74AUP1Z125
Low-power X-tal driver with enable and internal resistor;
3-state
Rev. 5 — 8 August 2012
Product data sheet
1. General description
The 74AUP1Z125 combines the functions of the 74AUP1GU04 and 74AUP1G125 with
enable circuitry and an internal bias resistor to provide a device optimized for use in
crystal oscillator applications.
When not in use the EN input can be driven HIGH, pulling up the X1 input and putting the
device in a low-power disable mode. Schmitt trigger action at the EN input makes the
circuit tolerant to slower input rise and fall times across the entire V
CC
range from 0.8 V to
3.6 V.
This device is fully specified for partial power-down applications using I
OFF
at output Y.
The I
OFF
circuitry disables the output Y, preventing the damaging backflow current through
the device when it is powered down.
The integration of the two devices into the 74AUP1Z125 produces the benefits of a
compact footprint, lower power dissipation and stable operation over a wide range of
frequency and temperature.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78B Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial power-down mode operation at output Y
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
NXP Semiconductors
74AUP1Z125
Low-power X-tal driver with enable and internal resistor; 3-state
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AUP1Z125GW
74AUP1Z125GM
74AUP1Z125GF
74AUP1Z125GN
74AUP1Z125GS
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SC-88
XSON6
XSON6
XSON6
XSON6
Description
plastic surface-mounted package; 6 leads
Version
SOT363
Type number
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1
1.45
0.5 mm
plastic extremely thin small outline package; no leads; SOT891
6 terminals; body 1
1
0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9
1.0
0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0
1.0
0.35 mm
SOT1115
SOT1202
4. Marking
Table 2.
Marking
Marking code
[1]
55
55
55
55
55
Type number
74AUP1Z125GW
74AUP1Z125GM
74AUP1Z125GF
74AUP1Z125GN
74AUP1Z125GS
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
V
CC
RPU
X1
3
6
Y
Rbias
4
X2
EN
1
001aaf141
R
PU
= pull-up resistance.
R
bias
= bias resistance.
Fig 1.
Logic symbol
74AUP1Z125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 8 August 2012
2 of 32
NXP Semiconductors
74AUP1Z125
Low-power X-tal driver with enable and internal resistor; 3-state
6. Pinning information
6.1 Pinning
74AUP1Z125
74AUP1Z125
EN
GND
1
2
6
5
Y
GND
V
CC
X1
X1
3
001aaf142
EN
1
6
Y
EN
GND
74AUP1Z125
1
2
3
6
5
4
Y
V
CC
X2
2
5
V
CC
3
4
X2
X1
4
X2
001aaf143
001aaf144
Transparent top view
Transparent top view
Fig 2.
Pin configuration SOT363
Fig 3.
Pin configuration SOT886
Fig 4.
Pin configuration SOT891,
SOT1115 and SOT1202
6.2 Pin description
Table 3.
Symbol
EN
GND
X1
X2
V
CC
Y
Pin description
Pin
1
2
3
4
5
6
Description
enable input (active LOW)
ground (0 V)
data input
unbuffered output
supply voltage
data output
7. Functional description
Table 4.
Input
EN
L
L
H
H
[1]
H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
Function table
[1]
Output
X1
L
H
L
H
X2
H
L
H
L
Y
H
L
Z
Z
74AUP1Z125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 8 August 2012
3 of 32
NXP Semiconductors
74AUP1Z125
Low-power X-tal driver with enable and internal resistor; 3-state
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
V
I
I
OK
V
O
I
O
I
CC
I
GND
T
stg
P
tot
[1]
[2]
Parameter
supply voltage
input clamping current
input voltage
output clamping current
output voltage
output current
supply current
ground current
storage temperature
total power dissipation
Conditions
V
I
< 0 V
[1]
Min
0.5
50
0.5
50
[1]
Max
+4.6
-
+4.6
-
+4.6
20
50
-
+150
250
Unit
V
mA
V
mA
V
mA
mA
mA
C
mW
V
O
< 0 V
Active mode and Power-down mode
V
O
= 0 V to V
CC
0.5
-
-
50
65
T
amb
=
40 C
to +125
C
[2]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For SC-88 packages: above 87.5
C
the value of P
tot
derates linearly with 4.0 mW/K.
For XSON6 packages: above 118
C
the value of P
tot
derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
V
CC
V
I
V
O
T
amb
t/V
Recommended operating conditions
Parameter
supply voltage
input voltage
output voltage
ambient temperature
input transition rise and fall rate
V
CC
= 0.8 V to 3.6 V
Conditions
Min
0.8
0
0
40
-
Max
3.6
3.6
V
CC
+125
200
Unit
V
V
V
C
ns/V
74AUP1Z125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 8 August 2012
4 of 32
NXP Semiconductors
74AUP1Z125
Low-power X-tal driver with enable and internal resistor; 3-state
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
T
amb
= 25
C
V
IH
HIGH-level input voltage
X1 input
V
CC
= 0.8 V to 3.6 V
EN input
V
CC
= 0.8 V
V
CC
= 0.9 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 3.0 V to 3.6 V
V
IL
LOW-level input voltage
X1 input
V
CC
= 0.8 V to 3.6 V
EN input
V
CC
= 0.8 V
V
CC
= 0.9 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 3.0 V to 3.6 V
V
OH
HIGH-level output voltage
Y output; V
I
at X1 input = V
IH
or V
IL
I
O
=
20 A;
V
CC
= 0.8 V to 3.6 V
I
O
=
1.1
mA; V
CC
= 1.1 V
I
O
=
1.7
mA; V
CC
= 1.4 V
I
O
=
1.9
mA; V
CC
= 1.65 V
I
O
=
2.3
mA; V
CC
= 2.3 V
I
O
=
3.1
mA; V
CC
= 2.3 V
I
O
=
2.7
mA; V
CC
= 3.0 V
I
O
=
4.0
mA; V
CC
= 3.0 V
X2 output; V
I
= GND or V
CC
I
O
=
20 A;
V
CC
= 0.8 V to 3.6 V
I
O
=
1.1
mA; V
CC
= 1.1 V
I
O
=
1.7
mA; V
CC
= 1.4 V
I
O
=
1.9
mA; V
CC
= 1.65 V
I
O
=
2.3
mA; V
CC
= 2.3 V
I
O
=
3.1
mA; V
CC
= 2.3 V
I
O
=
2.7
mA; V
CC
= 3.0 V
I
O
=
4.0
mA; V
CC
= 3.0 V
V
CC
0.1
1.11
1.32
2.05
1.9
2.72
2.6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
0.75
V
CC
-
V
CC
0.1
1.11
1.32
2.05
1.9
2.72
2.6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
0.75
V
CC
-
-
-
-
-
-
-
-
-
0.30
V
CC
V
0.35
V
CC
V
0.7
0.9
V
V
-
-
0.25
V
CC
V
0.70
V
CC
-
0.65
V
CC
-
1.6
2.0
-
-
-
-
-
-
V
V
V
V
0.75
V
CC
-
-
V
Conditions
Min
Typ
Max
Unit
74AUP1Z125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 8 August 2012
5 of 32
嵌入式系统
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