
the heat radiation can be improved. It is recommended to
design the solder pattern by opening the insulation film of the
solder patterns of pins 5, 6, 7, and 8, on the wide GND
pattern as shown in Figure 1.
e1
1
2
3
4
e
e
Figure 1
e
sReference
Data
Thermal resistance vs. Copper area
140
Area of PC board : 40×40mm
1.2
Power dissipation vs. Copper area
Tj=100°C Area of PC board : 40×40mm
Ta=25°C
Thermal resistance
θ
j-a (°C/W)
120
Power dissipation P
D
(W)
1
Ta=50°C
Ta=80°C
0.8
100
0.6
0.4
80
60
0.2
40
10
100
Copper area (mm
2
)
1000
0
10
100
Copper area (mm
2
)
1000
• Calculating junction temperature
Measure the temperature TL of the lead of the GND pin (pin 7) by using a thermocouple, and substitute the
measured value into the following expression to calculate the junction temperature.
T
j
=P
D
× θ
j–L
+ T
L
(
θ
j–L
= 22
°
C/W)
qSI-3000KS
Series
sTaping
Specifications
Carrier tape
Surface resistance of em-
bossed tape: 100 kΩ maxi-
mum (among 10 pockets)
160 to 240mm
(About 25 pockets)
1,000PCS
(1,000 pockets)
160 to 240mm
(About 25 pockets)
400 to 600mm
Leader
Vacant seal section
Trailer
IC compartments
Vacant seal section
Cover tape
(Unit : mm)
4
2
8
φ
1.55
Tape draw-out direction
t=3
5.5
12
5.75
(4.75)
5.55
7.0
φ
2
2.1
6.7
Reel: Number of packed
products: 1000
Hole
Hole
B
1.5
60
°
60
°
Hole
Hole
φ
13±0.2
φ
60
φ
180
φ
R2
3
2
Hole
Hole
φ
1
0
Hole
Hole
13±0.3
15.4±1.0
Expanded view of center
2
5
φ
1
3
.5
10
Hole
4
Hole
5
30
°
11.9
Hole
10
Hole
φ
3
R2
φ
60
°
2
3
60
°
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