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74AUP1G158GM,115

产品描述Low-power 2-input multiplexer; inverting
产品类别逻辑    逻辑   
文件大小200KB,共19页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AUP1G158GM,115概述

Low-power 2-input multiplexer; inverting

74AUP1G158GM,115规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SON
包装说明1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
针数6
制造商包装代码SOT886
Reach Compliance Codecompli
系列AUP/ULP/V
JESD-30 代码R-PDSO-N6
JESD-609代码e3
长度1.45 mm
负载电容(CL)30 pF
逻辑集成电路类型MULTIPLEXER
最大I(ol)0.0017 A
湿度敏感等级1
功能数量1
输入次数2
输出次数1
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
输出极性INVERTED
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装等效代码SOLCC6,.04,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源1.2/3.3 V
Prop。Delay @ Nom-Su21 ns
传播延迟(tpd)21 ns
认证状态Not Qualified
座面最大高度0.5 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.8 V
标称供电电压 (Vsup)1.1 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1 mm

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74AUP1G158
Low-power 2-input multiplexer; inverting
Rev. 5 — 3 August 2012
Product data sheet
1. General description
The 74AUP1G158 is a single 2-input multiplexer which select data from two data inputs
(I0 and I1) under control of a common data select input (S). The state of the common data
select input determines the particular register from which the data comes. The output (Y)
presents the selected data in the complement (inverted) form.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP1G158GM,115相似产品对比

74AUP1G158GM,115 74AUP1G158GS,132 74AUP1G158GM,132 74AUP1G158GN,132 74AUP1G158GF,132 74AUP1G158GW,125
描述 Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting Low-power 2-input multiplexer; inverting
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 PLASTIC, SOT-363, SC-88, SMT-6
制造商包装代码 SOT886 SOT1202 SOT886 SOT1115 SOT891 SOT363
Reach Compliance Code compli compli compli compli compli compli
零件包装代码 SON - SON SON SON TSSOP
针数 6 - 6 6 6 6
系列 AUP/ULP/V - AUP/ULP/V - AUP/ULP/V AUP/ULP/V
JESD-30 代码 R-PDSO-N6 - R-PDSO-N6 - S-PDSO-N6 R-PDSO-G6
JESD-609代码 e3 - e3 - e3 e3
长度 1.45 mm - 1.45 mm - 1 mm 2 mm
负载电容(CL) 30 pF - 30 pF - 30 pF 30 pF
逻辑集成电路类型 MULTIPLEXER - MULTIPLEXER - MULTIPLEXER MULTIPLEXER
最大I(ol) 0.0017 A - 0.0017 A - 0.0017 A 0.0017 A
湿度敏感等级 1 - 1 - 1 1
功能数量 1 - 1 - 1 1
输入次数 2 - 2 - 2 2
输出次数 1 - 1 - 1 1
端子数量 6 - 6 - 6 6
最高工作温度 125 °C - 125 °C - 125 °C 125 °C
最低工作温度 -40 °C - -40 °C - -40 °C -40 °C
输出极性 INVERTED - INVERTED - INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSON - VSON - VSON TSSOP
封装等效代码 SOLCC6,.04,20 - SOLCC6,.04,20 - SOLCC6,.04,14 TSSOP6,.08
封装形状 RECTANGULAR - RECTANGULAR - SQUARE RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL - TAPE AND REEL - TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 - 260 - 260 260
电源 1.2/3.3 V - 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 21 ns - 21 ns - 21 ns 21 ns
传播延迟(tpd) 21 ns - 21 ns - 21 ns 21 ns
认证状态 Not Qualified - Not Qualified - Not Qualified Not Qualified
座面最大高度 0.5 mm - 0.5 mm - 0.5 mm 1.1 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V - 3.6 V 3.6 V
最小供电电压 (Vsup) 0.8 V - 0.8 V - 0.8 V 0.8 V
标称供电电压 (Vsup) 1.1 V - 1.1 V - 1.1 V 1.1 V
表面贴装 YES - YES - YES YES
技术 CMOS - CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子面层 Tin (Sn) - Tin (Sn) - Tin (Sn) Tin (Sn)
端子形式 NO LEAD - NO LEAD - NO LEAD GULL WING
端子节距 0.5 mm - 0.5 mm - 0.35 mm 0.65 mm
端子位置 DUAL - DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 30 - 30 - 30 30
宽度 1 mm - 1 mm - 1 mm 1.25 mm

 
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